JPS6376189A - Semiconductor memory circuit - Google Patents
Semiconductor memory circuitInfo
- Publication number
- JPS6376189A JPS6376189A JP61221099A JP22109986A JPS6376189A JP S6376189 A JPS6376189 A JP S6376189A JP 61221099 A JP61221099 A JP 61221099A JP 22109986 A JP22109986 A JP 22109986A JP S6376189 A JPS6376189 A JP S6376189A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- power source
- transistor
- memory cell
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 11
- 230000006870 function Effects 0.000 claims abstract description 4
- 230000003068 static effect Effects 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 abstract description 3
- 210000004027 cell Anatomy 0.000 description 24
- 238000010586 diagram Methods 0.000 description 9
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 1
- 210000000352 storage cell Anatomy 0.000 description 1
Landscapes
- Static Random-Access Memory (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
Abstract
Description
【発明の詳細な説明】
〔韮東上の利用分野〕
本発明はスタティック型半4坏記憶回路に関するもので
、k)り、計算機%制御機器等広く用いらnている。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of Niratojo] The present invention relates to a static type semi-quadratic memory circuit, which is widely used in computer control equipment and the like.
第2図はスタティック型半導体記憶回路の記憶回路の記
憶セルの従来例を示すものである0この記憶セルはトラ
ンジスタ構収の例であり、P型負荷トランジスタQ28
5 、 Q286 、 N型トランスファ、トランジス
タQ203 、 Q204 、 N型ドライバートラ
ンジスタQ201 、 Q202にエフ構収さn。FIG. 2 shows a conventional example of a memory cell in a static semiconductor memory circuit. This memory cell is an example of a transistor configuration, and includes a P-type load transistor Q28.
5, Q286, N-type transfer, transistors Q203, Q204, N-type driver transistors Q201, Q202.
負荷トランジスタの一端は一方の電源端子v202に接
続さnl ドライバートランジスタQ201 。One end of the load transistor is connected to one power supply terminal v202 nl driver transistor Q201.
Q 202のリース端子は他の電源端子V2O1に接地
さnている。まtトランスファトランジスターQ203
、 Q 204のゲート端子はワード巌W2O1に接
続さ′n1ソース端子にはデイツク)!i[D201゜
0202がそrt(jt′L接gさnている0次にこの
セルの続出し、書込み動作を第5図、第6図を用いて説
明する。The lease terminal of Q202 is grounded to the other power supply terminal V2O1. Transfer transistor Q203
, the gate terminal of Q204 is connected to the word pin W2O1, and the source terminal of Q204 is connected to the drive)! i[D201.degree.
読み出し動作は#g5図のタイミング図に示す工うに、
ワード!W2O1k高レベルにし、ディジット線DIO
I 、 0102の信号レベル差を検出する事によV実
行さnる。すなわち第5図中に破線あるいは実線で示さ
nるディジット線D201 、 D 202の信号レベ
ル状態に++Cシ′0′あるいはゝ1′状態状態比検出
。The read operation is as shown in the timing diagram in figure #g5.
word! Set W2O1k high level and digit line DIO
V is executed by detecting the signal level difference between I and 0102. That is, the signal level state of the digit lines D201 and D202 indicated by the broken line or solid line in FIG.
書込み動作は第6図に示すタイミング図の如く実行され
る。すなわちワード線W2O1に高レベルにしディジッ
ト線D201 、0202の一方を高レベルにし、また
他方を低レベルにする事にエフ実行さnる。同図には各
ディジット# D 201 、 D202の信号レベル
状態全実線と破線で示す。第4図は第2図の記憶セルを
用い次従来の冗長行tもっスタティック型半導体記憶回
路例でおり、4ワード×4ビツト構成を実現する几め、
1ワード×4ビツトの冗長行’!−1114え九回路青
成を示すものである。The write operation is performed as shown in the timing diagram shown in FIG. That is, the word line W2O1 is set to a high level, one of the digit lines D201 and 0202 is set to a high level, and the other is set to a low level. In the figure, the signal level states of each digit #D201 and D202 are shown by solid lines and broken lines. FIG. 4 shows an example of a conventional static type semiconductor memory circuit with redundant rows using the memory cells shown in FIG.
1 word x 4 bit redundant line'! -1114E indicates the completion of nine circuits.
記憶セルMij(i=1〜5.j=1〜4)は第2図破
線部Mk示し、ワード#W2O1nW401(1=1〜
5)、 D201 uD4i1 (i=1〜4)。Memory cells Mij (i=1 to 5.j=1 to 4) are shown in the broken line area Mk in FIG.
5), D201 uD4i1 (i=1-4).
D202iD4i2 (i=1〜4 )Kそnぞn対し
ている。D202iD4i2 (i=1 to 4)
第4図において記憶セルM22に不具合がるる場合には
、ワード線W402 k非選択とし、その時に冗長ワー
ドW405i選択する事により、正常な4ワ一ド×4ビ
ツト記憶回路動作が可能となる。In FIG. 4, if there is a problem in the memory cell M22, by deselecting the word line W402k and selecting the redundant word W405i at that time, normal 4-word x 4-bit memory circuit operation is possible.
かかるワードの置き換えt実施した場合、第2図に示す
記憶セルの接点N201.W2O2等にリーク経路があ
る場合、回路的動作は町の場合もめるが動作電流又に
磯釣の1流消費が太きいという欠点がある。When such word replacement is performed, the memory cell contacts N201 . If there is a leak path in W2O2, etc., the circuit operation can be determined in the case of a town, but the operating current or
The disadvantage is that first class fishing from the shore is expensive.
本発明にかかる従来冗長セル#を備え几記憶回路の欠点
を除去するtめに提案さnるものであり、不具合記憶セ
ルに=9消費電流が大になる事で防止し、かつ信頼性の
高いスタティック型半導体記憶回路を提供する事を目的
とする〇
〔問題点上解決する九めの手段〕
本発明は記憶セルが複数の行と複数の列のマトリックス
に配さn九複数の記1.はセルと1つ以上の行又は列の
冗長セル群を具備するスタティック型半導体記憶回路に
おいて谷々の行文に列単位に独立に電源端子への電力供
給を定常的に導通、非導通に制御する機能七有する手段
?備えた挙上特徴とする冗長行又は冗長列セル群全具備
するスタティック型半導体装置回路。This invention is proposed to eliminate the drawbacks of conventional memory circuits equipped with redundant cells. Object of the present invention is to provide a static type semiconductor memory circuit with high performance. [Ninth means for solving the problem] The present invention is characterized in that memory cells are arranged in a matrix of a plurality of rows and a plurality of columns. .. In a static semiconductor memory circuit comprising a cell and a group of redundant cells in one or more rows or columns, the power supply to the power supply terminal is constantly controlled to be conductive or non-conductive independently for each row and column. A means to have seven functions? A static semiconductor device circuit having all redundant row or redundant column cell groups.
以下本発明上図面にもとづいて説明する。 The present invention will be explained below based on the drawings.
第1図は本発明の一実施例である記憶セル及び電源供給
制御回路例を示す。従来例第2図と異なる点は電源端子
V102が破MPに示さnる電源供給制御回路に接続さ
nている事である。FIG. 1 shows an example of a memory cell and a power supply control circuit according to an embodiment of the present invention. The difference from the conventional example in FIG. 2 is that the power supply terminal V102 is connected to the power supply control circuit shown in broken MP.
回路動作列は従来例第2図と同様であり、第2図におけ
るD2XX 、 Q2XX、 V2XXは第1図におい
てそnぞADIXX 、 QIXX 、 VIXX、
に対応し、第2図破線部Mが第1図破線部Cに対応して
いる。次に第1図において電源供給制御回路Pの説明を
行なう。電源供給制御回路PにP型トランジスタQll
l 、 N型トランジスタQ112エク構収さn、トラ
ンジスタQ111のリース端子は一方の電源端子V11
2にドレイン端子はトランジスタQ112のドレイン端
子及び記憶セルtTM端子V102に、トランジスタQ
112のリースに他の電源端子v111にQlll 、
Q112 ノゲート端子if端子C111に接続さn
る0正常動作可能な記憶セルに2いては端子C1ユ1は
低レベルにあり、トランジスタQ111?!−導通状態
として記憶セルCKU電源が供給さnる〇
正常動作不可能な記憶セルにおいては端子C111は高
レベルにあり、トランジスタQlll−非4通状態とし
て記憶セルCの電源端子V102への電源供給を遮断状
態とする。The circuit operation sequence is the same as the conventional example in Fig. 2, and D2XX, Q2XX, and V2XX in Fig. 2 are equivalent to ADIXX, QIXX, VIXX, and V2XX in Fig. 1 respectively.
Correspondingly, the broken line section M in FIG. 2 corresponds to the broken line section C in FIG. Next, the power supply control circuit P will be explained with reference to FIG. P-type transistor Qll in power supply control circuit P
l, N-type transistor Q112 is connected to n, the lease terminal of transistor Q111 is connected to one power supply terminal V11
2, the drain terminal is connected to the drain terminal of the transistor Q112 and the memory cell tTM terminal V102, and the drain terminal of the transistor Q112 is connected to the memory cell tTM terminal V102.
Qllll to the other power terminal v111 to the lease of 112,
Q112 Connected to gate terminal if terminal C111 n
0 If the memory cell is in normal operation, the terminal C1 is at a low level, and the transistor Q111? ! - Power is supplied to the memory cell CKU in a conductive state. In a memory cell that cannot operate normally, the terminal C111 is at a high level, and the transistor Qllll - Power is supplied to the power supply terminal V102 of the memory cell C in a non-conducting state. is cut off.
次に第3図に4ワード×4ビツト構成の記憶回路であり
、1ワード×4ビツトの冗長セル群七備え九本発明の一
実施例を説明する。Next, an embodiment of the present invention will be described with reference to FIG. 3, which is a memory circuit having a 4 word x 4 bit configuration, and includes seven redundant cell groups of 1 word x 4 bits.
基本動作は第4図の従来例と同様であジ、第4図中W
4XX 、 D4XX 、 MXXは第3図中W3XX
。The basic operation is the same as the conventional example shown in Fig. 4.
4XX, D4XX, MXX are W3XX in Figure 3
.
CXXにそ扛ぞn対応する。第3丙中Pi(0=1〜5
)は第1図中の破線部Pk示す。Compatible with CXX. 3rd Heichu Pi (0=1~5
) indicates the broken line portion Pk in FIG.
第3図においてC22が正常動作不可能な記憶セルとす
る時、デコード機能にLりW3O2指示の時、冗長ワー
ドW305 ’に実際に選択する事にエフ行の交換は実
施さnる0記憶セルC22の異常電流で遮断するために
電源供給制御回路P2に非導通状態にする事にエフ異常
電流の導通を禁止する事ができる。In FIG. 3, when C22 is a memory cell that cannot operate normally, when the decoding function goes low and W3O2 is instructed, the exchange of the F row is carried out to actually select the redundant word W305'. In order to cut off the abnormal current of C22, conduction of the abnormal current can be prohibited by setting the power supply control circuit P2 to a non-conducting state.
以上冗長行の場合の説qh行っ之が冗長列の場合も同様
にできる事は明白である。It is clear that the above explanation for the case of redundant rows can be similarly applied to the case of redundant columns.
第1図中制御端子C111の制御回路例を第7図に示す
。第7図において端子711が第11/C11lに接続
さnる。N型トランジスタ0701 、 G702゜P
型トランジスタG 703及び7エーズエク構匠さnる
実施例であフ、7ユーズ及びトランジスタG703のリ
ース端子は一方の電源端子v702に接続さlrL、ト
ランジスタG 701 、 G702のソース端子は他
の電源端子v701に接地さnl トランジスタG 7
01のゲート端子及びG 702 、 G703のドレ
イン端子は共通に接続さnている。通常状態框フェーズ
Fは導通状態であり、不具合記憶セルヶ処理する場合、
7ユーズFは非導通状態にさnる。An example of a control circuit for the control terminal C111 in FIG. 1 is shown in FIG. In FIG. 7, a terminal 711 is connected to the 11th/C11l. N-type transistor 0701, G702゜P
In this embodiment, the lease terminal of transistor G703 and transistor G703 is connected to one power supply terminal V702, and the source terminals of transistors G701 and G702 are connected to the other power supply terminal. Grounded to v701 nl transistor G7
The gate terminal of G 01 and the drain terminals of G 702 and G 703 are commonly connected. Normal state frame phase F is in a conductive state, and when processing a defective memory cell,
7 use F is placed in a non-conductive state.
以上説明し7tように本発明は、不具合記憶セルによる
消費電流の増大會おさえる効果があるばかりでなく、不
具合記憶セルの異常発熱tも防止し、信頼性の高い半導
体記憶回路t えるものである。As explained above, the present invention not only has the effect of suppressing the increase in current consumption due to defective memory cells, but also prevents abnormal heat generation of defective memory cells, thereby providing a highly reliable semiconductor memory circuit. .
第1図は本発明の記憶セル及び電源供給制御回路の一実
施例を示す図、第2図は従来記憶セル例図、第3図は本
発明の4ワード×4ビツト構成の半導体記憶回路の一実
施例?示す図、第4図は47−ド×4ビツト構成の半導
体記憶回路の従来例を示す図、第5図、第6図は読出し
動作タイミング図及び曹込み動作タイミング因、第7図
は電源供給制御回路の制御端子制御回路例?示す図であ
る0
C1l ”’ Cl14 °°゛00m記憶セルO代
理人 弁理士 内 原 晋(°′(“、−
第1図
20f
、、/
第2図
D2θ/ u−+++
+−−−D2Of し −−−一−−−
−メ乙図
V7θlFIG. 1 is a diagram showing an embodiment of the memory cell and power supply control circuit of the present invention, FIG. 2 is a diagram of an example of a conventional memory cell, and FIG. 3 is a diagram of a semiconductor memory circuit of the present invention having a 4 word x 4 bit configuration. An example? FIG. 4 is a diagram showing a conventional example of a semiconductor memory circuit with a 47-word x 4-bit configuration, FIGS. 5 and 6 are a read operation timing diagram and shaving operation timing factors, and FIG. 7 is a power supply diagram. Control terminal control circuit example of control circuit? 0 C1l ”' Cl14 °°゛00m Storage cell
+----D2Of し ---1---
-Me Otsu diagram V7θl
Claims (1)
た複数の記憶セルと1つ以上の行又は列の冗長セル群を
具備するスタティック型半導体記憶回路において各々の
行又は列単位に独立に電源端子への電力供給を定常的に
導通、非導通に制御する機能を有する手段を備えた事を
特徴とする冗長行又は冗長列セル群を具備するスタティ
ック型半導体記憶回路。In a static semiconductor memory circuit comprising a plurality of memory cells arranged in a matrix of a plurality of rows and a plurality of columns and a group of redundant cells in one or more rows or columns, each row or column is independently 1. A static semiconductor memory circuit comprising a group of redundant row or column cells, characterized by comprising means having a function of controlling power supply to a power supply terminal to be constantly conductive or non-conductive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61221099A JPS6376189A (en) | 1986-09-19 | 1986-09-19 | Semiconductor memory circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61221099A JPS6376189A (en) | 1986-09-19 | 1986-09-19 | Semiconductor memory circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6376189A true JPS6376189A (en) | 1988-04-06 |
Family
ID=16761474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61221099A Pending JPS6376189A (en) | 1986-09-19 | 1986-09-19 | Semiconductor memory circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6376189A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0917194A (en) * | 1995-06-28 | 1997-01-17 | Samsung Electron Co Ltd | Defect relief circuit of semiconductor memory |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58208998A (en) * | 1982-05-28 | 1983-12-05 | Toshiba Corp | Semiconductor memory device |
-
1986
- 1986-09-19 JP JP61221099A patent/JPS6376189A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58208998A (en) * | 1982-05-28 | 1983-12-05 | Toshiba Corp | Semiconductor memory device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0917194A (en) * | 1995-06-28 | 1997-01-17 | Samsung Electron Co Ltd | Defect relief circuit of semiconductor memory |
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