JPS6375050U - - Google Patents
Info
- Publication number
- JPS6375050U JPS6375050U JP17036286U JP17036286U JPS6375050U JP S6375050 U JPS6375050 U JP S6375050U JP 17036286 U JP17036286 U JP 17036286U JP 17036286 U JP17036286 U JP 17036286U JP S6375050 U JPS6375050 U JP S6375050U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- diode
- chip
- main body
- semicircular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Description
第１図Ａ，Ｂは本考案の一実施例を示すそれぞ
れ立断面図、側断面図、第２図Ａ〜Ｅは従来のダ
イオードの外観図である。
１Ａ：ダイオード本体、２Ａ：リード線、２Ａ
′：リード線のＳｉチツプ固定部分、３：Ｓｉチ
ツプ、５：モールド樹脂。
FIGS. 1A and 1B are an elevational sectional view and a side sectional view showing an embodiment of the present invention, respectively, and FIGS. 2A to 2E are external views of a conventional diode. 1A: Diode body, 2A: Lead wire, 2A
': Si chip fixed part of lead wire, 3: Si chip, 5: mold resin.
Claims (1)
記Ｓｉチツプに接着固定された部分が平形状をし
ておりかつ前記ダイオード本体の下方に直線状に
引出されたリード線とを備えたことを特徴とする
高密度挿入型ダイオード。 (2) ダイオード本体が半円形柱状、半円形状、
円柱縦形状または球形状をしており、リード線が
円形状または角形状の断面を有し、前記リード線
のＳｉチツプ固定部分が前記リード線の長手方向
と直角にプレス加工されていることを特徴とする
実用新案登録請求の範囲第１項記載の高密度挿入
型ダイオード。[Claims for Utility Model Registration] (1) A diode main body having a Si chip, a portion adhesively fixed to the Si chip having a flat shape, and a lead wire drawn out in a straight line below the diode main body. A high-density insertion diode characterized by comprising: (2) The diode body is semicircular columnar, semicircular,
The lead wire has a cylindrical vertical shape or a spherical shape, the lead wire has a circular or square cross section, and the Si chip fixing portion of the lead wire is pressed perpendicular to the longitudinal direction of the lead wire. A high-density insertion type diode according to claim 1 of the patented utility model.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17036286U JPS6375050U (en) | 1986-11-06 | 1986-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17036286U JPS6375050U (en) | 1986-11-06 | 1986-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6375050U true JPS6375050U (en) | 1988-05-19 |
Family
ID=31105022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17036286U Pending JPS6375050U (en) | 1986-11-06 | 1986-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6375050U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9388293B2 (en) | 2005-08-12 | 2016-07-12 | Eastman Chemical Company | Polyvinyl chloride compositions |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533058A (en) * | 1978-08-28 | 1980-03-08 | Nec Home Electronics Ltd | Method of manufacturing diode |
-
1986
- 1986-11-06 JP JP17036286U patent/JPS6375050U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533058A (en) * | 1978-08-28 | 1980-03-08 | Nec Home Electronics Ltd | Method of manufacturing diode |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9388293B2 (en) | 2005-08-12 | 2016-07-12 | Eastman Chemical Company | Polyvinyl chloride compositions |
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