JPS6371578U - - Google Patents

Info

Publication number

JPS6371578U

JPS6371578U JP16703686U JP16703686U JPS6371578U JP S6371578 U JPS6371578 U JP S6371578U JP 16703686 U JP16703686 U JP 16703686U JP 16703686 U JP16703686 U JP 16703686U JP S6371578 U JPS6371578 U JP S6371578U

Authority

JP

Japan

Prior art keywords

copper foil

resist layer

solder resist

foil land

hole

Prior art date

1986-10-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 7
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
• 239000011889 copper foil Substances 0.000 claims description 4
• 230000002093 peripheral effect Effects 0.000 claims 1

Cited By (1)