JPS6371566U - - Google Patents

Info

Publication number
JPS6371566U
JPS6371566U JP16730286U JP16730286U JPS6371566U JP S6371566 U JPS6371566 U JP S6371566U JP 16730286 U JP16730286 U JP 16730286U JP 16730286 U JP16730286 U JP 16730286U JP S6371566 U JPS6371566 U JP S6371566U
Authority
JP
Japan
Prior art keywords
lead wires
cut
wiring board
printed wiring
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16730286U
Other languages
English (en)
Japanese (ja)
Other versions
JPH087649Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986167302U priority Critical patent/JPH087649Y2/ja
Publication of JPS6371566U publication Critical patent/JPS6371566U/ja
Application granted granted Critical
Publication of JPH087649Y2 publication Critical patent/JPH087649Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
JP1986167302U 1986-10-30 1986-10-30 プリント配線板 Expired - Lifetime JPH087649Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986167302U JPH087649Y2 (ja) 1986-10-30 1986-10-30 プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986167302U JPH087649Y2 (ja) 1986-10-30 1986-10-30 プリント配線板

Publications (2)

Publication Number Publication Date
JPS6371566U true JPS6371566U (US07655688-20100202-C00010.png) 1988-05-13
JPH087649Y2 JPH087649Y2 (ja) 1996-03-04

Family

ID=31099107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986167302U Expired - Lifetime JPH087649Y2 (ja) 1986-10-30 1986-10-30 プリント配線板

Country Status (1)

Country Link
JP (1) JPH087649Y2 (US07655688-20100202-C00010.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4746423B2 (ja) * 2005-12-22 2011-08-10 日本特殊陶業株式会社 配線基板内蔵用コンデンサの製造方法及び配線基板内蔵用コンデンサ
US8304321B2 (en) 2005-12-22 2012-11-06 Ngk Spark Plug Co., Ltd. Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138290A (en) * 1979-04-11 1980-10-28 Ricoh Kk Printed board
JPS5729180U (US07655688-20100202-C00010.png) * 1980-07-28 1982-02-16
JPS6071161U (ja) * 1983-10-24 1985-05-20 株式会社田村電機製作所 プリント配線基板
JPS6183071U (US07655688-20100202-C00010.png) * 1984-11-06 1986-06-02
JPS61153365U (US07655688-20100202-C00010.png) * 1985-03-15 1986-09-22

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138290A (en) * 1979-04-11 1980-10-28 Ricoh Kk Printed board
JPS5729180U (US07655688-20100202-C00010.png) * 1980-07-28 1982-02-16
JPS6071161U (ja) * 1983-10-24 1985-05-20 株式会社田村電機製作所 プリント配線基板
JPS6183071U (US07655688-20100202-C00010.png) * 1984-11-06 1986-06-02
JPS61153365U (US07655688-20100202-C00010.png) * 1985-03-15 1986-09-22

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4746423B2 (ja) * 2005-12-22 2011-08-10 日本特殊陶業株式会社 配線基板内蔵用コンデンサの製造方法及び配線基板内蔵用コンデンサ
US8304321B2 (en) 2005-12-22 2012-11-06 Ngk Spark Plug Co., Ltd. Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
US8350306B2 (en) 2005-12-22 2013-01-08 Ngk Spark Plug Co., Ltd. Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
US8697534B2 (en) 2005-12-22 2014-04-15 Ngk Spark Plug Co., Ltd. Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate

Also Published As

Publication number Publication date
JPH087649Y2 (ja) 1996-03-04

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