JPS6370980U - - Google Patents
Info
- Publication number
- JPS6370980U JPS6370980U JP16595286U JP16595286U JPS6370980U JP S6370980 U JPS6370980 U JP S6370980U JP 16595286 U JP16595286 U JP 16595286U JP 16595286 U JP16595286 U JP 16595286U JP S6370980 U JPS6370980 U JP S6370980U
- Authority
- JP
- Japan
- Prior art keywords
- vinylidene chloride
- semiconductor substrate
- copolymer
- packaging
- chloride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 1
- -1 Polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000012856 packing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Description
第1図は本考案の半導体基板梱包袋の一実施例
の断面図、第2図は従来例の説明図である。
1:ポリエチレン袋、2:半導体基板、3:密
封部、4:塩化ビニルと塩化ビニリデンの共重合
体、5:ポリエチレン、6:梱包袋。
FIG. 1 is a sectional view of an embodiment of the semiconductor substrate packaging bag of the present invention, and FIG. 2 is an explanatory view of a conventional example. 1: Polyethylene bag, 2: Semiconductor substrate, 3: Sealing part, 4: Copolymer of vinyl chloride and vinylidene chloride, 5: Polyethylene, 6: Packing bag.
Claims (1)
袋において、該梱包袋を構成する材料が、塩化ビ
ニリデン、塩化ビニリデンと塩化ビニルとの共重
合物、および塩化ビニリデン、塩化ビニリデンと
塩化ビニルとの共重合物と他の材料との複合体の
いづれかを用いるものであることを特徴とする半
導体基板梱包袋。 In semiconductor substrate packaging bags for storing and packaging semiconductor substrates, the materials constituting the packaging bags include vinylidene chloride, a copolymer of vinylidene chloride and vinyl chloride, and vinylidene chloride, a copolymer of vinylidene chloride and vinyl chloride. A semiconductor substrate packaging bag characterized in that it is made of a composite of a semiconductor substrate and other materials.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16595286U JPS6370980U (en) | 1986-10-29 | 1986-10-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16595286U JPS6370980U (en) | 1986-10-29 | 1986-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6370980U true JPS6370980U (en) | 1988-05-12 |
Family
ID=31096468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16595286U Pending JPS6370980U (en) | 1986-10-29 | 1986-10-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6370980U (en) |
-
1986
- 1986-10-29 JP JP16595286U patent/JPS6370980U/ja active Pending