JPS6370154U - - Google Patents

Info

Publication number
JPS6370154U
JPS6370154U JP16544286U JP16544286U JPS6370154U JP S6370154 U JPS6370154 U JP S6370154U JP 16544286 U JP16544286 U JP 16544286U JP 16544286 U JP16544286 U JP 16544286U JP S6370154 U JPS6370154 U JP S6370154U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
sealed
lead tip
element mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16544286U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16544286U priority Critical patent/JPS6370154U/ja
Publication of JPS6370154U publication Critical patent/JPS6370154U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP16544286U 1986-10-27 1986-10-27 Pending JPS6370154U (US20070244113A1-20071018-C00169.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16544286U JPS6370154U (US20070244113A1-20071018-C00169.png) 1986-10-27 1986-10-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16544286U JPS6370154U (US20070244113A1-20071018-C00169.png) 1986-10-27 1986-10-27

Publications (1)

Publication Number Publication Date
JPS6370154U true JPS6370154U (US20070244113A1-20071018-C00169.png) 1988-05-11

Family

ID=31095486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16544286U Pending JPS6370154U (US20070244113A1-20071018-C00169.png) 1986-10-27 1986-10-27

Country Status (1)

Country Link
JP (1) JPS6370154U (US20070244113A1-20071018-C00169.png)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516446A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Resin mold type semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516446A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Resin mold type semiconductor device

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