JPS636737U - - Google Patents
Info
- Publication number
- JPS636737U JPS636737U JP1986101095U JP10109586U JPS636737U JP S636737 U JPS636737 U JP S636737U JP 1986101095 U JP1986101095 U JP 1986101095U JP 10109586 U JP10109586 U JP 10109586U JP S636737 U JPS636737 U JP S636737U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- package
- semiconductor chip
- bonded
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0711—
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- H10W70/682—
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- H10W72/07141—
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- H10W72/075—
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- H10W72/07521—
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- H10W72/5363—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986101095U JPS636737U (index.php) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986101095U JPS636737U (index.php) | 1986-06-30 | 1986-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS636737U true JPS636737U (index.php) | 1988-01-18 |
Family
ID=30971526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986101095U Pending JPS636737U (index.php) | 1986-06-30 | 1986-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636737U (index.php) |
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1986
- 1986-06-30 JP JP1986101095U patent/JPS636737U/ja active Pending