JPS6365244U - - Google Patents
Info
- Publication number
- JPS6365244U JPS6365244U JP16051386U JP16051386U JPS6365244U JP S6365244 U JPS6365244 U JP S6365244U JP 16051386 U JP16051386 U JP 16051386U JP 16051386 U JP16051386 U JP 16051386U JP S6365244 U JPS6365244 U JP S6365244U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipating
- dissipating material
- circuit board
- printed circuit
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16051386U JPS6365244U (no) | 1986-10-20 | 1986-10-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16051386U JPS6365244U (no) | 1986-10-20 | 1986-10-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6365244U true JPS6365244U (no) | 1988-04-30 |
Family
ID=31085966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16051386U Pending JPS6365244U (no) | 1986-10-20 | 1986-10-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6365244U (no) |
-
1986
- 1986-10-20 JP JP16051386U patent/JPS6365244U/ja active Pending