JPS6365001B2 - - Google Patents

Info

Publication number
JPS6365001B2
JPS6365001B2 JP9962582A JP9962582A JPS6365001B2 JP S6365001 B2 JPS6365001 B2 JP S6365001B2 JP 9962582 A JP9962582 A JP 9962582A JP 9962582 A JP9962582 A JP 9962582A JP S6365001 B2 JPS6365001 B2 JP S6365001B2
Authority
JP
Japan
Prior art keywords
temperature
medium
low
tank
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9962582A
Other languages
Japanese (ja)
Other versions
JPS58215309A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9962582A priority Critical patent/JPS58215309A/en
Publication of JPS58215309A publication Critical patent/JPS58215309A/en
Publication of JPS6365001B2 publication Critical patent/JPS6365001B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/007Tempering units for temperature control of moulds or cores, e.g. comprising heat exchangers, controlled valves, temperature-controlled circuits for fluids

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Control Of Temperature (AREA)

Description

【発明の詳細な説明】 この発明は金型に熱媒体を供給し、もつてプラ
スチツク成形時における金型温度をコントロール
するプラスチツク成形用金型温度調節装置に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plastic mold temperature regulating device for supplying a heat medium to a mold and thereby controlling the mold temperature during plastic molding.

従来からもすでに、使用される樹脂材料や製品
形状等に応じて、金型温度を最適状態にコントロ
ールする必要性は認識されており、幾種かの温度
調節装置が提供されている。
It has been recognized that it is necessary to optimally control mold temperature depending on the resin material used, product shape, etc., and several types of temperature control devices have been provided.

第1図は、高温維持型(60〜120℃)と称され
るもので、熱媒体としては、水、油、有機媒体等
がその使用温度に応じて選択使用されている。こ
のタイプは、タンク1内に熱媒体が溜られており
このタンク1内部に設けた温度センサー2で測温
して温度設定機3に信号を送り、設定温度以下の
ときは、タンク1内部の電気ヒータ4に通電・加
熱して所定温度まで昇温する。この昇温された媒
体は、ポンプ5で金型Aに送られて金型Aを加熱
し、金型温度が適温になれば成形が始る。樹脂の
温度を媒体が持ち帰り設定値以上に温度が上れ
ば、電磁弁6に通電の指令が出され、タンク1内
部に設けられた冷却コイル7に通水され、媒体温
度を所望値まで冷却するようになつている。しか
しながら、設定機3の温度レンジが小さいため、
加熱・冷却工程を不必要に繰り返す欠点があつ
た。すなわち、ほとんどの機種は、電気ヒータ
OFFと同時にヒータの予熱によつて昇温を続け、
設定値以上となり易く、これを検知した温度セン
サーの指令によつてすぐさま電磁弁を開き冷却コ
イルに通水して、冷却を開始する。しかるに冷却
が始ると今度は設定値以下まで冷却され易く、結
局、加熱・冷却工程を不必要に繰り返していたの
であり、所望とする温度が得がたいのは無論、無
駄なコストアツプを招聘していたのである。
The one shown in FIG. 1 is called a high temperature maintenance type (60 to 120°C), and water, oil, organic media, etc. are selected as the heat medium depending on the operating temperature. In this type, a heat medium is stored in a tank 1, and a temperature sensor 2 installed inside the tank 1 measures the temperature and sends a signal to a temperature setting device 3. When the temperature is below the set temperature, the temperature inside the tank 1 is The electric heater 4 is energized and heated to raise the temperature to a predetermined temperature. This heated medium is sent to the mold A by the pump 5 and heats the mold A, and when the mold temperature reaches an appropriate temperature, molding begins. When the temperature of the resin is returned to the medium and the temperature rises above the set value, a command is issued to energize the solenoid valve 6, water is passed through the cooling coil 7 provided inside the tank 1, and the medium temperature is cooled down to the desired value. I'm starting to do that. However, since the temperature range of setting device 3 is small,
The drawback was that the heating and cooling processes were repeated unnecessarily. In other words, most models use electric heaters.
At the same time as turning off, the temperature continues to rise by preheating the heater.
The temperature is likely to exceed the set value, and in response to a command from the temperature sensor that detects this, the solenoid valve is immediately opened to allow water to flow through the cooling coil and begin cooling. However, once cooling begins, it tends to cool down to below the set value, and in the end, the heating and cooling steps are repeated unnecessarily, which not only makes it difficult to obtain the desired temperature, but also leads to unnecessary cost increases. It is.

さらにまた、冷却コイルには冷却塔水、工業用
水、水道水が使用されていたのであるが、冷却水
の水温変化が大きく、冷却速度が自然に左右され
易く、ひいては熱媒体供給温度の大きなバラツキ
となつて現れていたのである。
Furthermore, cooling tower water, industrial water, and tap water have been used in cooling coils, but the temperature of the cooling water varies widely, and the cooling rate is easily influenced by nature, which leads to large variations in the heat medium supply temperature. It was appearing as a result.

第2図は、低温維持型(40〜60℃)と称される
ので、熱媒体としては、水または有機媒体がその
使用温度に応じて選択使用されている。このタイ
プは、冷凍機8の冷却コイル9がタンク10内に
設置されており、金型Aへ射出される樹脂の熱が
水または媒体を通してタンク10内に持ち込まれ
たとき、タンク10内の温度が上昇すると、温度
センサー11でこれを感知し、温度設定機12の
設定温度以上であれば、冷凍機8を始動させ設定
温度以下になるまで冷却するようになつている。
冷却コイル9内の冷媒熱量は少ないため、この機
種においては過冷却することはない。
The device shown in FIG. 2 is called a low temperature maintenance type (40 to 60° C.), so water or an organic medium is selectively used as the heat medium depending on the operating temperature. In this type, the cooling coil 9 of the refrigerator 8 is installed in the tank 10, and when the heat of the resin injected into the mold A is brought into the tank 10 through water or a medium, the temperature inside the tank 10 increases. When the temperature rises, the temperature sensor 11 senses this, and if the temperature is higher than the set temperature of the temperature setting device 12, the refrigerator 8 is started to cool down the temperature until the temperature falls below the set temperature.
Since the amount of heat of the refrigerant in the cooling coil 9 is small, supercooling does not occur in this model.

上記2機種は、高温に維持するか、低温に維持
するかのいずれかで、いずれも単用タイプであ
り、高精度の製品を成型するに当つては不満とさ
れるところである。
The above two models are either single-use types that maintain either high temperature or low temperature, which is considered unsatisfactory when it comes to molding high-precision products.

第3図は、高温・低温切替タイプで、タンク1
3内には加熱ヒータ14と冷凍機15の冷却コイ
ル16の両者が備えられている。しかしながら、
高温・低温相互間における切替は、切替前の影響
を断つため、直ちに切替ることは不可能であり、
作業上手間どるのは無論、時間的ロスも大きいも
のであつた。
Figure 3 shows tank 1 of the high temperature/low temperature switching type.
Both a heater 14 and a cooling coil 16 of a refrigerator 15 are provided inside the refrigerator 3 . however,
It is impossible to switch between high and low temperatures immediately in order to cut off the effects before switching.
Not only did it slow down the work, but it also caused a huge loss of time.

そこでこの発明の目的とするところは、高温媒
体および低温媒体の両者を、互に独立した状態で
金型に供給可能となし、所望とする金型温度を広
い温度幅において、容易に得ることができるとと
もに、樹脂熱の持ち帰りによる高温媒体の過温
時、これを外乱要素によつて左右されない冷却媒
体によつて所望温度値まで冷却するようになし、
よつて安定した温度調節効果が得られるととも
に、必要に応じて、高温媒体および低温媒体の両
者を同時に金型の所望部分に個別的に供給するこ
とも可能となし得るプラスチツク成形用金型温度
調節装置を提供しようとするところにある。
Therefore, an object of the present invention is to make it possible to supply both a high-temperature medium and a low-temperature medium to a mold independently of each other, and to easily obtain a desired mold temperature over a wide temperature range. In addition, when the high-temperature medium is overheated due to resin heat being brought back, the medium is cooled to a desired temperature value by a cooling medium that is not affected by disturbance elements.
Thus, a stable temperature control effect can be obtained, and if necessary, both a high temperature medium and a low temperature medium can be individually supplied to desired parts of the mold at the same time. We are trying to provide equipment.

その特徴とするところは、加熱ヒータを配した
高温側媒体タンクと、冷却用クーラーを配した低
温側媒体タンクとを有し、高温媒体及び低温媒体
を各々の圧送ポンプによつて開閉弁を介し共通の
供給ヘツダーに個別的に送り込み、金型を通過し
た両媒体を共通の帰還ヘツダーより開閉弁を介し
て個別的に各タンクへ帰還させる媒体循環路を設
け、高温側媒体タンクには、低温側媒体タンクの
低温媒体の一部を循環させる冷却コイルを設置
し、各タンクに設置した温度センサーを検知端と
し、冷却用クーラーによる低温媒体の冷却、加熱
ヒータによる高温媒体の加熱あるいは冷却コイル
側への低温媒体の循環を制御する媒体温度制御系
を設けたところにある。
Its feature is that it has a high-temperature side medium tank equipped with a heater and a low-temperature side medium tank equipped with a cooling cooler, and the high-temperature medium and low-temperature medium are transported by respective pressure pumps through on-off valves. A medium circulation path is provided in which both media are individually fed into a common supply header and passed through the mold, and returned to each tank individually via an on-off valve from a common return header. A cooling coil is installed to circulate a part of the low temperature medium in the side medium tank, and the temperature sensor installed in each tank is used as the detection end to cool the low temperature medium with the cooling cooler, heat the high temperature medium with the heater, or the cooling coil side. A medium temperature control system is provided to control the circulation of low-temperature medium.

以下実施の一例について具体的に説明すると、
第4図は金型Aへの配管状態を示す説明図で、1
7は加熱ヒータ18を配した高温側媒体タンクで
あり、19は冷却用クーラー20を配した低温側
媒体タンクである。21及び22は各々高温媒体
及び低温媒体を共通の供給ヘツダー23に個別的
に送り込む圧送ポンプであつて、各々高温側媒体
タンク17及び低温側媒体タンク19に連り配管
されている。24及び25は各々圧送ポンプ2
1,22によつて圧送される媒体の流れを調節す
る開閉弁であり、上記供給ヘツダー23の近傍に
設けられている。26は金型Aを通過した上記両
媒体を共通に受け入れる帰還ヘツダーであり、2
7,28は帰還ヘツダー26から個別的に高温側
媒体タンク17或いは低温側媒体タンク19に熱
媒体を帰還させるにおいて帰還ヘツダー26の近
傍に各々設けた開閉弁である。29,30は各々
金型Aと供給ヘツダー23間並びに金型Aと帰還
ヘツダー26間を連結させる連結ホースである。
従つて、高温媒体側タンク17あるいは低温側媒
体タンク19から圧送ポンプ20,21によつて
圧送された熱媒体が開閉弁24,25を介し共通
の供給ヘツダー23に送り込まれ、金型Aを通過
し、共通の帰還ヘツダー26より開閉弁27,2
8を介して個別的に各タンクへ帰還させる媒体循
環路が形成されている。
An example of implementation will be explained in detail below.
Figure 4 is an explanatory diagram showing the state of piping to mold A.
7 is a high temperature side medium tank in which a heater 18 is arranged, and 19 is a low temperature side medium tank in which a cooling cooler 20 is arranged. Reference numerals 21 and 22 are pressure pumps that individually feed the high temperature medium and the low temperature medium to the common supply header 23, and are connected to the high temperature side medium tank 17 and the low temperature side medium tank 19, respectively, with piping. 24 and 25 are pressure pumps 2, respectively.
1 and 22, and is provided near the supply header 23. 26 is a return header that commonly receives both of the media that have passed through the mold A;
Reference numerals 7 and 28 designate on-off valves provided near the return header 26 to individually return the heat medium from the return header 26 to the high temperature side medium tank 17 or the low temperature side medium tank 19. Reference numerals 29 and 30 are connection hoses that connect the mold A and the supply header 23 and the mold A and the return header 26, respectively.
Therefore, the heat medium pumped from the high temperature medium side tank 17 or the low temperature side medium tank 19 by the pressure pumps 20, 21 is sent to the common supply header 23 via the on-off valves 24, 25, and passes through the mold A. The on-off valves 27, 2 are connected to the common return header 26.
8, a medium circulation path is formed which returns to each tank individually.

なおこの実施例においては、供給ヘツダー23
及び帰還ヘツダー26はいずれも、金型Aの内部
管路に応じた4個の供給口と帰還口を有してお
り、且つ内部を高温媒体路と低温媒体路に2分可
能な開閉弁31,32を有している。
In this embodiment, the supply header 23
Both of the header 26 and the return header 26 have four supply ports and a return port corresponding to the internal pipelines of the mold A, and an on-off valve 31 that can divide the inside into a high-temperature medium path and a low-temperature medium path. , 32.

33は高温側媒体タンク17に設置された冷却
コイルであり、低温側媒体タンク19の低温媒体
の一部を循還させることによつて高温媒体の冷却
作用を行つている。例えばこの実施例では、低温
側の媒体循環路において設けられた圧送ポンプ2
2を併用している。
A cooling coil 33 is installed in the high-temperature medium tank 17, and performs a cooling effect on the high-temperature medium by circulating a portion of the low-temperature medium in the low-temperature medium tank 19. For example, in this embodiment, the pressure pump 2 provided in the medium circulation path on the low temperature side
2 are used together.

34は高温側媒体タンク17に設置された温度
センサーであり、35は低温側媒体タンク19に
設置された温度センサーである。36は低温側媒
体タンク19外部に設置された冷凍機凝縮ユニツ
トで、低温側媒体タンク19内部に配設された前
記冷却用クーラー20に連結され、冷凍サイクル
によつて冷温媒体を冷却する作用を行つている。
37,38は媒体タンク外部の制御盤Bに設置さ
れた温度設定機で、各タンクに設置した上記温度
センサー34,35を検知端とした媒体温度制御
系の要部をなし、要所に配した開閉弁及びリレー
等に指令を与え、冷却用クーラー20による低温
媒体の冷却、加熱ヒーター18による高温媒体の
加熱あるいは冷却コイル33側への低温媒体の循
環を制御するものである。
34 is a temperature sensor installed in the high temperature side medium tank 17, and 35 is a temperature sensor installed in the low temperature side medium tank 19. 36 is a refrigerator condensing unit installed outside the low-temperature side medium tank 19, which is connected to the cooling cooler 20 installed inside the low-temperature side medium tank 19, and has the function of cooling the cold and hot medium through a refrigeration cycle. I'm going.
Reference numerals 37 and 38 indicate temperature setting machines installed on the control panel B outside the medium tank, which form the main part of the medium temperature control system with the temperature sensors 34 and 35 installed in each tank as the detection ends, and are installed at key points. It gives commands to on-off valves, relays, etc., and controls the cooling of the low-temperature medium by the cooling cooler 20, the heating of the high-temperature medium by the heating heater 18, or the circulation of the low-temperature medium to the cooling coil 33 side.

39は圧送ポンプ22で加圧された低温媒体を
一部バイパスさせ、冷却用クーラー20の内部を
上方部から下方部に向つて2重管状態で挿通し、
下端部39aにおいて再び低温側媒体タンク19
に帰還させるバイパス路であつて、媒体冷却用ク
ーラー20の熱伝導率の向上を図るとともに、タ
ンク内部の熱媒体の撹拌作用を行わせている。4
0はバイパス路39の途中に設けられた定流量弁
で、低温媒体をタンク19に一定量を越えること
なく帰還させるもので、併用している圧送ポンプ
22によつて金型Aへ供給する低温媒体の圧力低
下を阻止し、因つて一定温度を保持した低温媒体
を定常状態で供給可能としたものである。すなわ
ち、バイパス路39に定流量弁40を介すること
なく単純に低温側媒体タンク19に低温媒体を帰
還すれば、このバイパス路39における流れ抵抗
が小くなるため、多量の低温媒体がタンク19に
帰還し、因つて金型に供給される低温媒体の圧力
が維持できなくなり、金型へ供給される流量が極
端に減少し、所定の冷却作用をはたさなくなるも
ので、金型温度において安定した冷却パターンを
得るために配設したものである。
39 bypasses a part of the low temperature medium pressurized by the pressure pump 22, and inserts the inside of the cooling cooler 20 from the upper part toward the lower part in a double pipe state,
The low temperature side medium tank 19 is opened again at the lower end portion 39a.
This is a bypass path for returning the heat medium to the medium cooling cooler 20, and serves to improve the thermal conductivity of the medium cooling cooler 20 and to stir the heat medium inside the tank. 4
0 is a constant flow valve provided in the middle of the bypass path 39, which returns the low temperature medium to the tank 19 without exceeding a certain amount. This prevents the pressure of the medium from decreasing, thereby making it possible to supply a low-temperature medium that maintains a constant temperature in a steady state. That is, if the low temperature medium is simply returned to the low temperature side medium tank 19 through the bypass path 39 without going through the constant flow valve 40, the flow resistance in this bypass path 39 will be reduced, so a large amount of low temperature medium will be returned to the tank 19. As a result, the pressure of the low-temperature medium that returns to the mold and is supplied to the mold cannot be maintained, and the flow rate supplied to the mold is extremely reduced, and it no longer has the desired cooling effect, so it is not stable at the mold temperature. This arrangement was made in order to obtain a cooling pattern.

41は冷却コイル33に低温媒体を送給する管
路の途中に設けられた定流量弁で、上記と同様、
この定流量弁41を設けることにより金型Aへ供
給される流体圧が一定となり、金型温度において
安定した冷却パターンが得られるものである。な
お47は低温媒体の制御開閉弁である。なお例え
ば、圧送ポンプ22をバイパス路39あるいは上
記管路における圧送に併用せず、バイパス路ある
いは上記管路については別個のポンプ等によつて
低温媒体の一部を送給しても差支えない。
41 is a constant flow valve provided in the middle of the pipe line for feeding the low-temperature medium to the cooling coil 33;
By providing this constant flow valve 41, the fluid pressure supplied to the mold A becomes constant, and a stable cooling pattern can be obtained at the mold temperature. Note that 47 is a control opening/closing valve for the low temperature medium. Note that, for example, the pressure pump 22 may not be used for pressure feeding in the bypass path 39 or the above-mentioned pipe line, and a part of the low-temperature medium may be fed to the bypass line or the above-mentioned pipe line by a separate pump or the like.

ところで前述のごとく、供給ヘツダー23及び
帰還ヘツダー26には各々4個の供給口及び帰還
口があり、連結ホース29,30によつて金型A
に連結するものであるが、その連結方法は、この
実施例では高温あるいは低温媒体路側の2個の供
給口あるいは帰還口の一方を金型の一面の内部管
路に連結し、高温媒体及び低温媒体がいずれも金
型の一面及び他面の内部管路に送給され、且つ再
び各タンクに帰還するように連結されている。従
つて、開閉弁31,32が閉状態であれば、熱媒
体の供給如何によつて金型において低温部あるい
は高温部が具現するもので、それぞれの成形条件
に応じて精度の高い熱移動パターンを得ることが
できるのである。また成形始動時等において、金
型昇温のために金型の内部管路全体に高温媒体を
流したい場合には開閉弁31,32を開状態に
し、高温媒体のみを送給するようにすれば一挙的
に昇温可能であり、逆に金型を強制的に冷却させ
る場合には低温媒体のみを送給すれば一挙的な温
度降下が達成されるものである。従つて連結ホー
スを、用い方によつてその都度低温側から高温側
へとつなぎ替える必要はなくなり、バルブ操作で
簡単且つ迅速に温度コントロールを為し得るもの
である。なおこの実施例では、各ヘツダーは4個
の送給口あるいは帰還口とを有しているが、これ
に限定されるものではなく、要するに金型の内部
管路に応じて形成すればよく、ホースの連結方法
も前述したごとき熱媒体の流れ方向が得られる連
結であれば差支えない。
By the way, as mentioned above, the supply header 23 and the return header 26 each have four supply ports and four return ports, and the mold A is connected to the mold A by the connecting hoses 29 and 30.
In this embodiment, one of the two supply ports or return ports on the high temperature or low temperature medium path side is connected to the internal pipe line on one side of the mold, and the high temperature medium and low temperature medium are connected to each other. Both media are fed into internal conduits on one side and the other side of the mold, and are connected back to each tank. Therefore, when the on-off valves 31 and 32 are in the closed state, a low temperature region or a high temperature region is realized in the mold depending on the supply of heat medium, and a highly accurate heat transfer pattern is created depending on the respective molding conditions. can be obtained. In addition, when starting molding, etc., if you want to flow a high-temperature medium through the entire internal pipe line of the mold to raise the temperature of the mold, open the on-off valves 31 and 32 to feed only the high-temperature medium. On the other hand, when the mold is forcibly cooled, the temperature can be lowered all at once by feeding only the low-temperature medium. Therefore, there is no need to reconnect the connecting hose from the low-temperature side to the high-temperature side each time depending on the usage, and the temperature can be easily and quickly controlled by operating the valve. In this embodiment, each header has four supply ports or four return ports, but the header is not limited to this, and may be formed according to the internal pipe line of the mold. There is no problem with the method of connecting the hoses as long as the direction of flow of the heat medium as described above can be obtained.

42は高温側媒体タンク17と低温側媒体タン
ク19の下部間を連結して設けられた均液面管で
あり、その途中に熱媒体の移動あるいは熱の移動
を最小限度に調整可能な媒体移行量調整弁43が
設けられている。
Reference numeral 42 denotes a liquid level pipe connected between the lower portions of the high-temperature side medium tank 17 and the low-temperature side medium tank 19, and there is a medium transfer pipe in the middle of which can adjust the movement of the heat medium or the movement of heat to a minimum. A quantity regulating valve 43 is provided.

実施例の装置によれば、低温及び高温媒体を双
方同時にあるいは単独に金型へ供給することが可
能であるため、低温あるいは高温媒体の送給切替
時において低温媒体が高温側媒体タンク17へあ
るいは高温媒体が低温側媒体タンク19へ移行す
る可能性があり、また開閉弁24,25,27,
28,31,32の故障又は操作ミスによつて熱
媒体が別種媒体タンクに移行するおそれがある
が、上述の様に均液面管42によつて両タンクを
連通しておけば、一槽が空に、また他槽が溢れ水
装置外部へと流出するような事故を防止し得るも
のである。従つて媒体の損失を防止し得るだけで
なく、エネルギー損失が激減するものである。4
4は均液面管42の低温側媒体タンク19寄りに
おいて分枝連結された液面制御電極取付管44
で、低温側媒体タンク19の深さ方向に並設され
ている。これにより水等の電導糸の熱媒体を使用
すれば液面制御を容易に行ない得るものである。
また非電導系の熱媒体を使用する場合には電極取
付管44の取付位置に液面が直視可能な補助タン
クを代用してもよい。なおタンク内への媒体供給
方法としては、媒体が水であれば、給水口45か
ら給水開閉弁46を介し、給水路47を利用して
供給すれば良く、他方非電導系の熱媒体であれ
ば、前記補給タンクを給水部とすれば高温側媒体
タンク17及び低温側媒体タンク19の双方に媒
体を供給することができる。
According to the device of the embodiment, it is possible to supply both the low-temperature and high-temperature media to the mold simultaneously or individually, so that when switching the supply of low-temperature or high-temperature media, the low-temperature medium is transferred to the high-temperature side medium tank 17 or There is a possibility that the high temperature medium will move to the low temperature side medium tank 19, and the on-off valves 24, 25, 27,
28, 31, 32 or an operational error may cause the heat medium to transfer to a different type of medium tank. However, if both tanks are connected through the liquid level pipe 42 as described above, one tank can be transferred. This prevents accidents such as the tank becoming empty or other tanks overflowing and water flowing out of the device. Therefore, not only can loss of the medium be prevented, but also energy loss can be drastically reduced. 4
Reference numeral 4 denotes a liquid level control electrode mounting pipe 44 which is branched and connected near the low temperature side medium tank 19 of the liquid level pipe 42.
and are arranged in parallel in the depth direction of the low temperature side medium tank 19. This makes it possible to easily control the liquid level by using a conductive thread heat medium such as water.
Further, when a non-conductive heat medium is used, an auxiliary tank whose liquid level can be seen directly may be substituted at the mounting position of the electrode mounting pipe 44. Regarding the method of supplying the medium into the tank, if the medium is water, it can be supplied from the water supply port 45 via the water supply on/off valve 46 and by using the water supply channel 47; For example, if the replenishment tank is used as a water supply section, the medium can be supplied to both the high temperature side medium tank 17 and the low temperature side medium tank 19.

48は冷凍機凝縮ユニツト36が故障時の応急
回路で、一端部は開閉弁49を介して給水口45
に連結され、他端部は冷却コイル33に連結され
ている。すなわち、ユニツト36が故障した場
合、ユニツト36修理完了までの間温度精度は落
ちるが、水を使用する場合に限り運転可能とした
もので、高温側媒体タンク17の温度が上昇した
場合、上記開閉弁49を開き、補給水を冷水に変
えて冷却コイル33に強制通水するもので、これ
によつてある程度の温度調整が可能になる。低温
側媒体タンク19の水温が補給冷水の温度より高
い設定温度であれば、前述の開閉弁46を開き低
温側媒体タンク19に強制供給すれば同様に温度
調整可能である。
48 is an emergency circuit when the refrigerator condensing unit 36 breaks down, and one end is connected to the water supply port 45 via the on-off valve 49.
The other end is connected to the cooling coil 33. In other words, if the unit 36 breaks down, the temperature accuracy will drop until the unit 36 is repaired, but operation is possible only when water is used, and if the temperature of the high-temperature side medium tank 17 rises, the above-mentioned opening/closing By opening the valve 49, the make-up water is changed to cold water, and the water is forced to flow through the cooling coil 33, thereby making it possible to adjust the temperature to a certain extent. If the water temperature in the low-temperature side medium tank 19 is a set temperature higher than the temperature of the supplementary cold water, the temperature can be similarly adjusted by opening the above-mentioned on-off valve 46 and forcibly supplying the water to the low-temperature side medium tank 19.

次にこの種の装置を用いた温度コントロールの
一方法等につき順次説明する。なお熱媒体は水と
する。
Next, one method of temperature control using this type of device will be sequentially explained. Note that the heat medium is water.

まず熱媒体が、液面制御電極管44に取り付け
られた電極棒よりの信号にて制御盤Bに設けられ
た液面制御リレーの指示により給水用開閉弁46
が開かれ低温側媒体タンク19に給水される。こ
の時均液面管42を通じ高温側媒体タンク17に
も同時に供給される。それぞれのタンク17,1
9が所定の貯水レベルまで達すれば電極管がその
位置を検知し、液面制御リレーへ信号を送る。こ
れにより給水開閉弁46は閉じ、媒体の補給は完
了する。
First, the heat medium is activated by the water supply on-off valve 46 in response to a signal from the electrode rod attached to the liquid level control electrode tube 44 and an instruction from the liquid level control relay provided in the control panel B.
is opened and water is supplied to the medium tank 19 on the low temperature side. The liquid is simultaneously supplied to the high temperature side medium tank 17 through the time equalizing liquid level pipe 42. Each tank 17,1
When 9 reaches a predetermined water storage level, the electrode tube detects its position and sends a signal to the liquid level control relay. As a result, the water supply on/off valve 46 is closed, and the medium replenishment is completed.

ここで低温側媒体タンク19に設置された温度
センサー35が補給された熱媒体の温度を検知
し、信号を媒体温度制御系の要部をなす温度設定
機38に送り、設定値より高い場合はリレーを通
じ冷凍機凝縮ユニツト36を起動させ、冷却用ク
ーラー20にユニツト36より冷媒を送給し、熱
媒体の温度を低下させ所望の低温媒体となす。所
定温度に低温媒体が至達すれば、温度センサー2
0よりの信号が温度設定機及びリレーに指示し、
上記冷凍機凝縮ユニツト36が作動を停止し、低
温媒体は所定の設定温度に維持される。
Here, a temperature sensor 35 installed in the low-temperature side medium tank 19 detects the temperature of the supplied heat medium, and sends a signal to the temperature setting machine 38, which is a main part of the medium temperature control system. The refrigerator condensing unit 36 is activated through the relay, and the refrigerant is supplied from the unit 36 to the cooling cooler 20 to lower the temperature of the heat medium and make it a desired low-temperature medium. When the low temperature medium reaches a predetermined temperature, the temperature sensor 2
The signal from 0 instructs the temperature setting machine and relay,
The refrigerator condensing unit 36 stops operating and the cryogenic medium is maintained at a predetermined set temperature.

一方高温側媒体タンク17内に補給された熱媒
体は、温度センサー34によつて温度が検知さ
れ、その信号を媒体温度制御系の要部をなす温度
設定機37に送り、設定値より低温の場合はリレ
ーを通じ加熱ヒータ18に通電される。熱媒体の
温度が上昇し設定温度に達すれば温度センサー3
4の信号により温度設定機及びリレーに指示さ
れ、加熱ヒータの通電が止り高温媒体は所定の設
定温度に維持される。
On the other hand, the temperature of the heat medium replenished in the high temperature side medium tank 17 is detected by the temperature sensor 34, and the signal is sent to the temperature setting machine 37 which forms the main part of the medium temperature control system. In this case, the heater 18 is energized through the relay. When the temperature of the heat medium rises and reaches the set temperature, temperature sensor 3
The signal No. 4 instructs the temperature setting machine and relay, the heater is de-energized, and the high-temperature medium is maintained at a predetermined set temperature.

これら2種類の温度の媒体は、以上の操作によ
つてそれぞれの温度に保たれるもので、次に各々
の圧送ポンプ21,22を駆動すれば、それぞれ
の回路へ供給される。
The media at these two types of temperatures are maintained at their respective temperatures through the above-described operations, and when the pressure pumps 21 and 22 are then driven, they are supplied to the respective circuits.

まず低温媒体を供給する場合について述べる。 First, the case of supplying a low-temperature medium will be described.

操作盤Bに設けられた低温媒体の圧送ポンプ2
2のスイツチをONにすれば、電磁接触器に通電
され、圧送ポンプ32が起動し、低温媒体は金型
Aに圧送される。また一部はバイパス路39なら
びに冷却コイル33の管路に圧送される。バイパ
ス路では、まず定流量弁40を経由し、低温媒体
用の冷却クーラー20の内部を通つて低温側媒体
タンク19内に帰還し、タンク内の低温媒体を撹
拌する。なおこの際前述したごとく、バイパス路
において定流量弁40が設けられているため、上
記他の回路に対する圧力降下は大きくないもので
ある。
Low-temperature medium pressure pump 2 installed on operation panel B
When switch 2 is turned on, the electromagnetic contactor is energized, the pressure pump 32 is activated, and the low temperature medium is pumped into the mold A. In addition, a portion is sent under pressure to the bypass path 39 and the conduit of the cooling coil 33. In the bypass path, first, the flow passes through the constant flow valve 40, passes through the inside of the cooling cooler 20 for low temperature medium, returns to the low temperature side medium tank 19, and stirs the low temperature medium in the tank. In this case, as described above, since the constant flow valve 40 is provided in the bypass path, the pressure drop with respect to the other circuits is not large.

次に操作盤内の低温媒体バルブスイツチをON
にすれば、開閉弁25,28が各々開き、供給ヘ
ツダー23中央の開閉弁31が閉の時は金型Aと
のホース連絡により低温媒体が所定路を通じ帰還
ヘツダー32から低温側媒体タンク19に帰る。
この際、金型Aにおいて製品樹脂からの廃熱を奪
い、因つて媒体は先程の供給媒体温度より高くな
り、タンク19に帰還することになる。従つてタ
ンク19内の媒体温度が上昇し、温度センサー3
5が検知して、その信号が温度設定機38に送ら
れ、設定温度より高くなればリレーが動作し、冷
凍機凝縮ユニツト36が作動し媒体温度を下げ
る。その後設定温度に到達すれば冷凍機凝縮ユニ
ツト36は作動を停止し、所定の温度を持続する
ものである。この時金型Aから受けた廃熱は媒体
から冷凍機凝縮ユニツト36より機外へと排出さ
れる。
Next, turn on the low temperature medium valve switch in the operation panel.
, the on-off valves 25 and 28 are each opened, and when the on-off valve 31 in the center of the supply header 23 is closed, the low-temperature medium is passed through a predetermined path from the return header 32 to the low-temperature side medium tank 19 by the hose connection with the mold A. I'm going home.
At this time, waste heat is removed from the product resin in the mold A, and the medium becomes higher in temperature than the previously supplied medium, and returns to the tank 19. Therefore, the temperature of the medium in the tank 19 increases, and the temperature sensor 3
5 is detected and the signal is sent to the temperature setting machine 38. If the temperature becomes higher than the set temperature, the relay is activated and the refrigerator condensing unit 36 is activated to lower the medium temperature. Thereafter, when the set temperature is reached, the refrigerator condensing unit 36 stops operating and maintains the predetermined temperature. At this time, the waste heat received from the mold A is discharged from the medium through the refrigerator condensing unit 36 to the outside of the machine.

次に操作盤内の高温媒体ポンプスイツチをON
にすれば開閉弁24,27が開き、ヘツダー中央
の開閉弁31,32が閉の時は、ヘツダーと金型
Aのホース連絡により高温媒体は所定路に圧送さ
れ、帰還ヘツダー26から高温側媒体タンク17
に帰還する。この際金型Aより廃熱が有る場合は
供給媒体温度よりも高くなつて高温側媒体タンク
17に帰還する。従つてタンク内の媒体温度が上
昇し、検知した温度センサー34より温度設定機
に対し信号が送られる。なお、この高温媒体制御
用温度設定機37にはON・OFF二段階制御が出
来る制御機構が設けられており、低位置側で加熱
ヒータ18を制御し、高位置側で高温側媒体タン
ク17内の冷却コイル33へ低温媒体の供給を制
御するようになつている。従つて媒体温度が上昇
した場合、温度センサー34よりの信号で、高温
側設定温度以上になれば温度設定機の指示により
低温媒体制御開閉弁47が開き、高温媒体は冷却
され、設定温度まで下がれば開閉弁47が閉じ、
低温媒体の冷却コイル33側への供給は停止し温
度は下がらなくなる。
Next, turn on the high temperature medium pump switch in the operation panel.
When the on-off valves 24 and 27 are open, and the on-off valves 31 and 32 in the center of the header are closed, the high-temperature medium is forced into a predetermined path by the hose connection between the header and mold A, and the high-temperature medium is sent from the return header 26. tank 17
to return to. At this time, if there is waste heat from the mold A, the temperature becomes higher than the supply medium temperature and returns to the high temperature side medium tank 17. Therefore, the temperature of the medium in the tank increases, and the detected temperature sensor 34 sends a signal to the temperature setting machine. The temperature setting device 37 for high-temperature medium control is equipped with a control mechanism capable of two-step ON/OFF control; the lower position side controls the heater 18, and the higher position side controls the temperature inside the high-temperature side medium tank 17. The supply of low temperature medium to the cooling coil 33 is controlled. Therefore, when the medium temperature rises, if the signal from the temperature sensor 34 exceeds the set temperature on the high temperature side, the low temperature medium control opening/closing valve 47 opens according to the instruction from the temperature setting machine, and the high temperature medium is cooled down to the set temperature. If the on-off valve 47 is closed,
The supply of the low temperature medium to the cooling coil 33 side is stopped and the temperature no longer decreases.

なおこの際、前述のごとく開閉弁47と冷却コ
イル33との配管途中には定流量弁40を設けて
いるため、金型Aへの低温媒体の圧力低下は防止
するものである。
At this time, as mentioned above, since the constant flow valve 40 is provided in the middle of the piping between the on-off valve 47 and the cooling coil 33, a drop in the pressure of the low-temperature medium to the mold A is prevented.

また始動時、金型温度の昇温の必要上金型全体
に高温体を供給する必要があるが、この場合はま
ず開閉弁31,32を開き、操作盤の低温バルブ
操作スイツチを切り、高温バルブ操作スイツチを
ONの位置にすれば、低温媒体路から高温媒体路
へのホースのつなぎ替えの必要はなく、金型全体
の管路へ高温媒体を供給することができるもので
ある。
Also, at startup, it is necessary to supply a high temperature body to the entire mold in order to raise the mold temperature, but in this case, first open the on-off valves 31 and 32, turn off the low temperature valve operation switch on the operation panel, and then valve operation switch
When set to the ON position, there is no need to reconnect the hose from the low-temperature medium path to the high-temperature medium path, and high-temperature medium can be supplied to the pipes throughout the mold.

以上のごとくこの発明は、加熱ヒータを配した
高温側媒体タンクと、冷却用クーラーを配した低
温側媒体タンクとを有し、高温媒体及び低温媒体
を各々の圧送ポンプによつて開閉弁を介し共通の
供給ヘツダーに個別的に送り込み、金型を通過し
た両媒体を共通の帰還ヘツダーより開閉弁を介し
て個別的に各タンクへ帰還させる媒体循環路を設
け、高温媒体タンクには、低温媒体タンクの低温
媒体の一部を循還させる冷却コイルを設置し、各
タンクに設置した温度センサーを検知端とし、冷
却用クーラーによる低温媒体の加熱あるいは冷却
コイル側への低温媒体の循還を制御する媒体温度
制御系を設けたことにより、高温媒体および低温
媒体の両者を、互いに独立した状態で金型に供給
可能となし、所望とする金型温度を広い温度幅に
おいて容易に得ることができたものである。すな
わち高温に維持するか、低温に維持するしかでき
ない極めて温度レンジが小さい従来の単用タイプ
に比し、優れて汎用性が増大したものである。ま
た高温・低温相互間における切替作業において非
常に手間どり、時間的ロスも大きい従来の高温・
低温切替タイプに比して容易に且つ迅速に熱媒体
を切替供給することができるものである。さらに
また樹脂熱の持ち帰りによる高温媒体の過温時、
これを外乱要素によつて左右されない冷却媒体、
すなわち一定温度を維持した低温媒体によつて所
定温度値まで冷却するようになしたもので極めて
安定した温度調節効果が得られたものである。
As described above, the present invention has a high-temperature side medium tank equipped with a heater and a low-temperature side medium tank equipped with a cooling cooler, and the high-temperature medium and the low-temperature medium are transported by respective pressure pumps through on-off valves. A medium circulation path is provided in which both media are individually fed into a common supply header and passed through the mold, and returned to each tank individually via an on-off valve from a common return header. A cooling coil is installed to circulate part of the low-temperature medium in the tank, and the temperature sensor installed in each tank is used as the detection end to control the heating of the low-temperature medium by the cooling cooler or the circulation of the low-temperature medium to the cooling coil side. By providing a medium temperature control system, it is possible to supply both the high-temperature medium and the low-temperature medium to the mold independently of each other, and the desired mold temperature can be easily obtained over a wide temperature range. It is something that In other words, it has superior versatility compared to the conventional single-use type, which has an extremely narrow temperature range that can only be maintained at high temperatures or low temperatures. In addition, switching between high and low temperatures is very time-consuming and requires a lot of time.
The heat medium can be switched and supplied more easily and quickly than the low temperature switching type. Furthermore, when the high temperature medium is overheated due to the resin heat being brought back,
This is called a cooling medium that is not influenced by disturbance elements.
That is, it is designed to cool to a predetermined temperature value using a low-temperature medium that maintains a constant temperature, and an extremely stable temperature control effect can be obtained.

なおまた従来、金型の温度は常に一定の温度に
することが最適の方法であると考え、金型に一個
又は複数個の温度センサーを取付け、温度設定機
により所望温度に設定し、その温度に金型がなる
ように温媒体又は冷媒体の流量調節するコントロ
ールユニツトや、温媒体や冷媒体を必要に応じて
設定値より高い時は冷媒体を、低い時は温媒体を
自動的に切替供給し、金型温度を一定温度にコン
トロールするユニツトも市販され使用されてきた
が、このような温調装置では、最近の傾向として
要求される高精度の製品をハイサイクルで製造す
ることが困難であつた。すなわち、このような要
求を満足するには、熱の移動及び流量又は熱媒体
の温度を変えるにも時間が必要であることに着眼
しなければならない。上述のごとく金型温度を温
度センサーで計り、媒体の量や温度を変える方法
では温度制御の時間と成型サイクルとのバランス
が取れなくなり、到底高精度製品をハイサイクル
で製造することは不可能である。しかるにこの発
明に係る温度調節装置では、実施例の説明から明
らかな通り、供給ヘツダー及び帰還ヘツダーに内
部を2分可能な開閉弁を具備させれば、必要に応
じて高温媒体及び低温媒体の両者を同時に金型の
所望部分に個別的に供給することも可能となし得
たのである。すなわち金型温度を一定にするとい
う発想を改め、金型の温度は一定の温度にするの
ではなく、金型の各部の温度は種々の温度で、低
温部あるいは高温部等が存在し、決して一定では
なく、常に種々の各部温度が常時一定のパターン
で波動コントロールすることを可能となし得るも
ので、最近の要望にも十分答え得る高性能温度装
置となし得るものである。
Furthermore, in the past, it was thought that the best method was to always keep the temperature of the mold constant, so one or more temperature sensors were attached to the mold, the desired temperature was set with a temperature setting device, and the temperature was adjusted. A control unit that adjusts the flow rate of the hot or cold medium so that the mold reaches the desired temperature, or automatically switches the hot or cold medium as needed when the temperature is higher than the set value, and the hot medium when it is lower than the set value. Units that control mold temperature at a constant temperature have also been commercially available, but with such temperature control devices, it is difficult to manufacture high-precision products in high cycles, which is required as a recent trend. It was hot. That is, in order to satisfy such requirements, attention must be paid to the fact that time is required to change the movement and flow rate of heat or the temperature of the heat medium. As mentioned above, with the method of measuring the mold temperature with a temperature sensor and changing the amount and temperature of the medium, there is no balance between the temperature control time and the molding cycle, and it is impossible to manufacture high-precision products in a high cycle. be. However, in the temperature control device according to the present invention, as is clear from the description of the embodiments, if the supply header and the return header are equipped with on-off valves that can divide the inside into two parts, both the high-temperature medium and the low-temperature medium can be supplied as needed. At the same time, it was also possible to individually supply the desired portions of the mold. In other words, we changed the idea of keeping the mold temperature constant, and instead of keeping the mold temperature at a constant temperature, the temperature of each part of the mold is at various temperatures, and there are low temperature parts and high temperature parts. It is possible to perform wave control of the temperature of various parts in a constant pattern at all times, rather than being constant, and it can be made into a high-performance temperature device that can fully meet recent demands.

さらにまたその場合、従来のごとき取付けが困
難な金型用温度センサーも必要がなく、しかも高
価なコントロールユニツトを使用せずに済むもの
で、画期的な金型温度調節装置を提供し得たもの
である。
Furthermore, in that case, there is no need for a temperature sensor for the mold, which is difficult to install as in the past, and there is no need to use an expensive control unit, making it possible to provide an innovative mold temperature control device. It is something.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はいわゆる高温維持型と称される従来の
金型温度調節装置の配管状態を示す説明図、第2
図はいわゆる低温維持型と称される従来の金型温
度調節装置の配管状態を示す説明図、第3図はい
わゆる高温・低温切替タイプの従来の金型温度調
節装置の配管状態を示す説明図、第4図はこの発
明に係る金型温度調節装置の一実施例で、配管状
態を示す説明図である。 A…金型、17…高温側媒体タンク、18…加
熱ヒータ、19…低温側媒体タンク、20…冷却
用クーラー、21,22…圧送ポンプ、23…供
給ヘツダー、24,25…開閉弁、26…帰還ヘ
ツダー、27,28…開閉弁、31,32…開閉
弁、33…冷却コイル、34,35…温度センサ
ー、40,41…定流量弁。
Figure 1 is an explanatory diagram showing the piping state of a conventional mold temperature control device called a high temperature maintenance type;
The figure is an explanatory diagram showing the piping state of a conventional mold temperature control device called a so-called low-temperature maintenance type, and FIG. 3 is an explanatory diagram showing the piping state of a conventional mold temperature control device of the so-called high-temperature/low-temperature switching type. , FIG. 4 is an explanatory diagram showing the state of piping in an embodiment of the mold temperature control device according to the present invention. A... Mold, 17... High temperature side medium tank, 18... Heater, 19... Low temperature side medium tank, 20... Cooling cooler, 21, 22... Pressure pump, 23... Supply header, 24, 25... Open/close valve, 26 ...Feedback header, 27, 28... Opening/closing valve, 31, 32... Opening/closing valve, 33... Cooling coil, 34, 35... Temperature sensor, 40, 41... Constant flow valve.

Claims (1)

【特許請求の範囲】 1 加熱ヒータを配した高温側媒体タンクと、冷
却用クーラーを配した低温側媒体タンクとを有
し、高温媒体及び低温媒体を各々の圧送ポンプに
よつて開閉弁を介し共通の供給ヘツダーに個別的
に送り込み、金型を通過した両媒体を共通の帰還
ヘツダーより開閉弁を介し個別的に各タンクへ帰
還させる媒体循環路を設け、高温側媒体タンクに
は、低温側媒体タンクの低温媒体の一部を循環さ
せる冷却コイルを設置し、各タンクに設置した温
度センサーを検知端とし、冷却用クーラーによる
低温媒体の冷却、加熱ヒータによる高温媒体の加
熱あるいは冷却コイル側への低温媒体の循環を制
御する媒体温度制御系を設けてなるプラスチツク
成形用金型温度調節装置。 2 供給ヘツダー及び帰還ヘツダーが、内部を高
温媒体路と低温媒体路に2分可能な開閉弁を有す
る特許請求の範囲第1項記載のプラスチツク成形
用金型温度調節装置。 3 圧送ポンプによつて圧送される低温媒体の一
部を定流量弁を介して低温側媒体タンクに帰還さ
せてなる特許請求の範囲第1項記載のプラスチツ
ク成形用金型温度調節装置。 4 圧送ポンプによつて圧送される低温媒体の一
部を定流量弁を介して高温側媒体タンクに設置し
た冷却コイルに送給し、低温側媒体タンクに帰還
させてなる特許請求の範囲第1項記載のプラスチ
ツク成形用金型温度調節装置。 5 高温媒体側タンクと低温媒体側タンクが底部
において均液面管にて連通されており、高温側及
び低温側とも共通媒体を使用した特許請求の範囲
第1項記載のプラスチツク成形用金型温度調節装
置。
[Scope of Claims] 1. It has a high-temperature side medium tank equipped with a heater and a low-temperature side medium tank equipped with a cooling cooler, and the high-temperature medium and low-temperature medium are transferred by respective pressure pumps through on-off valves. A medium circulation path is provided in which both media are individually fed into a common supply header and passed through the mold, and returned individually to each tank from a common return header via an on-off valve. A cooling coil is installed to circulate part of the low-temperature medium in the medium tank, and the temperature sensor installed in each tank is used as the detection end to cool the low-temperature medium with the cooling cooler, heat the high-temperature medium with the heater, or send it to the cooling coil side. A mold temperature control device for plastic molding comprising a medium temperature control system for controlling the circulation of a low-temperature medium. 2. The plastic mold temperature control device according to claim 1, wherein the supply header and the return header each have an on-off valve that can divide the interior into a high-temperature medium path and a low-temperature medium path. 3. The plastic mold temperature control device according to claim 1, wherein a part of the low-temperature medium pumped by the pressure pump is returned to the low-temperature medium tank via a constant flow valve. 4. Claim 1, in which a part of the low-temperature medium pumped by a pressure pump is supplied via a constant flow valve to a cooling coil installed in a high-temperature medium tank, and is returned to a low-temperature medium tank. A mold temperature control device for plastic molding as described in 2. 5. The temperature of the mold for plastic molding according to claim 1, in which the high temperature medium side tank and the low temperature medium side tank are connected at the bottom through a liquid level pipe, and a common medium is used on both the high temperature side and the low temperature side. Regulator.
JP9962582A 1982-06-09 1982-06-09 Temperature control equipment of mold for plastic molding Granted JPS58215309A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9962582A JPS58215309A (en) 1982-06-09 1982-06-09 Temperature control equipment of mold for plastic molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9962582A JPS58215309A (en) 1982-06-09 1982-06-09 Temperature control equipment of mold for plastic molding

Publications (2)

Publication Number Publication Date
JPS58215309A JPS58215309A (en) 1983-12-14
JPS6365001B2 true JPS6365001B2 (en) 1988-12-14

Family

ID=14252262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9962582A Granted JPS58215309A (en) 1982-06-09 1982-06-09 Temperature control equipment of mold for plastic molding

Country Status (1)

Country Link
JP (1) JPS58215309A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61118705U (en) * 1985-01-12 1986-07-26
JPH07115398B2 (en) * 1987-05-27 1995-12-13 日本電熱株式会社 Temperature control device for injection mold
JPH057417U (en) * 1991-07-11 1993-02-02 サンデン株式会社 Mold temperature controller
JPH0513710U (en) * 1991-08-02 1993-02-23 サンデン株式会社 Mold temperature controller
JPH0513711U (en) * 1991-08-02 1993-02-23 サンデン株式会社 Mold temperature controller
US5376317A (en) * 1992-12-08 1994-12-27 Galic Maus Ventures Precision surface-replicating thermoplastic injection molding method and apparatus, using a heating phase and a cooling phase in each molding cycle
JP3977565B2 (en) 1999-05-06 2007-09-19 小野産業株式会社 Mold for synthetic resin molding, mold temperature control device and mold temperature control method
JP4550762B2 (en) * 2005-09-22 2010-09-22 株式会社スター精機 Mold temperature controller
US10553463B2 (en) 2011-11-15 2020-02-04 Tokyo Electron Limited Temperature control system, semiconductor manufacturing device, and temperature control method
JP5912439B2 (en) * 2011-11-15 2016-04-27 東京エレクトロン株式会社 Temperature control system, semiconductor manufacturing apparatus, and temperature control method
SG11201402991TA (en) 2011-12-09 2014-07-30 Ritemp Pty Ltd Temperature regulation improvements
FR3060433B1 (en) * 2016-12-21 2019-12-20 A2P Industrie MOLD COOLING SYSTEM
KR102220747B1 (en) * 2019-12-30 2021-02-26 주식회사 디케이솔루션 Molding apparatus for composite material

Also Published As

Publication number Publication date
JPS58215309A (en) 1983-12-14

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