JPS6364079A - Manufacture of conducting high polymer electronic element - Google Patents

Manufacture of conducting high polymer electronic element

Info

Publication number
JPS6364079A
JPS6364079A JP20893186A JP20893186A JPS6364079A JP S6364079 A JPS6364079 A JP S6364079A JP 20893186 A JP20893186 A JP 20893186A JP 20893186 A JP20893186 A JP 20893186A JP S6364079 A JPS6364079 A JP S6364079A
Authority
JP
Japan
Prior art keywords
electrode body
conductive polymer
polymer layer
layer
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20893186A
Other languages
Japanese (ja)
Inventor
智之 小池
竹中 豊
毅 岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP20893186A priority Critical patent/JPS6364079A/en
Publication of JPS6364079A publication Critical patent/JPS6364079A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 この発明は、導電性高分子を使用した電子素子の製造方
法に関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field This invention relates to a method for manufacturing electronic devices using conductive polymers.

(ロ)従来の技術 近年、高分子化学の進歩により導電性高分子が開発され
、この導電性高分子は、TL荷Yにより導電度や吸光度
をコントロールすることができる新素材として注目され
、バッテリや表示層をはしめ、多方面への応用が期待さ
れている。
(b) Conventional technology In recent years, advances in polymer chemistry have led to the development of conductive polymers, which have attracted attention as new materials whose conductivity and absorbance can be controlled by the TL charge, Y, and which can be used for batteries. It is expected to be used in a variety of fields, including display layers.

従来の導電性高分子電子素子の製造方法としては、基板
12内面にSnO□、ITO等の金属酸化物よりなる透
明導電膜、又はpt等の金属薄膜を形成して電極体13
とし〔第4図(al参照〕、さらにこの電極体13上に
、導電性高分子層14を電解重合法等により形成するも
のが知られている〔第4図(b)参照〕。
In a conventional method for manufacturing a conductive polymer electronic device, a transparent conductive film made of a metal oxide such as SnO□ or ITO, or a metal thin film such as PT is formed on the inner surface of the substrate 12, and then the electrode body 13 is formed.
It is known that a conductive polymer layer 14 is formed on the electrode body 13 by an electrolytic polymerization method or the like [see FIG. 4(b)].

(ハ)発明が解決しようとする問題点 上記従来の導電性高分子電子素子の製造方法においては
、電極体13に厚さノ、うや、偏析等の)”I:常部1
3bが生しる。このため、導電性高分子層14の厚さに
もムラが生じたり、導電性高分子層14と電極体13と
の間の接着力が低下し、導電性高分子層14力’ 2i
L’dしてしまう不都合があった。
(c) Problems to be Solved by the Invention In the above-mentioned conventional method for manufacturing conductive polymer electronic devices, the electrode body 13 has problems such as thickness, cloudiness, segregation, etc.
3b is born. For this reason, the thickness of the conductive polymer layer 14 also becomes uneven, and the adhesive force between the conductive polymer layer 14 and the electrode body 13 decreases.
There was the inconvenience of L'd.

特に、電極体13として透明導電膜を使用し、これをス
プレー法により形成した場合に、前記不都合は顕著なも
のとなり、導電性高分子電子素子を耐久性に欠けるもの
としていた。
In particular, when a transparent conductive film is used as the electrode body 13 and is formed by a spray method, the above-mentioned disadvantages become significant, and the conductive polymer electronic device lacks durability.

この発明は、上記不都合に鑑みなされ1こもので、耐久
性に優れた導電性高分子電子素子が得られるλq導電性
高分子電子素子製造方法の提供を目的としている。
The present invention has been made in view of the above-mentioned disadvantages and aims to provide a method for manufacturing a λq conductive polymer electronic device which can yield a conductive polymer electronic device with excellent durability.

(ニ)問題点をη・7決するだめの手段上記不都合を解
決するための手段として、この発明の導電性高分子電子
素子の製造方法は、基板表面に電極体を形成し、この電
極体表面を研摩して電極体表面層を除去し、この研摩さ
れた電極体上にW導電性高分子層形成するものである。
(d) Means to resolve the problem η・7 As a means to solve the above-mentioned disadvantages, the method for manufacturing a conductive polymer electronic device of the present invention includes forming an electrode body on the surface of a substrate, and The surface layer of the electrode body is removed by polishing, and a W conductive polymer layer is formed on the polished electrode body.

(ホ)作用 この発明の導電性高分子電子素子の製造方法は、異常部
を含んだ電極体表面層を除去することにより、異常部の
ない電極体表面を得ると共に、電極体層厚を均一化する
。これにより、導電性高分子層と電極体との間の接着力
の向上及び導電性高分子層のPlさの均一化が可能とな
る。
(E) Function The method for manufacturing a conductive polymer electronic device of the present invention removes the electrode body surface layer containing abnormal parts, thereby obtaining an electrode body surface free of abnormal parts and making the electrode body layer thickness uniform. become This makes it possible to improve the adhesive force between the conductive polymer layer and the electrode body and to make the Pl of the conductive polymer layer uniform.

(へ)実施例 この発明の一実、ち面倒を、第1図(−1)、第1図i
bl、第1図te+、第2図及び第3[714こ基づい
て、以下に説明する。
(f) Example The fruits and troubles of this invention are shown in Fig. 1 (-1) and Fig. 1 i.
bl, Figure 1 te+, Figure 2 and Figure 3 [714] will be explained below.

この実施例は、本発明を表示素子lの製造に適用したも
のである。2は自ガラス、」明合成樹脂よりなる絶縁基
板である(第2図及び第3図、q Q、:j )。
In this example, the present invention is applied to the manufacture of a display element 1. 2 is an insulating substrate made of self-glass or bright synthetic resin (Figs. 2 and 3, q Q, :j).

絶8!基板2内面2aには、スプレー法によりS nO
□透明導′)R膜を形成し、電極体3、・・・、3とす
る。電極体3は、7セグメントのパターンに配置されて
いる。各電極体3より一よ、リード部3dが延設され、
側部に設けられている端子7、・・・、7に接続される
Absolutely 8! The inner surface 2a of the substrate 2 is coated with SnO by a spray method.
□Transparent conductor') R film is formed to form electrode bodies 3, . . . , 3. The electrode body 3 is arranged in a seven segment pattern. A lead portion 3d extends from each electrode body 3,
It is connected to terminals 7, . . . , 7 provided on the side.

電極体3の表面層3aには、第1図(atζこ示すよう
に起伏があり、″:rL極体3極層3が不均一なものと
なっている。また、表面層3aには、偏析等による異常
部3bが含まれている。
The surface layer 3a of the electrode body 3 has undulations as shown in FIG. It includes an abnormal part 3b due to segregation or the like.

次に、上記表面層3aをパフ研摩により除去し、新しい
表面3Cを生成すると共に、電極体3の層厚を均一化す
る〔第1図(bl参照〕。このパフ研摩における研摩材
は、粒径が0.1〜1μmのアルミナ砥粒であり、これ
を純水に懸濁したものを使用する。
Next, the surface layer 3a is removed by puff polishing to generate a new surface 3C, and the layer thickness of the electrode body 3 is made uniform [see FIG. 1 (bl)].The abrasive material used in this puff polishing is Alumina abrasive grains with a diameter of 0.1 to 1 μm are used, which are suspended in pure water.

続いて、前記新表面3c上に、電解重合によりjI導電
性高分子層を形成する〔第1図tel参照]。
Subsequently, a jI conductive polymer layer is formed on the new surface 3c by electrolytic polymerization [see tel in FIG. 1].

導電性高分子層4は、例えばポリアニリン、ポリチオフ
ェン等より構成される。この時に、電極体3の層厚が均
一なため、導電性高分子層4の層厚も均一となる。また
、電極体3の新表面3cには、起伏や異常部がないため
、導電性高分子層4と電極体3との間の接着力が強化さ
れる。
The conductive polymer layer 4 is made of polyaniline, polythiophene, etc., for example. At this time, since the layer thickness of the electrode body 3 is uniform, the layer thickness of the conductive polymer layer 4 is also uniform. Further, since the new surface 3c of the electrode body 3 has no undulations or abnormal parts, the adhesive force between the conductive polymer layer 4 and the electrode body 3 is strengthened.

?:、、極体3反体3、i電性高分子層4の形成された
絶縁基板2は、もう1つの絶縁基板5と、所定間隔をお
いて対面させられる(第3図参照)。この絶縁基板5の
内面5aには、SnO,透明導′屯膜等よりなる第2電
極体6が、予め形成されている。
? The insulating substrate 2 on which the polar body 3 and the i-conductive polymer layer 4 are formed faces another insulating substrate 5 at a predetermined distance (see FIG. 3). On the inner surface 5a of this insulating substrate 5, a second electrode body 6 made of SnO, a transparent conductive film, etc. is formed in advance.

絶縁基板2及び5の周囲は、封止材9により封止される
。絶縁基板2と5との間には電解液8が充填され、導電
性高分子層4と第2電極体6が、この電解液8に浸潤さ
れる。電解液8としては、アセトニトリルILl13F
4.アセトニトリル+171C104等が使用される。
The peripheries of the insulating substrates 2 and 5 are sealed with a sealing material 9. An electrolytic solution 8 is filled between the insulating substrates 2 and 5, and the conductive polymer layer 4 and the second electrode body 6 are soaked in this electrolytic solution 8. As the electrolyte 8, acetonitrile ILl13F
4. Acetonitrile +171C104 etc. are used.

参考までに、この完成した表示素子lの+)1作を、以
下に節単に説明する。
For reference, one of the completed display elements 1 will be briefly described below.

各端子7と第2電極体6との間に正f[の電圧を卯月1
1すると、導電性高分子層4が酸化5元反応を起ごし、
例えば緑色1.:、7色に着色ずろ。そして、各端子7
、即ち各電極体3を正又は負の電圧に変化させることに
より、各電極体3上の導電性高分子層4が緑色又は黄色
に変化し、数字表示をすることとなる。
A voltage of positive f[ is applied between each terminal 7 and the second electrode body 6 by Uzuki 1
1, the conductive polymer layer 4 undergoes a quinary oxidation reaction,
For example, green 1. :, Colored in 7 colors. And each terminal 7
That is, by changing the voltage of each electrode body 3 to a positive or negative voltage, the conductive polymer layer 4 on each electrode body 3 changes to green or yellow to display a numerical display.

なお、上記実施例においては、電極体表面の研摩には、
アルミナ砥粒の純水;Δ濁液を使用する)\フ研摩を通
用しているが、これに限定されろものではなく、適宜変
更可能である。
In addition, in the above embodiment, polishing the surface of the electrode body includes:
Pure water with alumina abrasive grains (using Δ suspension) is commonly used for polishing, but it is not limited to this and can be changed as appropriate.

また、上記実施例においては、この発明を表示素子の製
造に通用した例を示しているが、これに限定されるもの
でiまなく、バッテリ等、他の導電性高分子電子素子の
製造にも適用可11ヒである。
In addition, although the above embodiment shows an example in which the present invention is applied to the manufacture of display elements, the present invention is not limited to this, and can be applied to the manufacture of other conductive polymer electronic elements such as batteries. 11 is also applicable.

(ト)発明の効果 この発明の導電性高分子層7−素子の製造方法は、基(
反の内面に電Is体を形成し、この電(板体表面を研摩
して表面層を除去し、この研1?された電極体表面に導
電性高分子層を形成するものであるから、導電性高分子
層の膜厚が均一化され、また導電性高分子層と電極体と
の間の接着力が強化され、入7電性高分子電子素1−の
i:i4久性を優れたものとできる利点を有している。
(g) Effects of the invention The method for manufacturing a conductive polymer layer 7-element of this invention is based on (
The electrode body is formed on the inner surface of the plate, the surface layer is removed by polishing the plate surface, and a conductive polymer layer is formed on the polished surface of the electrode body. The thickness of the conductive polymer layer is made uniform, the adhesion between the conductive polymer layer and the electrode body is strengthened, and the i:i4 durability of the 7-conducting polymer electronic element 1- is improved. It has the advantage that it can be used as an alternative.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a+は、この発明の一実施例に係る表示素子の
装造工程において、j絶縁基板内面に電極体を形成した
状態を示す拡大断面図、第1図tblは、同製造工程に
おいて、電極体表面を研摩した状1点を示す拡大断面図
、第1図fclは、同製造工程において、電極体表面に
導電性高分子層を形成した状!声を示す拡大断面図、第
2図は、前記表示素子の平面図、第3図は、同表示素子
の縦断面図、第4図(a)及び第4図(blは、従来の
導電性高分子電子素子の製造方法を説明する図である。 2:絶縁基板、 3・・・3:電極体、3a:22而層
、  4・・・4:導電性高分子層。
FIG. 1 (a+ is an enlarged cross-sectional view showing the state in which an electrode body is formed on the inner surface of the j insulating substrate in the manufacturing process of a display element according to an embodiment of the present invention, and FIG. , an enlarged cross-sectional view showing one point where the surface of the electrode body has been polished, and FIG. The figure is a plan view of the display element, FIG. 3 is a vertical cross-sectional view of the display element, and FIGS. 2: Insulating substrate, 3...3: Electrode body, 3a: 22 layer, 4...4: Conductive polymer layer.

Claims (3)

【特許請求の範囲】[Claims] (1)基板内面に電極体を形成し、この電極体表面を研
摩して表面層を除去し、この研摩された電極体表面に導
電性高分子層を形成することを特徴とする導電性高分子
電子素子の製造方法。
(1) A conductive polymer characterized by forming an electrode body on the inner surface of a substrate, polishing the surface of the electrode body to remove a surface layer, and forming a conductive polymer layer on the polished surface of the electrode body. Method for manufacturing molecular electronic devices.
(2)前記電極体は、金属酸化物の透明導電膜であり、
これをスプレー法により前記基板内面に形成する特許請
求の範囲第1項記載の導電性高分子電子素子の製造方法
(2) the electrode body is a transparent conductive film of metal oxide;
2. The method of manufacturing a conductive polymer electronic device according to claim 1, wherein the coating is formed on the inner surface of the substrate by a spray method.
(3)前記研摩は、粒径0.1〜1μmの砥粒を研摩材
として使用するバフ研摩である特許請求の範囲第1項又
は第2項記載の導電性高分子電子素子の製造方法。
(3) The method for manufacturing a conductive polymer electronic device according to claim 1 or 2, wherein the polishing is buff polishing using abrasive grains having a particle size of 0.1 to 1 μm as an abrasive.
JP20893186A 1986-09-04 1986-09-04 Manufacture of conducting high polymer electronic element Pending JPS6364079A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20893186A JPS6364079A (en) 1986-09-04 1986-09-04 Manufacture of conducting high polymer electronic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20893186A JPS6364079A (en) 1986-09-04 1986-09-04 Manufacture of conducting high polymer electronic element

Publications (1)

Publication Number Publication Date
JPS6364079A true JPS6364079A (en) 1988-03-22

Family

ID=16564497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20893186A Pending JPS6364079A (en) 1986-09-04 1986-09-04 Manufacture of conducting high polymer electronic element

Country Status (1)

Country Link
JP (1) JPS6364079A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007018116A1 (en) * 2005-08-09 2007-02-15 Idemitsu Kosan Co., Ltd. Conductive laminate
WO2009060717A1 (en) * 2007-11-07 2009-05-14 Konica Minolta Holdings, Inc. Transparent electrode and method for producing transparent electrode
JP2009140790A (en) * 2007-12-07 2009-06-25 Seiko Epson Corp Conductor and method of manufacturing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007018116A1 (en) * 2005-08-09 2007-02-15 Idemitsu Kosan Co., Ltd. Conductive laminate
WO2009060717A1 (en) * 2007-11-07 2009-05-14 Konica Minolta Holdings, Inc. Transparent electrode and method for producing transparent electrode
JP5212377B2 (en) * 2007-11-07 2013-06-19 コニカミノルタホールディングス株式会社 Transparent electrode and method for producing transparent electrode
JP2009140790A (en) * 2007-12-07 2009-06-25 Seiko Epson Corp Conductor and method of manufacturing the same

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