JPS6364074U - - Google Patents

Info

Publication number

JPS6364074U

JPS6364074U JP1986157985U JP15798586U JPS6364074U JP S6364074 U JPS6364074 U JP S6364074U JP 1986157985 U JP1986157985 U JP 1986157985U JP 15798586 U JP15798586 U JP 15798586U JP S6364074 U JPS6364074 U JP S6364074U

Authority

JP

Japan

Prior art keywords

layer

copper foil

flexible board

adhesive layer

base material

Prior art date

1986-10-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000010410 layer Substances 0.000 claims description 6
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
• 239000011889 copper foil Substances 0.000 claims description 5
• 239000012790 adhesive layer Substances 0.000 claims description 4
• 239000011347 resin Substances 0.000 claims description 2
• 229920005989 resin Polymers 0.000 claims description 2
• 239000004020 conductor Substances 0.000 claims 2
• 239000000463 material Substances 0.000 claims 2
• 239000011241 protective layer Substances 0.000 claims 2
• 239000000758 substrate Substances 0.000 description 4
• 239000010408 film Substances 0.000 description 2
• 239000004973 liquid crystal related substance Substances 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 2
• 239000013039 cover film Substances 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1