JPS6362708A - Breaking device for semiconductor wafer - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a device for breaking a semiconductor wafer in the manufacturing process of semiconductor chips, and more specifically, a device for breaking a scribed semiconductor wafer in the manufacturing process of semiconductor elements. This invention relates to an improvement of a blurring device for

[Conventional technology]

An example of a conventional semiconductor wafer breaking device of this type is shown in FIG.

In other words, in the conventional configuration shown in FIG. 3, reference numeral 1 is an air cylinder for brake operation, and 2 is a phosphorus cylinder held at the tip of the operating piston of this air cylinder 1 in a tensioned state via tension springs 3, 3. There is a break plate ma for the break operation using a plate spring such as a bronze plate. Further, reference numeral 4 denotes a break stand capable of receiving a scribed conductive wafer 5 on a semicircular arc-shaped receiving surface 4a.

Therefore, in the case of this conventional apparatus, the scribed semiconductor wafer 5 received on the semicircular arc-shaped receiving surface 4a of the break table 4 is moved by the break plate 3 as the air-operated cylinder 1 operates. The break plate 3 is pressed and divided along the scribe line, and at this time, the break plate 3 is always maintained so as not to be deformed or deflected by the tensile force of the tension spring 3.3.

[Problem that the invention seeks to solve]

However, when using the conventional semiconductor wafer breaking device operated in this manner, the surface of the semiconductor wafer is touched by the hard break plate 3 during the breaking operation.
Therefore, if foreign matter 9, such as silicon chips, is attached to the surface of the sea urchin I\ that the break plate 3 contacts, the active area of the surface may be damaged. There was a problem in that the device was made into a defective product.

This invention was made to solve these conventional problems, and its purpose is to prevent damage to the surface of a semiconductor wafer even when foreign matter is present on the surface of the semiconductor wafer. The wafer can now be broken. It is an object of the present invention to provide this type of semiconductor wafer breaking device.

[Means for Solving the Problems] In order to achieve the above object, the semiconductor wafer breaking device according to the present invention includes a relatively flexible elastic break held by a predetermined fluid pressure as a configuration for breaking operation. A pressure table having a membrane and a receiver 11-. having an arcuate surface. Using a combination of an actuating member and an actuating cylinder that pressurizes at least one of these, the semiconductor wafer is broken in a desired manner by an arcuate surface while the surface of the semiconductor wafer is in contact with one elastic break membrane. It was designed to be obtained.

[For production]

That is, in this invention, the break member in contact with the surface of the scribed semiconductor wafer is a relatively flexible elastic break membrane held by pressurizable fluid pressure, so during the breaking operation, the break member in contact with the surface of the semiconductor wafer is The entire surface can be pressurized as evenly as possible, and even if there is a foreign object on the same surface, the pressure applied to the foreign object itself can be reduced,
Damage to the surface caused by the presence of foreign matter can be effectively prevented.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a semiconductor wafer breaking device according to the present invention will be described in detail with reference to FIGS. 1 and 2.

FIG. 1 is a cross-sectional configuration diagram schematically showing the main points of a device according to a first embodiment of the present invention.

That is, in the first embodiment device shown in FIG.
Reference numeral 11 is an air cylinder for brake operation, and 12
is a pressure plate provided at the tip of the operating piston of the air operating cylinder 11. Reference numeral 13 denotes a pressurizing table which has an elastic break membrane 14 made of a relatively flexible material such as silicone rubber on its break surface, and has a pressurized fluid 15 sealed therein, and has the pressurizing plate on its negative side. 12 and to keep the pressure of the pressurized fluid 15 constant in the non-operated state, a 2ml pressure valve! 6 and pressure gauge 1
7. Furthermore, 18 is a semicircular arc shaped receiving surface 18.
This is a break stand which is arranged to face the elastic break Wi14 and is capable of receiving the semiconductor wafer 13 scribed on the semicircular arc-shaped receiving surface 18a, as in the conventional example.

Therefore, in the case of the configuration of this first embodiment, the brake stand! 8'1' - The scribed semiconductor wafer 19 received on the two surfaces 18a of the arcuate receiver 11 is placed in the air-operated cylinder 1.
1, the pressurizing table 13 itself is moved,
The elastic break film 14 is brought into contact with the surface of the semiconductor wafer 19, and then the pressure plate 12 is applied to the pressure table 13.
Pressure is applied.

Pressure is applied to this pressure table 13 via an elastic break membrane via pressurized fluid 15. 4, the elastic break 11914 applies pressure evenly over the entire surface of the semiconductor wafer 19, thereby effectively and effectively pressing the semiconductor wafer 19 along the scribe line. At this time, the break pressure applied to the semiconductor wafer 1B is equal to the pressure fluid 15.
By adjusting the pressure regulating valve 18, the pressure is maintained within a pressure range that does not damage the wafer surface.

Next, in the second embodiment shown in FIG. 2, a rotatable disc-shaped break member 20 is provided at the tip of the actuating piston of the air actuating cylinder 11 in place of the break stand 18, and the pressure stand The front side of the scribed semiconductor wafer 19 is received on the elastic break film 14 of No. 13, and the break member 2 is placed on the back side of the semiconductor wafer 18.
By pressing and rolling the circumferential break portion 20a of 0, the semiconductor wafer 18 can be divided along the scribe line, and this operation is similar to that of the first embodiment.

It can be effective.

〔Effect of the invention〕

As detailed above, according to the present invention, at least one of the pressurizing table having a relatively flexible elastic break membrane held by a predetermined fluid pressure, the receiver 2 actuating member having an arcuate surface, and This is because the semiconductor wafer can be broken as desired by pressing the arcuate surface with the surface of the semiconductor wafer in contact with the elastic break membrane. During the break operation, the entire surface of the semiconductor wafer can be pressurized as uniformly as possible, and even if there is a foreign object on the same surface, the pressure applied to the foreign object itself can be suppressed to a small level. It has excellent features such as being able to effectively prevent damage to the wafer surface due to interference, and being relatively simple in structure and easy to implement.

[Brief explanation of drawings]

FIGS. 1 and 2 are cross-sectional configuration diagrams schematically showing first and second embodiments of a semiconductor wafer breaking device according to the present invention, respectively. Further, FIG. 3 is a cross-sectional configuration diagram schematically showing the outline of the breaking device according to the conventional example. Et...Air actuated cylinder, 12...Pressure plate, 1
3... Pressure table, 14... Elastic break membrane, 15
... Pressurized fluid, 16 ... Pressure regulating pulp, 18.
...Break stand (receiving member), 18a...Receiver I
F-plane (arc-shaped surface), 18... semiconductor wafer, 20...
...Break member (operating member), 20a...Circle I
SI break surface (arc shaped surface). Agent Masuo Oiwa Figure 1 11: Airi Fudekai Kashiri 〉da. 12: 3 mouths, 1 stroke, 16: So-called IL bar 1 and 7゛. 19+Cow's body Urchinha Fig. 2 Genus 3 Fig.

Claims (1)

[Claims] (1) A relatively flexible elastic break membrane is disposed on the break surface, and a pressurizing table containing a pressurized fluid at a predetermined pressure is provided inside, and a receiving and actuating member having an arcuate surface are provided;
At least one of the pressurizing table, the receiver, and the actuating member can be pressurized by an actuating cylinder, and an elastic break membrane of the pressurizing table, an arcuate surface of the receiver, and the actuating member, 1. A semiconductor wafer breaking device characterized in that a semiconductor wafer received on one side of the semiconductor wafer is broken by applying pressure to the other side.