JPS6361128U - - Google Patents
Info
- Publication number
- JPS6361128U JPS6361128U JP15452786U JP15452786U JPS6361128U JP S6361128 U JPS6361128 U JP S6361128U JP 15452786 U JP15452786 U JP 15452786U JP 15452786 U JP15452786 U JP 15452786U JP S6361128 U JPS6361128 U JP S6361128U
- Authority
- JP
- Japan
- Prior art keywords
- mold part
- resin
- fixed
- pressurizing
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986154527U JPH0719147Y2 (ja) | 1986-10-08 | 1986-10-08 | 半導体素子の樹脂封止装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986154527U JPH0719147Y2 (ja) | 1986-10-08 | 1986-10-08 | 半導体素子の樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6361128U true JPS6361128U (US06826419-20041130-M00005.png) | 1988-04-22 |
| JPH0719147Y2 JPH0719147Y2 (ja) | 1995-05-01 |
Family
ID=31074397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986154527U Expired - Lifetime JPH0719147Y2 (ja) | 1986-10-08 | 1986-10-08 | 半導体素子の樹脂封止装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719147Y2 (US06826419-20041130-M00005.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6233317U (US06826419-20041130-M00005.png) * | 1985-08-17 | 1987-02-27 | ||
| JPH0376782A (ja) * | 1989-07-31 | 1991-04-02 | Rodel Inc | 金属表面を研磨する方法およびそのための組成物 |
-
1986
- 1986-10-08 JP JP1986154527U patent/JPH0719147Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6233317U (US06826419-20041130-M00005.png) * | 1985-08-17 | 1987-02-27 | ||
| JPH0376782A (ja) * | 1989-07-31 | 1991-04-02 | Rodel Inc | 金属表面を研磨する方法およびそのための組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719147Y2 (ja) | 1995-05-01 |
