JPS6359206A - Electronic component - Google Patents
Electronic componentInfo
- Publication number
- JPS6359206A JPS6359206A JP20397586A JP20397586A JPS6359206A JP S6359206 A JPS6359206 A JP S6359206A JP 20397586 A JP20397586 A JP 20397586A JP 20397586 A JP20397586 A JP 20397586A JP S6359206 A JPS6359206 A JP S6359206A
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- lead
- lead terminals
- element body
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 abstract description 15
- 238000007747 plating Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 description 3
- 241001385733 Aesculus indica Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は電子部品に関し、特に、その両主面から少な
くとも３つのリード端子が延びて形成される電子部品に
関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an electronic component, and particularly to an electronic component formed with at least three lead terminals extending from both main surfaces thereof.
（従来技術）
この発明の背景となる電子部品が、特開昭５６−１５８
５１７号公報に開示されている。この電子部品１のリー
ド端子のうち、１つのリード端子２は、第４図に示すよ
うに、素子本体３を他２本のリード端子４および５ （
リード端子５は図示せず）とともに挟めるように、その
先端部を直角に曲げられて折曲部２ａが形成されている
。(Prior art) The electronic component that forms the background of this invention is
It is disclosed in Japanese Patent No. 517. Among the lead terminals of this electronic component 1, one lead terminal 2 connects the element body 3 to the other two lead terminals 4 and 5 (as shown in FIG. 4).
The tip of the lead terminal 5 (not shown) is bent at a right angle to form a bent portion 2a so as to be sandwiched therebetween.
（発明が解決しようとする問題点）
しかしながら、そのような電子部品１では、リード端子
２の先端部が直角に折り曲げられているので、リード端
子２の表面にはんだめっきを行う際に、第５図に示すよ
うに、表面張力によってその折曲部２ａに不要なはんだ
５が残り、素子本体３をリード端子２とリード端子４お
よび５の間に挿入させて挟むことが困難になるので、こ
の不要なはんだ５を取り除かなければならないという問
題点を有していた。(Problems to be Solved by the Invention) However, in such an electronic component 1, the tip of the lead terminal 2 is bent at a right angle, so when solder plating is performed on the surface of the lead terminal 2, the fifth As shown in the figure, unnecessary solder 5 remains on the bent portion 2a due to surface tension, making it difficult to insert and sandwich the element body 3 between the lead terminal 2 and the lead terminals 4 and 5. There was a problem in that unnecessary solder 5 had to be removed.
それゆえに、この発明の主たる目的は、リード端子には
んだめっきを行った際に、リード端子に不要なはんだが
残らない電子部品を提供することである。Therefore, the main object of the present invention is to provide an electronic component in which no unnecessary solder remains on the lead terminals when solder plating is performed on the lead terminals.
（問題点を解決するための手段）
この発明は、素子本体および素子本体の両主面からほぼ
平行に延びて形成される少なくとも３つのリード端子を
含み、リード端子の少な（とも１つは、他のリード端子
とともに素子本体を挟めるように、その先端部に素子本
体の厚みとほぼ同じ高さの段差を設けるため鈍角に折り
曲げられた折曲部を有する電子部品であって、リード端
子は少なくとも３本を１単位としてリード端子保持部材
にほぼ平行に並列して配置され、素子本体にそれぞれが
固定された後、リード端子保持部材に近い所定部位で切
り離されて形成される、電子部品である。(Means for Solving the Problems) The present invention includes an element body and at least three lead terminals formed extending substantially in parallel from both main surfaces of the element body, It is an electronic component that has a bent part bent at an obtuse angle to provide a step with a height almost equal to the thickness of the element body at its tip so that the element body can be sandwiched together with other lead terminals, and the lead terminal is at least It is an electronic component that is formed by arranging three wires as a unit in parallel to the lead terminal holding member, each of which is fixed to the element body, and then separated at a predetermined portion near the lead terminal holding member. .
（作用）
リード端子の折曲部は、鈍角に折り曲げられているため
、不要なはんだが表面張力によって折曲部に残りにくく
なる。(Function) Since the bent portion of the lead terminal is bent at an obtuse angle, unnecessary solder is less likely to remain on the bent portion due to surface tension.
（発明の効果）
この発明によれば、折曲部に不要なはんだが残りにくく
なるため、この不要なはんだを取り除く必要がなくなり
、素子本体を容易にリード端子の間に挿入しこれを挟む
ことができる。(Effects of the Invention) According to the present invention, since unnecessary solder is less likely to remain on the bent portion, there is no need to remove this unnecessary solder, and the element body can be easily inserted between the lead terminals and sandwiched therebetween. Can be done.
この発明の上述の目的、その他の目的、特徴および利点
は、図面を参照して行う以下の実施例の詳細な説明から
一層明らかとなろう。The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.
（実施例）
第１図はこの発明の一実施例を示す斜視図である。以下
の実施例では、この発明が圧電素子に用いられた場合に
ついて説明するが、この発明はその素子本体側主面に少
なくとも３つのリード端子を有する、たとえばハイブリ
ッドＩＣなど電子部品一般にも適用できるということを
予め指摘しておく。(Embodiment) FIG. 1 is a perspective view showing an embodiment of the present invention. In the following examples, a case will be explained in which the present invention is applied to a piezoelectric element, but the present invention can also be applied to general electronic components such as hybrid ICs, which have at least three lead terminals on the main surface of the element body. Let me point this out in advance.
この電子部品１０は板状の圧電素子本体１２を含む。こ
の圧電素子本体１２は、第２図および第３図に示すよう
に、その一方主面の両端に電極１４および１５が形成さ
れており、その他方主面の中央に電極１６が形成されて
いる。This electronic component 10 includes a plate-shaped piezoelectric element body 12. As shown in FIGS. 2 and 3, this piezoelectric element body 12 has electrodes 14 and 15 formed at both ends of one main surface, and an electrode 16 formed at the center of the other main surface. .
電極１４には細長い板状のリード端子１８が、たとえば
はんだ付けによって接続されている。また、同様に、電
極１５には同様の形状のリード端子２０が、たとえばは
んだ付けによって接続されている。そして、電極１６に
はリード端子２２が、同様に、たとえばはんだ付けによ
って接続されている。An elongated plate-shaped lead terminal 18 is connected to the electrode 14 by, for example, soldering. Similarly, a lead terminal 20 having a similar shape is connected to the electrode 15 by, for example, soldering. A lead terminal 22 is similarly connected to the electrode 16 by, for example, soldering.
このリード端子２２の先端には、鈍角に折り曲げられた
第１の折曲部２２ａが設けられ、この第１の折曲部２２
ａよりさらに先端に近い部位に、第１の折曲部とは逆向
きの鈍角に折り曲げられた、第２の折曲部２２ｂが設け
られている。なお、第１の折曲部２２ａおよび第２の折
曲部２２ｂによって生じる段差の高さは、圧電素子本体
の厚みとほぼ等しく形成されている。そして、先端から
第２の折曲部２２ｂにわたる部位が電極１８と接続され
る。A first bent portion 22a bent at an obtuse angle is provided at the tip of the lead terminal 22.
A second bent portion 22b, which is bent at an obtuse angle opposite to the first bent portion, is provided at a portion closer to the tip than a. Note that the height of the step created by the first bent portion 22a and the second bent portion 22b is formed to be approximately equal to the thickness of the piezoelectric element body. Then, a portion extending from the tip to the second bent portion 22b is connected to the electrode 18.
これらのリード端子１８．２２および２０は、リード端
子保持部２４にこの順で平行にかつほぼ同一の間隔を隔
てて並列されている。なお、リード端子１８．２０およ
び２２とリード端子保持部２４とは、たとえば１枚の金
属板を打ち抜いて、一体的に形成される。そして、これ
らのリード端子１８．２２および２０はその表面にはん
だめっき層を形成される。この際に、リード端子２２は
第１の折曲部２２ａおよび第２の折曲部２２ｂを有して
いるが、これらはともに鈍角に折り曲げられているため
、表面張力による不要なはんだが残りにく（なる。These lead terminals 18, 22 and 20 are arranged in parallel in this order on the lead terminal holding portion 24 at substantially the same intervals. Note that the lead terminals 18, 20 and 22 and the lead terminal holding portion 24 are integrally formed by punching out a single metal plate, for example. A solder plating layer is formed on the surfaces of these lead terminals 18, 22 and 20. At this time, the lead terminal 22 has a first bent part 22a and a second bent part 22b, but since these are both bent at an obtuse angle, unnecessary solder due to surface tension is left behind. ku(naru)
このように、不要なはんだがリード端子２２の折曲部に
残らず、かつリード端子２２の段差の高さが、圧電素子
本体１２の厚みとほぼ等しく形成されているため、圧電
素子本体１２をこれらのリード端子１８．２０および２
２によって容易に挟むことができる。In this way, unnecessary solder does not remain on the bent portion of the lead terminal 22, and the height of the step of the lead terminal 22 is formed to be approximately equal to the thickness of the piezoelectric element body 12, so that the piezoelectric element body 12 can be These lead terminals 18.20 and 2
2 can be easily sandwiched.
なお、第１図に示したように、リード端子１８．２０お
よび２２がリード端子保持部２４と一体的に形成されて
いる状態では、この電子部品１０は素子としては働かな
い。リード端子１８．２０および２２は、圧電素子本体
１２を挿入され、これを接続された後、リード端子保持
部材２４に近い所定の位置で切断され、これによって電
子部品１０が完成される。Note that, as shown in FIG. 1, when the lead terminals 18, 20 and 22 are integrally formed with the lead terminal holding portion 24, the electronic component 10 does not function as an element. After the piezoelectric element main body 12 is inserted into the lead terminals 18, 20 and 22 and they are connected, they are cut at a predetermined position near the lead terminal holding member 24, thereby completing the electronic component 10.
なお、この実施例では３つのリード端子の中で真中のリ
ード端子２２に折曲部２２ａおよび２２ｂを形成したが
、これは、たとえばリード端子１８および２０の先端に
折り曲げ部を形成してもよく、圧電素子本体１２を挟む
ことが可能ならば、その形成箇所や数は任意である。In this embodiment, bent portions 22a and 22b are formed in the middle lead terminal 22 among the three lead terminals, but bent portions may be formed at the tips of the lead terminals 18 and 20, for example. , the formation location and number thereof are arbitrary as long as the piezoelectric element main body 12 can be sandwiched therebetween.
第１図はこの発明の一実施例を示す斜視図である。
第２図はこの実施例の平面図である。
第３図はこの実施例の背面図である。
第４図はこの発明の背景となる従来の電子部品を示す図
屑図である。
第５図は従来の電子部品のリード端子先端部を示す断面
図である。
図において、１０は電子部品、１２は圧電素子、１８．
２０および２２はリード端子、２２ａおよび２２ｂは折
り曲げ部、２４はリード端子保持部材を示す。
特許出願人 株式会社 村田製作所
代理人 弁理士 岡 １） 全 啓
（ほか１名）
第４図
第５図FIG. 1 is a perspective view showing an embodiment of the present invention. FIG. 2 is a plan view of this embodiment. FIG. 3 is a rear view of this embodiment. FIG. 4 is a scrap diagram showing a conventional electronic component which is the background of this invention. FIG. 5 is a sectional view showing the tip of a lead terminal of a conventional electronic component. In the figure, 10 is an electronic component, 12 is a piezoelectric element, 18.
20 and 22 are lead terminals, 22a and 22b are bent portions, and 24 is a lead terminal holding member. Patent applicant Murata Manufacturing Co., Ltd. Representative Patent attorney Oka 1) Kei Zen (and 1 other person) Figure 4 Figure 5
Claims (1)
延びて形成される少なくとも３つのリード端子を含み、
前記リード端子の少なくとも１つは、他のリード端子と
ともに前記素子本体を挟めるように、その先端部に前記
素子本体の厚みとほぼ同じ高さの段差を設けるため鈍角
に折り曲げられた折曲部を有する電子部品であって、 前記リード端子は少なくとも３本を１単位としてリード
端子保持部材にほぼ平行に並列して配置され、前記素子
本体にそれぞれが固定された後、前記リード端子保持部
材に近い所定部位で切り離されて形成される、電子部品
。[Scope of Claims] An element body and at least three lead terminals extending substantially parallel from both main surfaces of the element body,
At least one of the lead terminals has a bent part bent at an obtuse angle to provide a step at the tip thereof with a height approximately equal to the thickness of the element body so that the element body can be sandwiched together with the other lead terminals. The electronic component has at least three lead terminals arranged in parallel to the lead terminal holding member as a unit, and after each lead terminal is fixed to the element body, the lead terminals are placed close to the lead terminal holding member. An electronic component that is formed by being separated at a predetermined location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61203975A JPH0763130B2 (en) | 1986-08-29 | 1986-08-29 | Electronic component manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61203975A JPH0763130B2 (en) | 1986-08-29 | 1986-08-29 | Electronic component manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6359206A true JPS6359206A (en) | 1988-03-15 |
| JPH0763130B2 JPH0763130B2 (en) | 1995-07-05 |
Family
ID=16482723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61203975A Expired - Lifetime JPH0763130B2 (en) | 1986-08-29 | 1986-08-29 | Electronic component manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0763130B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02130121U (en) * | 1989-03-31 | 1990-10-26 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649133U (en) * | 1979-09-21 | 1981-05-01 | ||
| JPS5994422U (en) * | 1982-12-13 | 1984-06-27 | 株式会社村田製作所 | resonator |
-
1986
- 1986-08-29 JP JP61203975A patent/JPH0763130B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649133U (en) * | 1979-09-21 | 1981-05-01 | ||
| JPS5994422U (en) * | 1982-12-13 | 1984-06-27 | 株式会社村田製作所 | resonator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02130121U (en) * | 1989-03-31 | 1990-10-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0763130B2 (en) | 1995-07-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |