JPS635799Y2 - - Google Patents
Info
- Publication number
- JPS635799Y2 JPS635799Y2 JP1982011457U JP1145782U JPS635799Y2 JP S635799 Y2 JPS635799 Y2 JP S635799Y2 JP 1982011457 U JP1982011457 U JP 1982011457U JP 1145782 U JP1145782 U JP 1145782U JP S635799 Y2 JPS635799 Y2 JP S635799Y2
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- thermal spraying
- blasting
- spraying
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007751 thermal spraying Methods 0.000 claims description 19
- 238000005422 blasting Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 8
- 239000007921 spray Substances 0.000 description 8
- 238000005507 spraying Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Nozzles (AREA)
Description
【考案の詳細な説明】
本考案はすぐれた溶射膜を効率よく得るための
溶射装置に関するものである。[Detailed Description of the Invention] The present invention relates to a thermal spraying apparatus for efficiently obtaining an excellent thermal sprayed film.
溶射の施行における前処理条件の設定は良好な
溶射膜を得るための重要なポイントである。前処
理した被溶射材は直ちに溶射することが望ましい
が、一般には前処理装置と溶射装置はそれぞれ独
立していること、および作業段取り等の理由で前
処理から溶射までは数時間放置される。 Setting pretreatment conditions during thermal spraying is an important point to obtain a good thermal sprayed film. Although it is desirable to spray the pretreated material immediately, it is generally left for several hours between pretreatment and spraying because the pretreatment equipment and the spraying equipment are independent, and for reasons such as work setup.
前処理としてブラスト法を採用する場合、第１
図のブラスト後の放置時間と溶射膜の密着性
（密着性指数＝１／a1／θ1＋a2／θ2＋a3／θ3…
θ＝テストの曲げ角度、ａ＝皮膜の割れ発生状
況のランク）との関係を示すグラフから判るよう
に、室温程度の低温度環境の場合、数時間以内で
あれば膜の密着性等にはあまり影響はない。しか
しながら溶射施行の信頼性を高めるためには放置
時間をより短縮する措置が望まれている。 When using the blasting method as pretreatment, the first
The left time after blasting and the adhesion of the sprayed film in the figure (adhesion index = 1/a 1 / θ 1 + a 2 / θ 2 + a 3 / θ 3 ... θ = test bending angle, a = crack occurrence status of the film) As can be seen from the graph showing the relationship between the temperature and the rank of the film, in the case of a low temperature environment around room temperature, the adhesion of the film will not be affected much within a few hours. However, in order to improve the reliability of thermal spraying, measures are desired to further shorten the exposure time.
本考案は上記観点から為されたもので、グリツ
トブラスト法による前処理装置と溶射装置とを一
体化したもので、この一体化により
前処理及び溶射が一つのチヤンバー内で実施
でき溶射膜の品質が高められる。 The present invention was developed from the above point of view, and is a device that integrates a grit blasting pretreatment device and a thermal spraying device.This integration allows pretreatment and thermal spraying to be performed in one chamber. Quality can be improved.
平板及び円筒形等の実際構造物に適用でき
る。 It can be applied to actual structures such as flat plates and cylinders.
部屋全体を空調しないですむ。 There is no need to air condition the entire room.
周囲が高湿でも作業ができる。 Can work even in high humidity surroundings.
施行場所がクリーンである。 The enforcement site is clean.
等の効果が奏せられる。Effects such as this can be achieved.
本考案における溶射機構としては、後記具体例
に示すプラズマ溶射の外、アーク溶射、ガス粉末
式、ガス爆裂式等を採用することができ、特に限
定はされない。 As the thermal spraying mechanism in the present invention, in addition to plasma spraying shown in the specific examples below, arc thermal spraying, gas powder type, gas explosion type, etc. can be adopted, and there is no particular limitation.
本考案装置の一例の概略図を第２図の断面図に
示した。 A schematic diagram of an example of the device of the present invention is shown in the sectional view of FIG.
本装置は一つのチヤンバー１内にグリツトブラ
スト室２と溶射室３の２つがあり、これらは遮蔽
板４で仕切られている。チヤンバー１は上部チヤ
ンバー１′と下部チヤンバー１″の２つから成り、
被処理材Ｍの形状（平板、円筒等）に合わせて下
部チヤンバー１″のみを取替える。被処理材Ｍと
下部チヤンバー１″のシールは真空チヤンバーの
様に厳密にする必要はなく、むしろシール材Ｓ等
により多少のガスが逃げられる程度のシール状態
とする。 This apparatus has two chambers 1, a grit blasting chamber 2 and a thermal spraying chamber 3, which are separated by a shielding plate 4. The chamber 1 consists of two parts: an upper chamber 1' and a lower chamber 1''.
Only the lower chamber 1'' is replaced according to the shape of the material M to be treated (flat plate, cylinder, etc.).The seal between the material M and the lower chamber 1'' does not need to be as strict as the vacuum chamber, but rather with a sealing material. A sealing condition such as S is established to allow some gas to escape.
グリツトブラスト室２には、グリツトGrおよ
びガスGa供給機構とブラストノズル６からなる
ブラスト装置５が設けられている。溶射室３には
ガスGa供給管、粉末Ｐ供給管およびプラズマ電
源Ｅ、プラズマ溶射ガン８からなる溶射装置７が
設けられている。ブラストノズル６および溶射ガ
ン８は自在継手９で各室に固定し、所定の処理範
囲を確保できるようにし、これらの動作は手動お
よび自動操作可能とする。 The grit blasting chamber 2 is provided with a blasting device 5 consisting of a grit Gr and gas Ga supply mechanism and a blast nozzle 6. The thermal spraying chamber 3 is provided with a thermal spraying device 7 consisting of a gas Ga supply pipe, a powder P supply pipe, a plasma power source E, and a plasma spray gun 8. The blast nozzle 6 and the thermal spray gun 8 are fixed in each chamber with a universal joint 9 so that a predetermined processing range can be secured, and these operations can be performed manually or automatically.
次に本装置を用いての円筒形構造物外面への溶
射施行法を説明する。 Next, a method for spraying onto the outer surface of a cylindrical structure using this device will be described.
まず被処理材Ｍを旋盤等に設置する。 First, the material M to be processed is placed on a lathe or the like.
本装置を第２図に示すように被処理材Ｍに設
置する。 This apparatus is installed on the material M to be treated as shown in FIG.
被処理材表面の汚れがひどい場合は、上記
実施例に予備的にブラスト処理を施しておく。 If the surface of the material to be treated is heavily contaminated, the above-mentioned example is preliminarily subjected to blasting treatment.
被処理材Ｍを矢印のように回転させる。回転
速度はブラストおよび溶射の処理能力に同調さ
せる。 Rotate the material M to be processed as shown by the arrow. Rotation speed is matched to blast and thermal spray throughput.
次にブラスト装置５を稼動させ、グリツト
Grおよび不活性ガスや圧縮エアのようなガス
Gaをブラストノズル６から吹き込んで処理面
のブラストを行う。この際のグリツトGrは排
気管１０およびグリツト排出管１１から回収し
再利用する。 Next, the blasting device 5 is operated to remove grit.
Gr and gases like inert gases and compressed air
Ga is blown into the blast nozzle 6 to blast the treated surface. The grit Gr at this time is recovered from the exhaust pipe 10 and the grit discharge pipe 11 and reused.
ブラスト処理面はゆつくりと溶射室３へ移動
し引続き溶射が開始される。ブラスト処理と溶
射は連続的に実施される。 The blasted surface is slowly moved to the thermal spraying chamber 3, and thermal spraying is subsequently started. Blasting and thermal spraying are carried out continuously.
母材SS材にWC溶射を行う場合を例にとると、
Ａ2O3グリツト30〜40メツシユ、５Kg／cm2圧で
ブラスト、湿度コントロール50％とした後、溶射
ガン3MB／7MB、ガス（Ar7Kg／cm2、H23.5Kg／
cm2）、溶射材としてWC粉末を用い、電流400A、
電圧50〜55V、溶射距離76cm程度で溶射が行なわ
れる。 For example, when performing WC spraying on base material SS material,
A 2 O 3 grit 30-40 mesh, 5 Kg/cm 2 pressure blast, humidity control 50%, thermal spray gun 3 MB/7 MB, gas (Ar 7 Kg/cm 2 , H 2 3.5 Kg/
cm 2 ), using WC powder as the spraying material, current 400A,
Thermal spraying is performed at a voltage of 50 to 55V and a spraying distance of approximately 76cm.
第２図の装置の場合、ブラスト時の粉塵等が処
理面に残つたり、また遮蔽板の隙間から溶射室へ
の流入性も考えられるため、これらの弊害を除き
たい場合は第３図、第４図に示すようなブラスト
面の清掃機構を取付けることとする。 In the case of the equipment shown in Figure 2, dust during blasting may remain on the processing surface and may also flow into the thermal spraying chamber through gaps in the shielding plate. A cleaning mechanism for the blast surface as shown in Fig. 4 will be installed.
第３図に示す清掃法は回転する被処理材Ｍ表面
に、新たに設けた排気管１２先端に取付けたブラ
シ１３を押付けながら、粉塵PD等を排気管１２
で吸引し、チヤンバー１外へ排出するものであ
る。 The cleaning method shown in FIG. 3 is to remove dust PD, etc. from the exhaust pipe 12 while pressing the brush 13 attached to the tip of the newly installed exhaust pipe 12 onto the surface of the rotating workpiece M.
The gas is sucked in and discharged to the outside of the chamber 1.
第４図は、溶射室３とブラスト室２の中間に設
けられた、遮蔽板の機能をも有する中間室１４に
取付けられた回転ブラシ１５により、粉塵PDを
排気管１６より排出するものである。 FIG. 4 shows a system in which dust PD is discharged from an exhaust pipe 16 by a rotating brush 15 attached to an intermediate chamber 14, which is provided between the thermal spray chamber 3 and the blast chamber 2 and also has the function of a shielding plate. .
第１図は被処理面ブラスト後の放置時間と溶射
膜密着性の関係を示すグラフであり、第２図は本
考案の溶射装置の一例を示す断面図であり、第３
図および第４図は第２図の装置に更に取付け可能
なブラスト面清掃機構を示す断面図である。
第２〜４図において、１はチヤンバー、２はブ
ラスト室、６はブラストノズル、３は溶射室、８
はプラズマ溶射ガン、第２，３図において４は遮
蔽板、第３図の１２は排気管、１３はブラシ、第
４図において１４は遮蔽板の機能を有す中間室、
１５は回転ブラシである。
FIG. 1 is a graph showing the relationship between the standing time after blasting the surface to be treated and the adhesion of the sprayed film, FIG. 2 is a cross-sectional view showing an example of the thermal spraying apparatus of the present invention, and FIG.
4 and 4 are cross-sectional views showing a blast surface cleaning mechanism that can be further attached to the apparatus of FIG. 2. In Figures 2 to 4, 1 is a chamber, 2 is a blast chamber, 6 is a blast nozzle, 3 is a thermal spray chamber, and 8
1 is a plasma spray gun; in FIGS. 2 and 3, 4 is a shielding plate; in FIG. 3, 12 is an exhaust pipe; 13 is a brush; in FIG. 4, 14 is an intermediate chamber that functions as a shielding plate;
15 is a rotating brush.
Claims (1)
機構を備えたブラスト室と、溶射機構を備えた溶
射室とを一体化した形で設けたことを特徴とする
溶射装置。 A thermal spraying apparatus characterized in that one chamber is partitioned by a shielding plate, and a blasting chamber equipped with a blasting mechanism and a thermal spraying chamber equipped with a thermal spraying mechanism are integrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1145782U JPS58116066U (en) | 1982-02-01 | 1982-02-01 | Thermal spray equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1145782U JPS58116066U (en) | 1982-02-01 | 1982-02-01 | Thermal spray equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58116066U JPS58116066U (en) | 1983-08-08 |
| JPS635799Y2 true JPS635799Y2 (en) | 1988-02-17 |
Family
ID=30024065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1145782U Granted JPS58116066U (en) | 1982-02-01 | 1982-02-01 | Thermal spray equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58116066U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60227856A (en) * | 1984-04-27 | 1985-11-13 | Kawasaki Heavy Ind Ltd | Low-pressure thermal spray device |
| JPH0522288Y2 (en) * | 1986-02-21 | 1993-06-08 | ||
| JPH0532213Y2 (en) * | 1987-10-05 | 1993-08-18 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845788Y2 (en) * | 1979-12-29 | 1983-10-18 | 新日本製鐵株式会社 | Refractory powder sprayer |
-
1982
- 1982-02-01 JP JP1145782U patent/JPS58116066U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58116066U (en) | 1983-08-08 |
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