JPS635638U - - Google Patents
Info
- Publication number
- JPS635638U JPS635638U JP9950986U JP9950986U JPS635638U JP S635638 U JPS635638 U JP S635638U JP 9950986 U JP9950986 U JP 9950986U JP 9950986 U JP9950986 U JP 9950986U JP S635638 U JPS635638 U JP S635638U
- Authority
- JP
- Japan
- Prior art keywords
- coating
- passage hole
- thin wire
- sliding properties
- wire passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案に係るボンデイング用ウエツ
ジの先端部のみを示す縦断面図、第２図は、ボン
デイング装置の概略図である。
１２…細線の通過孔、１３…滑動性良好な被覆
。
FIG. 1 is a longitudinal sectional view showing only the tip of a bonding wedge according to the present invention, and FIG. 2 is a schematic diagram of a bonding apparatus. 12...Thin wire passage hole, 13...Coating with good sliding properties.
Claims (1)
たことを特徴とするボンデイング用ウエツジ。 A bonding wedge characterized by coating the inner wall of a thin wire passage hole with a coating having good sliding properties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9950986U JPS635638U (en) | 1986-06-27 | 1986-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9950986U JPS635638U (en) | 1986-06-27 | 1986-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS635638U true JPS635638U (en) | 1988-01-14 |
Family
ID=30968448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9950986U Pending JPS635638U (en) | 1986-06-27 | 1986-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635638U (en) |
-
1986
- 1986-06-27 JP JP9950986U patent/JPS635638U/ja active Pending