JPS635637U - - Google Patents

Info

Publication number
JPS635637U
JPS635637U JP1986099404U JP9940486U JPS635637U JP S635637 U JPS635637 U JP S635637U JP 1986099404 U JP1986099404 U JP 1986099404U JP 9940486 U JP9940486 U JP 9940486U JP S635637 U JPS635637 U JP S635637U
Authority
JP
Japan
Prior art keywords
capillary
hole
bonding
cylindrical body
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986099404U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986099404U priority Critical patent/JPS635637U/ja
Publication of JPS635637U publication Critical patent/JPS635637U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • H01L2224/78302Shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
JP1986099404U 1986-06-27 1986-06-27 Pending JPS635637U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986099404U JPS635637U (fr) 1986-06-27 1986-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986099404U JPS635637U (fr) 1986-06-27 1986-06-27

Publications (1)

Publication Number Publication Date
JPS635637U true JPS635637U (fr) 1988-01-14

Family

ID=30968252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986099404U Pending JPS635637U (fr) 1986-06-27 1986-06-27

Country Status (1)

Country Link
JP (1) JPS635637U (fr)

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