JPS6356236U - - Google Patents
Info
- Publication number
- JPS6356236U JPS6356236U JP14788986U JP14788986U JPS6356236U JP S6356236 U JPS6356236 U JP S6356236U JP 14788986 U JP14788986 U JP 14788986U JP 14788986 U JP14788986 U JP 14788986U JP S6356236 U JPS6356236 U JP S6356236U
- Authority
- JP
- Japan
- Prior art keywords
- release paper
- sponge
- main body
- outer edge
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986147889U JPH0243856Y2 (US06420036-20020716-C00037.png) | 1986-09-27 | 1986-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986147889U JPH0243856Y2 (US06420036-20020716-C00037.png) | 1986-09-27 | 1986-09-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6356236U true JPS6356236U (US06420036-20020716-C00037.png) | 1988-04-15 |
| JPH0243856Y2 JPH0243856Y2 (US06420036-20020716-C00037.png) | 1990-11-21 |
Family
ID=31061664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986147889U Expired JPH0243856Y2 (US06420036-20020716-C00037.png) | 1986-09-27 | 1986-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243856Y2 (US06420036-20020716-C00037.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2017145321A1 (ja) * | 2016-02-25 | 2018-03-01 | 新電元工業株式会社 | 回路基板の実装構造体および回路基板の実装方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4310257Y1 (US06420036-20020716-C00037.png) * | 1964-05-07 | 1968-05-06 | ||
| JPS493614U (US06420036-20020716-C00037.png) * | 1972-04-12 | 1974-01-12 | ||
| JPS49111441U (US06420036-20020716-C00037.png) * | 1972-10-09 | 1974-09-24 | ||
| JPS55164271A (en) * | 1979-06-08 | 1980-12-20 | Takayoshi Ishigaki | Adhesive material with release paper and its preparation |
| JPS57143236U (US06420036-20020716-C00037.png) * | 1981-02-28 | 1982-09-08 |
-
1986
- 1986-09-27 JP JP1986147889U patent/JPH0243856Y2/ja not_active Expired
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4310257Y1 (US06420036-20020716-C00037.png) * | 1964-05-07 | 1968-05-06 | ||
| JPS493614U (US06420036-20020716-C00037.png) * | 1972-04-12 | 1974-01-12 | ||
| JPS49111441U (US06420036-20020716-C00037.png) * | 1972-10-09 | 1974-09-24 | ||
| JPS55164271A (en) * | 1979-06-08 | 1980-12-20 | Takayoshi Ishigaki | Adhesive material with release paper and its preparation |
| JPS57143236U (US06420036-20020716-C00037.png) * | 1981-02-28 | 1982-09-08 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2017145321A1 (ja) * | 2016-02-25 | 2018-03-01 | 新電元工業株式会社 | 回路基板の実装構造体および回路基板の実装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0243856Y2 (US06420036-20020716-C00037.png) | 1990-11-21 |
