JPS6355948A - Probimg apparatus - Google Patents

Abstract

PURPOSE:To improve productivity, by constituting an inspecting part so that the mounting position of a test head can be replaced at least between two sides, thereby utilizing the inside of a clean room effectively. CONSTITUTION:Probe needles 4 of a probing card 8 are connected to a pin electronics board 6 of a test bed 5 through wirings 12, pogo pins 13 and wirings 11. The semiconductor chips of a wafer 1 on a stage 7 are inspected with the probe needles 4. The mounting position of the test head 5 for inspecting the chips can be replaced between two sides. For this purpose, the distance between an inspecting part and the left surface side is made equal to the distance between the inspecting part and the right surface side. Thus the test bed 5 can be mounted to both right and left sides.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a probe device.

(Conventional technique W) Probe devices, such as semiconductor wafer probers,
-49643, etc., and is well known. That is, a probe needle (2) is brought into contact with the pad (2) of the semiconductor chip (2) formed on the positioned wafer (2), and the pin electronics node 0 of the test head (0) is brought into contact with the other side of the probe needle (3) to test the electrical performance. . At this time, the stage (2) on which the wafer (2) is placed is moved, and the probe card (c) needle is brought into contact with the semiconductor chip (2) for inspection. In a prober with such a configuration, if the semiconductor wafer supply device is installed on the right side of the housing, the test head is attached to the left side wall, and the semiconductor wafer supply device is installed on the left side of the housing. If it is,
A test head was attached to the right side wall to form a prober.

(Problem to be Solved by the Invention) The purpose of fixing the test head ■ to the left side or right side of the upper surface of the vertebral body of the prober is as follows:
-41045, etc., and is well known. That is, by installing the semiconductor wafer supply device on the right side, the test head (2) is installed on the left side of the upper surface of the prober vertebral body. Also, by installing the semiconductor wafer device on the left side, the test head (2) is installed on the right side of the upper surface of the prober vertebral body. This has the purpose of increasing the usage efficiency per unit area of expensive lean rooms. However, it is necessary to decide which type to use before manufacturing the prober, which is time-consuming and costly because it is not versatile in manufacturing. Moreover, after installation in a clean room, the arrangement cannot be easily changed, and changing the arrangement requires a great deal of time and cost, and requires modification.

As a result, it is desired that at the manufacturing stage, a type with a feeding device added on the right side and a type with a feeding device added on the left side can be manufactured without worrying, and that the arrangement can be easily changed after completion.

As described above, since the test head (c) cannot be removed and moved to the desired position, the present invention has the disadvantage that it hinders the effective use of the clean room and is a major hindrance to improving productivity. This probe device is designed to improve productivity by making effective use of the clean room space by providing an inspection section that allows the test head of the wafer prober to be moved in the desired direction. It provides:

[Structure of the invention]

(Means for Solving the Problem) The present invention provides a probe device that transports a wafer to an inspection section and inspects semiconductor chips formed on the wafer using a test head, in which the test head is connected to at least two test heads.
A probe device characterized in that the above-mentioned inspection section is configured so that the mounting position can be exchanged between sides.

(Function) In the probe device of the present invention, the inspection section is configured such that the test head can be attached and positioned interchangeably between at least two sides.

This makes it possible to test semiconductor wafers with the same probe device even if the test head is mounted in a different position.
A probe device that can effectively utilize the inside of a clean room and improve productivity can be obtained. This is particularly effective in manufacturing probe devices.

(Embodiment) An embodiment of the probe device of the present invention, for example, a semiconductor wafer prober, will be described with reference to FIGS. 1, 2, and 3.

The feature of this embodiment is that the semiconductor wafer prober is equipped with a plurality of probe needles corresponding to the pad pattern of the chip to be measured, for example, on a wafer (2) on which a large number of semiconductor chips (2) are formed and placed on a stage (2). Touch the probe card ■ holding the probe card ■ to the pad ■ of the above-mentioned semiconductor chip ■, and output a predetermined voltage, current, signal, etc. to the pad ■, or output the voltage, current, signal, etc. from the device.
The test head (2), which includes a board for inputting signals, such as a pin electronics port 0, is attached to the upper surface of the probe device. Attached the pin of the test head ■ from the electronics port ■ to the probe card (to)
The wire is connected to the tip of the probe needle (A). For maintenance and inspection purposes, the test head (■) and the probe device are rotated around the test head rotation fulcrum (■), so the circuit board (10) must be removed from one side during wiring.
The wiring (11)L is brought into contact with the wiring (12) from the other side using, for example, a pogo pin (13). By installing this test head (■), the distance to the drivers and comparators in the pin electronics port (■), which used to be over 1m, has been reduced to approximately 70 or less, and the impedance has also been lowered, making it possible to test at high frequencies.

Thereafter, all of the semiconductor chips (2) formed on the wafer (2) are inspected by moving the stage (2).

The test head 1 for testing the chip to be measured is mounted between two sides so that the distance from the left side and the right side of the testing section is equal to enable the position to be changed. Here, the casters (14
), so if you attach it to the right side as it is, the position of the pogo pin (13) will be 180°.
The problem of misalignment occurs. However, this problem can be resolved by rotating the wiring (11) up to the probe card by 180 degrees to eliminate the misalignment of the pogo pin (13).

It is also possible to rotate the wiring (12) on the test head side by 1801 rotations. Therefore, it is desirable that the probe card has a structure that allows it to be attached to and removed from the wiring (11).
A substrate (15) for receiving the wiring (11) is provided on the opposite side from the substrate (15), and a probe card (8) is connected to the substrate (15). The stage (2) is configured to be movable in the x-y-z directions, and this movement is preset according to the size of the chips formed on the wafer. The configuration of a semiconductor wafer prober is well known to those skilled in the art, so details thereof will be omitted.

As another example, by configuring the contact board (1o) to have the same distance from the front and rear surfaces of the upper surface of the vertebral body surface of the wafer prober, it is also possible to mount the test head (1) from the front and back. As an example, by configuring the contact board (10) in the center of the upper surface of the vertebral body surface of the wafer blob, the test head can be
It becomes possible to install the . By configuring the inspection section in such a way that the test head can be attached from various directions, it is difficult to change the layout of conventional semiconductor wafer probers as needed, and it is difficult to change the arrangement of the test head when needed. This eliminates the need to manufacture products.

〔Effect of the invention〕

As described above, according to the present invention, the inspection section and the test head of the semiconductor wafer prober can be installed and replaced between at least two sides, so that the inspection part and the test head of the semiconductor wafer prober can be changed in position, repaired, modified, and It can be used effectively during management, which has a great effect on improving productivity.

[Brief explanation of the drawing]

FIG. 1 is a diagram of a wafer prober for explaining one embodiment of the present invention, FIG. 2 is a diagram of the interior within the dotted line in FIG. 1(a),
FIG. 3 is a plan view of a wafer on which the measurement chip of FIG. 1 is constructed, and FIG. 4 is a diagram of a conventional wafer blower. 1... Wafer 5... Test head 6...
・Pin electronics port 10...Contact board 11.12...Wiring 13...Pogo pin

Claims (1)

[Claims] In a probe device that transports a wafer to an inspection section and inspects semiconductor chips formed on the wafer with a test head, the inspection section is configured such that the mounting position of the test head can be exchanged between at least two sides. A probe device characterized by: