JPS6355548U - - Google Patents
Info
- Publication number
- JPS6355548U JPS6355548U JP1986150241U JP15024186U JPS6355548U JP S6355548 U JPS6355548 U JP S6355548U JP 1986150241 U JP1986150241 U JP 1986150241U JP 15024186 U JP15024186 U JP 15024186U JP S6355548 U JPS6355548 U JP S6355548U
- Authority
- JP
- Japan
- Prior art keywords
- concave part
- heat sink
- component mounting
- mounting board
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986150241U JPS6355548U (US06330241-20011211-M00004.png) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986150241U JPS6355548U (US06330241-20011211-M00004.png) | 1986-09-29 | 1986-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355548U true JPS6355548U (US06330241-20011211-M00004.png) | 1988-04-14 |
Family
ID=31066205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986150241U Pending JPS6355548U (US06330241-20011211-M00004.png) | 1986-09-29 | 1986-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355548U (US06330241-20011211-M00004.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53100462A (en) * | 1977-02-15 | 1978-09-01 | Matsushita Electric Ind Co Ltd | Method of producing hyb ic |
-
1986
- 1986-09-29 JP JP1986150241U patent/JPS6355548U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53100462A (en) * | 1977-02-15 | 1978-09-01 | Matsushita Electric Ind Co Ltd | Method of producing hyb ic |
