JPS6351480U - - Google Patents

Info

Publication number

JPS6351480U

JPS6351480U JP1986146170U JP14617086U JPS6351480U JP S6351480 U JPS6351480 U JP S6351480U JP 1986146170 U JP1986146170 U JP 1986146170U JP 14617086 U JP14617086 U JP 14617086U JP S6351480 U JPS6351480 U JP S6351480U

Authority

JP

Japan

Prior art keywords

circuit board

package

printed circuit

electronic component

copper foil

Prior art date

1986-09-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
• 239000011889 copper foil Substances 0.000 claims description 3
• 238000010586 diagram Methods 0.000 description 2
• 238000005452 bending Methods 0.000 description 1
• 238000004806 packaging method and process Methods 0.000 description 1