JPS6351437U - - Google Patents
Info
- Publication number
- JPS6351437U JPS6351437U JP14451986U JP14451986U JPS6351437U JP S6351437 U JPS6351437 U JP S6351437U JP 14451986 U JP14451986 U JP 14451986U JP 14451986 U JP14451986 U JP 14451986U JP S6351437 U JPS6351437 U JP S6351437U
- Authority
- JP
- Japan
- Prior art keywords
- bonding device
- semiconductor chip
- frame
- wire bonding
- die bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14451986U JPS6351437U (nl) | 1986-09-20 | 1986-09-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14451986U JPS6351437U (nl) | 1986-09-20 | 1986-09-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6351437U true JPS6351437U (nl) | 1988-04-07 |
Family
ID=31055194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14451986U Pending JPS6351437U (nl) | 1986-09-20 | 1986-09-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6351437U (nl) |
-
1986
- 1986-09-20 JP JP14451986U patent/JPS6351437U/ja active Pending