JPS6351436U - - Google Patents
Info
- Publication number
- JPS6351436U JPS6351436U JP14560586U JP14560586U JPS6351436U JP S6351436 U JPS6351436 U JP S6351436U JP 14560586 U JP14560586 U JP 14560586U JP 14560586 U JP14560586 U JP 14560586U JP S6351436 U JPS6351436 U JP S6351436U
- Authority
- JP
- Japan
- Prior art keywords
- heating
- manufacturing apparatus
- etching rate
- wafer
- semiconductor manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000001312 dry etching Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14560586U JPS6351436U (sv) | 1986-09-22 | 1986-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14560586U JPS6351436U (sv) | 1986-09-22 | 1986-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6351436U true JPS6351436U (sv) | 1988-04-07 |
Family
ID=31057300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14560586U Pending JPS6351436U (sv) | 1986-09-22 | 1986-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351436U (sv) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016225521A (ja) * | 2015-06-02 | 2016-12-28 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
-
1986
- 1986-09-22 JP JP14560586U patent/JPS6351436U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016225521A (ja) * | 2015-06-02 | 2016-12-28 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |