JPS63501259A - touch sensitive indicator light - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] touch sensitive indicator light Foreword The present invention relates to touch-sensitive indicator lights, and more particularly to actuated as switching means. Light emitting diodes incorporating touch or proximity sensors.

Background of the invention -・Light-emitting diodes, also known as LEDs, are very popular in the electrical and electronic industries. It is widespread. Light emitting diodes are typically forward-biased p-n semiconductor junction devices. A solid-state electronic component consisting of diodes. Injection holes and electrons spread over the entire surface of the junction and bonding area. When dispersed, light emission occurs in or near the junction region. The bonding hole and electron are It releases energy, and some of this energy is directly emitted as photons. luminescence A diode is created by diffusing p-n type impurities into a suitable semiconductor to form a junction. It can be manufactured by Common for making light emitting diodes that emit light in the visible spectrum The semiconductor used is gallium arsenide phosphide.

The diode is conventionally encapsulated in a plastic capsule with a dome-topped circle. It forms a cylindrical structure, and the assembled diameter is approximately 5 mII+.

Light emitting diodes play an important role in the electrical and electronic industry. light emitting diode Provides a simple and effective means of displaying specific states of various components in electronic circuits. Ru. Its small size and durability make it ideal for use in instrument panels and circuit boards. . Light emitting diodes are often used to indicate the status of switch means and are often For example, it may be installed adjacent to a switch to display the status of the switch.

In recent years, companies such as HevIett Packard A light emitting diode in which the company has incorporated an IC (integrated circuit) into the structure of the light emitting diode. was produced.

Summary of the invention The present invention provides a light emitting diode with built-in switching means.

The present invention also includes a diode encapsulated in a plastic dome. , a connection located within the plastic dome and operable from the outside. A touch-sensitive light emitting diode comprising a touch-sensitive switch means, the switch comprising: a touch-sensitive light emitting diode; The switch means includes an output terminal to external electronic equipment, and the diode is connected to the switch means state. Provide a formula that gives a visual representation of the Preferably, the switch means includes a conductive region located at or near the top of the stick dome.

The switch means may be a resistance type contact switch, a voltage detection type contact switch, or a capacitance detection type. It may be a contact switch or a proximity detection type contact switch.

In one embodiment, the switch means is located within the plastic dome. a stress/strain sensitive element to reduce the external pressure on the top of the dome to the stress/strain sensitive element; It is detected by a motion-sensitive element.

The stress/strain sensitive element may be a resistor, a piezoelectric or piezoresistive layer, or a semiconductor piezoelectric layer. It may also consist of a resistor or a transistor.

In another embodiment, the switch means is configured to detect a signal from a nearby object or from a fingertip. A photosensitive element that detects the light from the light emitting diode reflected by the plastic dome. including. The optical sensor may consist of a phototransistor or a photodiode. It may be.

The term "dome" as used herein refers to a dome that prevents diversification of the external contour. Regarding the iode term part.

Drawing description Embodiments of the invention will now be described by way of example only with reference to the accompanying drawings, in which: FIG.

Figures 1 to 7 show various embodiments of light emitting diodes incorporating switching means. The side view shown in Figure 8 uses an LED (light emitting diode) with built-in switch means. FIG. 9 is a block circuit diagram illustrating one embodiment of the toggle output used to control the toggle output. Figure 8 is a circuit diagram illustrating the LED, Figure 10 is a simple "instant on" output to the switch. 11a, a circuit diagram illustrating the use of an LED with switch means for providing Figure b and Figure C are respectively a plan view, a side view, and a side view incorporating the stress/strain sensor. Front view, Figure 12 shows an LED block incorporating a piezoresistive stress/strain sensor. Figure 13 is a circuit diagram of an LED incorporating a piezoresistive stress/strain sensor. It is a road map.

Description of the preferred embodiment The various embodiments illustrated in the accompanying drawings include light emitting diodes (light emitting diodes) incorporating switching means. Regarding LED). Throughout the various examples, the same reference numbers will be used for similar parts. There is. Essentially, the touch-sensitive light emitting diode consists of a translucent plastic dome. Consists of one of many known types of LEDlo encapsulated in 1l. . The dome 11 is composed of a dome-shaped neck portion 12 and a cylindrical portion 13 placed on a substrate 14. Ru. The substrate is usually molded integrally with the dome and has a space outside the substrate. It has three protruding terminals, namely an output terminal 16, a ground terminal 17 and a switch. It has an output terminal l8. the plastic in which the LED is encapsulated; The dome is preferably made of thermosetting resin or injection molded thermoplastic. produced. The plastic dome is transparent or translucent and has an outer diameter of approximately 5 m. is manufactured to do so. This is the standard diameter of conventional LEDs, and the touch sensitive This allows LEDs to be used in existing circuits and instrument panels.

The touch-sensitive type L described in the embodiment illustrated in FIGS. 1 to 7 of the accompanying drawings. The ED includes four types of switch means. That is, (a) resistive contact switch blood The resistance between two or more electrodes can be reduced by contact with a finger or other conductive material. Ru. This change is a switch signal that is sent to the switch electronics inside and outside the touch-sensitive LED. Therefore, it is measured and utilized.

(b) Voltage detection type contact switch The human body acts as a kind of antenna, and is exposed to electromagnetic fields generated from power sources such as power lines. It has a high impedance AC voltage coupled to it. These voltages are touch sensitive Detected by a single conductive sensor area on the LED. by finger contact or proximity , the voltage can be detected and used as a switch signal. the conductivity type sensor area and contact is not a requirement. This is because the voltage is close to the conductive sensor from the finger. This is because they can be capacitively coupled.

(C) Capacitance detection type contact switch The human body acts as a small capacitor with one end grounded.

This effect is created by an electronic circuit that detects the presence of a finger in contact with or proximity to the conductive sensor. It can be used to detect. This type of contact switch is a single touch switch on the touch-sensitive LED. It operates in one conductive sensor area. proximity or contact of the layer with the conductive sensor region; The capacitance change with respect to electrical ground caused by this is used as a switch signal.

This change in capacitance is due to the high frequency oscillator flowing from the conductive sensor to electrical ground. Vibration signals present in the conductive sensor, such as by detecting an electrical current; 1. due to deterioration or harmonic filter action. Can be detected.

(d) Conductor proximity type contact switch The switch does not require contact and typically uses two or more conductive sensor areas. . In the switch, the proximity of a conductor, such as a finger, on the touch-sensitive LED or An electrical conductor between two or more conductive heads within its plastic encapsulation. change conductive or capacitive coupling.

From the above, the term "touch-sensitive" refers to whether or not an external element actually contacts the sensor. is a switching means in which case the external element is placed in close proximity to the sensor. It should be understood that it also includes. The phrase "touch sensitivity" is based on actual touch. Not limited.

FIG. 1 illustrates a simple form of a touch-sensitive LED 20. This touch sensitive type The LED contains no internal electronics and is simply encapsulated in a plastic dome 11 Consists of a single light emitting diode. The top 12 of the dome is made of the plastic It comprises an electrically conductive coating/layer applied over the encapsulating capsule. This layer is a conductive oxide Or conductive plastic may be used. Formed by sputter deposition or electrolytic methods Metallic coatings have also been used to provide the layer. The coating 21 covers the light emitting diode. It is partially transparent to light from the card IO. The metal lead 22 is connected to the conductive cover m21. is clipped to one end edge and electrically connects the sheath to the switch output terminal 18. do. In this embodiment, the touch-sensitive LED is coupled with an external electronic circuit. Let's become.

In the embodiment illustrated in FIGS. 2-7, the touch-sensitive LEDs are all zero voltage, i.e. an integrated circuit glued and electrically connected to the ground terminal 17; Built-in path 69. The positive input terminal 16 is connected to the metal frame member 67 of the terminal 16. A thin gold wire or metal bonded to a metallized pad 66 formed on the integrated circuit. It is coupled to the integrated circuit 69 via line 68 . Similarly, the switch terminal 1 The output of 8 is coupled to the integrated circuit 69 via a thin wire glue section 64. . A thin wire line θ3 connects the integrated circuit 69 to the touch sensitive layer 21 via a lead 62. Join.

Metal strip 61 is coupled to the LED and the integrated circuit only internally. The relevant The code 61 is cut out near the substrate of the LED's encapsulation.

Operation of the integrated circuit and its touch-sensitive LEDs will be discussed later in this specification.

In the embodiment illustrated in FIG. 3, the dome 12 of the touch-sensitive LED 30 is Completely or partially for the light of the frequency emitted by the light emitting diode lO Conductive cap 31 made of light-transmitting conductive plastic or other conductive material It is equipped with The conductive cap 31 is connected to the integrated circuit 69 via leads 32. are combined.

In the embodiment illustrated in FIG. 4, ie, the touch-sensitive LED 40, the driver The conductive cap or conductive coating layer on the top 12 of the dome 11 covers the outside of the dome. There is also a conductive pin that extends outward through the surface and that can be directly contacted to activate the LED. Alternatively, it may be replaced by an electrode or lead 41 forming a lead.

Conductive coatings or layers that can be used include gold, silver or nickel, or chromium. Contains a thin coating of metal. The coating is sufficiently thick to allow some of the light from the LED to pass through. It is thinned out in minutes. The coating may be applied by existing vapor deposition, sputtering or electrolytic plating. or can be formed using chemical precipitation techniques.

Metal oxide thin films such as indium oxide, tin oxide and zinc oxide thin films are translucent; It is also electrically conductive. For this reason, these oxides are currently used in some optoelectronic Used in Roex parts. Oxide thin films are formed using existing vapor deposition methods. Ru. Sometimes, the thin film is doped with impurities to modify or adjust its properties. Ru.

There are also two types of conductive polymers.

That is, i) Usually non-conductive plastics mixed with fillers that produce conductive results. of. For example, thermal polymers or resins filled with metal or graphite.

These materials are typically opaque, but can be partially translucent when used as ultra-thin coatings. Form an electrode.

1j) Polycyphen, trans polyacetylene, polyaniline, etc. Conductive polymers are electrically conductive. If these materials are used as a thin film, they will Create a spectrally transparent electrode.

In the embodiment illustrated in FIG. 5, the touch-sensitive LED 50 is connected to the dome 11 Two conductive electrodes 51 and 52 in the shape of a conductive layer on the outer surface of the dome are placed on the top 12 of the dome. It is incorporated. The conductive electrodes 5L and 52 are slightly spaced apart as illustrated in FIG. The integrated circuit 69 is connected to the integrated circuit 69 through leads 53 and 54. are combined. Finger contact changes the resistance between the two electrodes, but the resistance Can be detected by integrated circuit electronics. Moreover, the approach of the finger is between the electrodes 51 and 52. This increases capacitive coupling, which can also be detected by the integrated circuit's electronics. Applicable If the sensor is capacitive and does not require direct contact, the electrodes are as shown in Figure 6. below the surface of the encapsulating encapsulated plastic dome as illustrated in the examples. protected or hidden, in which case the electrodes 61 and 62 are It is located slightly below the top 12 of.

FIG. 7 shows a pair of light emitting diodes 70 and 71 arranged close to each other and in a cluster. coupled to the product circuit 69, said switch means being, in use, of any of the types described above; The light emitting diodes 70 and 71 may be optionally colored red or green upon activation of the light emitting diodes 70 and 71. energize alternately so that when green is “on” there is zero voltage on that output lead. and when red is “on” indicates the output lead is at the positive supply voltage. An example in which this is done will be illustrated. A large number of light emitting diodes are combined into one contact reaction type L. It is also understood that the ED can be incorporated to provide a variety of colors to indicate a specific range of conditions. Ru.

FIG. 8 provides the touch-sensitive LEDs illustrated in FIGS. 2 and 3 and the desired operation. A block circuit diagram of a corresponding electronic circuit incorporated in the integrated circuit 69 is illustrated as follows. . The LED is illustrated by the river fish number 10, and the touch-sensitive pickup is illustrated by the river fish number 10. According to 21 and 31. The circuit includes constant current LED driver, touch detection and debounce circuit, flip-flop for toggle actuation, and output driver stroke solid Contains a switch stage. Examples of electronic equipment that may be used to implement the switch output stage To name a few, transistors, triacs, diacs, and analog switches or a logic level output, such as a CMOS inverter. Shown in the block diagram Each part is rl! terminal voltage,” “switch output terminal,” and “ground terminal.”

Figure 9 is a circuit diagram of a single sensor electrode 21.31.41 voltage sensing contact switch. be. By modifying existing components, this type has internal electronic equipment as shown in Figure 1. It is suitable as an external electronic device for operating a touch-sensitive LED that does not have a It is shown. When the electrode 21 is contacted, the AC electrical signals present in the human body are is supplied to the input of trigger 81. At that time, the output of the Schmitt trigger 81 The power is converted to DC by diode 82, resistors 83 and 84 and capacitor 85. It is a rectified square wave. This direct current exists while the electrodes are in contact; 2. There is no sudden electrical change due to the Schmitt trigger. Output of the Schmitt trigger drives the clock signal to the flip-flop 87. of the flip-flop Output 18 toggles between zero voltage and positive supply voltage with each successive contact. The output When 18 is "on" at the positive supply voltage, this voltage limits the current to the LED. The LED is driven through a resistor 90.

The equivalent circuit of this circuit is incorporated into an integrated circuit to create an embodiment as shown in Figs. 2 and 3. May be used.

Figure 10 shows a two-electrode resistive sensing contact with a simple "on while touching" output 18. FIG. 2 is a circuit diagram of a sensitive LED. This circuit is suitable for integration on an integrated circuit and is shown in Figure 5. used as shown.

The circuit consists of complementary p-n type MOS field effect transistors arranged as an inverter. Consists of -98,99. Resistor 93 typically holds the input to the inverter high. and sets the output 18 low. The resistance of the finger through electrodes 51 and 52 is The inverter power is lowered so that the output 18 increases close to the positive supply voltage. Ru. This voltage also drives the LEDIO, but the current is limited by the resistor 90. limited.

In the above embodiment, the switching means of the touch-sensitive LED are all resistive. Operates with type voltage sensing inductive or capacitive pickups.

In another embodiment, the switch means is activated by a nearby object or a finger. A light sensor detects the light from the light emitting diode reflected into the plastic dome. It may be. Typically, the optical sensor is a photon sister or photon sensor. diodes, and the device includes more than one different color light emitting diodes. can be included. In this way, different switch states of the device will always turn on the light. Display can be performed while activating the light sensor by reflecting the light. 1 in the light emitting diode The device may emit invisible infrared radiation, in which case the device is turned off. It looks like it is.

The actual layout shown in FIG. 7 is used to implement a light sensing touch sensitive LED.

The diode 71 is a photosensitive photodiode and the second diode 72 is a light emitting diode. It is.

The light from the light emitting diode 72 is reflected to the photodiode 71 due to the proximity of the fingertip. Ru. The reverse bias current through the photodiode can be used as a switch signal . In this case using only one light emitting diode, the switch The status is displayed by different light intensities and flash speeds of the light emitting diode, but what In both cases, the light output is reflected from the fingertip to the diode to enable switch operation. It will be provided to the extent that it is possible.

Typically the photodetector is made particularly sensitive to light from the light emitting diode. Designed to be unaffected by changes in ambient lighting.

The photodetector is not exposed to direct light output from the light emitting diode and is not exposed to any changes in reflected light. It is equally sensitive to changes.

In the embodiment illustrated in FIGS. 11a, 11a and 11c, the touch-sensitive LE D100 is encapsulated in a dome U made of a suitable plastic material as in the previous embodiment. The device incorporates at least one light emitting diode encapsulated in a light emitting diode. The LED is powered Input terminal 16, ground terminal 17, and switch output terminal 18 in the case of the previous embodiment As well as, it contains. Also, the touch-sensitive light emitting diode is different from the previous embodiment. Connect to each terminal via a gold wire or whisker with the same capacitance as described above. It is also understood that the integrated circuit 189 includes an integrated circuit 189.

11a, 11a and 11C and the earlier embodiments. The difference is that the switch means is built into the integrated circuit and mounted on the top of the dome 11. stress/strain that is sensitive to changes in stress/strain caused by actual contact The sensor 130 is included.

An annular groove 1 to localize the stress/strain when the dome is in contact. 32 is arranged near the substrate of the dome, and a banana-shaped cutout 131 is placed inside the dome. A cavity is formed in the section to be evacuated. The combination of the air 5tst and the groove 132 is creating a force concentration on the stress/strain sensor and causing the stress/strain sensor to Ensure that the switch is activated.

As another alternative, the cavity could be replaced with a compression insert, in which case the stress /Has the effect of concentrating strain.

As shown in FIG. connected to a diode. Further, the integrated circuit is connected via a thin metal wire 125. Connect the metal output terminal 18 to the positive power input terminal via a similar thin lead wire 12B. , are connected. The stress/strain sensor 130 is of three basic types: resistive; It may be one of a resistive type element, a piezoelectric type element, or a capacitive type element. capacitive element In some cases, a diaphragm or cantilever can be etched into the surface of the integrated circuit. provide or attach; Strain in the material surrounding the integrated circuit causes the diaphragm to capacitance between the metallized conductor on the membrane or cantilever and the adjacent conductor of the integrated circuit. change. The capacitance change also provides a switch signal to other electronic components of the integrated circuit. It can be used as

Integrated circuit speedometers based on this capacitive principle are commercially available.

In the case of resistive elements, the resistive stress sensor is integrated into the surface of the integrated circuit. A set of resistors is incorporated into the integrated circuit. These resistors are When applied to the top of the dome, the strain is applied through the plastic of the encapsulating capsule. be exposed to The resistor changes in strain resistance, and this change occurs on the surface of the integrated circuit. detected and interpreted by other electronic components assembled into the Typically, These resistors are called piezoresistors because their resistance changes due to piezoresistance. It will be done.

The stress/strain sensor illustrated in FIG. 11 is incorporated on an integrated circuit. Applicable The sensor may be a piezoresistor, or a piezoelectric sensor may be a silicon The sensor area of the substrate on the chip is made of a piezoelectric material, such as crystalline aluminum nitride. It may also be fabricated by coating with a thin film layer.

In both of the sensor designs described above, the sensitivity of the device depends on the thin diaphragm or the series. By setting the sensor element area on the cantilever area of the conchip, It can be made bigger. To achieve this result, the thickness of the silicon wafer must be anisotropic etching and micro-machining techniques are used to reduce the surface area.

By this method, the bottom surface of the silicon wafer is etched to form a diaphragm. Or create a cantilever region.

When the piezoelectric stress sensor device is subjected to strain, charge separation occurs and the surface of the material Generates a potential difference across surfaces. The corresponding change in electrical resistance of a conductor or semiconductor is due to the piezoresistive effect. It is called fruit. Semiconductor resistors are integrated above or below the surface of an integrated circuit and Although it exhibits a resistive effect, it can be incorporated into a circuit that is sensitive to even the slightest change in the resistor to create a strain sensor. can form a sir. These resistors can be manufactured using conventional diffusion and doping techniques. Alternatively, a piezoresistive layer of microcrystalline silicon or the like is formed on the surface of the integrated circuit. It can be manufactured by A specific example of a piezoresistive stress sensor is a metal oxide It is a semiconductor (MOS) field effect transistor. When stress is applied to a semiconductor , a change actually occurs in the charge carrier mobility. MOS field effect transistor drive Lane current is proportional to the carrier mobility. In this way, the MOS field effect transistor The star is an integrated circuit specifically designed to act as a piezoresistive-based stress/strain sensor. incorporated into the road.

Additionally, the stress/strain sensor may be a piezoresistive bridge, an embedded piezoresistor or Incorporating other types such as piezoelectric thin film field effect transistors (PI-Fm) It is also understood.

In the configuration diagram shown in Figure 12, a piezoresistive stress/strain sensor element is incorporated. A touch sensitive LED is shown along with other components of the integrated circuit. As shown in Figure 12. The area of the block diagram is within the dotted line in FIG. 11a. The device has three electrical terminals. . The two nodes 16 and 17 are connected beyond the voltage difference of the external power supply, and the third terminal That is, the output lead 18 toggles between high and low voltage levels with each successive finger touch. Ru. The output lead switching operation is performed at a voltage level suitable for use with digital electronic equipment. The transition between bells is smooth and noiseless, so there are no electrical jumps.

The light emitting diode IO is controlled by the integrated circuit and the output lead is in a high voltage state. Power is supplied at some point. The light emitting diode is supplied with power via a constant current circuit Therefore, it can operate within a certain range of power supply voltage fluctuations.

The permissible power supply voltage variation range is 3 volts to 18 volts, and the output lead is 100 volts. Can supply amperage.

Figure 13 shows a connection using stress/strain sensors and a simple instant-on output. It is a circuit diagram of a touch switch LED. The part of the circuit within the dotted line boundary is the MOS field effect. Directly built into an integrated circuit using transistors 153, 154 and piezoresistor 150 You can also raise it. The circuit consists of complementary p-n MOs arranged as simple inverters. Consists of 3 field effect transistors. The piezoresistor 150 and fixed resistor ! 51 constitutes a voltage divider @The stress applied to this piezoresistor is an infinite amount of human effort. By changing the voltage of 1, the output voltage can be changed significantly. Also, the output lead drives the LE D 1'0 through the resistor 90. The resistor 90 Limit maximum current to LEDIO.

The stress/strain sensor built on an integrated circuit is manufactured by Motorola. Inc.) and Honeywell Corporation (HoneywCll). It is used to make type gas pressure sensors and can be purchased from these companies.

In all the above embodiments, the touch-sensitive light emitting diode is a visible light emitting diode. and suitable switch means. By selecting this combination of parts and integrated circuit, , it is possible to use the device for various operations.

Typical functions that can be built into the device using appropriate integrated circuit designs are: The output leads toggle between low and high ("on") voltages with continuous external contact.

2. A single light emitting diode can read the output of the device equipped with the light emitting diode. “on” when the output lead is at the positive supply voltage and when the output lead is at zero voltage. Controlled to display as "off" when

3. Two different color light emitting diodes are included in the device, one of which is green, for example. Indicates that the output lead is at zero voltage, the second one is e.g. red and the corresponding output Indicates that the lead is “on”.

4. The integrated circuit will turn the output lead "on" for 10 seconds and then "off" after each suppression. It can also be equipped with a timer function such as switching to ``.''.

5. The device is in a certain known state when first powered up.

6. When the device with power-down memory capability is removed from its power supply voltage. It remembers its functional state and resumes this state at the next power-up.

7. Analog voltage output with magnitude related to the time between touch detection times.

The output voltage level is expressed using the light intensity or flash speed of the light emitting device. It can also be shown.

Selection and design of an integrated circuit for detecting the functionality of the touch-sensitive LED that is the subject of the present invention. are known to those skilled in the art and are intended to be encompassed by the present invention in its broadest form. I understand.

The touch-sensitive light emitting diode of the attached application has the known functions of LED and Products that also include a contact control switch function using an embedded integrated circuit are considered non-custom products. give you the opportunity to purchase. The contact-responsive LED has already improved with respect to conventional LEDs. It combines the advantages that are known as well as those that occur in touch-sensitive switches. the contact Sensitive LEDs reduce the number of components required in electronic circuits and reduce the number of plastic components required. An integrated unit that is encapsulated and protected from hostile environments such as water and mechanical abrasion. Provide knitwear. One touch-sensitive LED can switch and display at one point. Therefore, a large number of touch-sensitive LEDs are arranged in an array on the panel. or mounted directly on the circuit board for automotive industry testing laboratory research, high-fidelity and Used in many applications such as consumer equipment, industrial and military applications, and sophisticated test and measurement equipment. used in the field.

In some embodiments, the touch-sensitive LED functionality is partially translucent and Connect a conductive touch-sensitive area or electrode using a material or coating that is conductive. It is increased by coming. In this way, the touch-sensitive conductive region is Large relative to the size of the plastic encapsulation capsule, the front of the component or The light output from the LED in the device may become invisible due to the , not covered by shadows. In this way, the LED is mounted behind the electrode. Moreover, since it is possible to see through the electrode, the overall size of the component can be determined. It increases the opportunity for miniaturization while at the same time producing clear visible light output.

of FIG 11A FIG 11 -A international search report ANNEX To THE INTERNATIONAL 5EARCHREP ORT ON

Claims (21)

[Claims] 1. A diode encapsulated in a plastic dome and a externally operable touch-sensitive switch means located within the dome made of The switch means includes an output to an external electronic device, and the diode includes an output to an external electronic device. A touch-sensitive light emitting diode characterized in that it provides a visual indication of the state of the switch means. code. 2. The switch means is a conductor disposed at or near the top of the plastic dome. The touch-sensitive light emitting diode according to claim 1, characterized in that the diode comprises an electric region. code. 3. The switch means is a resistance type contact switch, a voltage detection type contact switch, or a capacitance detection type contact switch. A claim characterized in that it is a type contact switch or a proximity detection type contact switch. A touch-sensitive light emitting diode according to scope 2. 4. The switch means includes a conductor extending across the top of the plastic dome. The touch-sensitive light emitting diode according to claim 2 or 3, characterized in that Do. 5. the top of the dome is covered with a conductive material electrically coupled to the diode; The touch sensitivity according to claim 2 or 3, wherein the touch sensitivity is reversed. type light emitting diode. 6. the top of the dome is a conductive plastic electrically coupled to the diode; The touch sensitive device according to claim 2 or 3, characterized in that the touch sensitive device is made of type light emitting diode. 7. One or more conductive regions are located immediately below the outer surface of the top of the dome. the electrically conductive region is coupled to the diode, and the switch means has a capacitance or The device according to claim 2 or 3, characterized in that it operates by inductive coupling. A touch-sensitive light emitting diode. 8. the conductive material on or within the dome of the diode is disposed behind it; It is characterized by being translucent or partially translucent with respect to the light emitted from the light emitting diode. The touch-sensitive light emitting diode according to any one of claims 2 to 7, characterized in that Ode. 9. said switch means being stress/strain sensitive disposed within said plastic dome; the stress/strain sensitive element such that external pressure at the top of the dome is applied to the stress/strain sensitive element; The touch-sensitive emitting device according to claim 1, characterized in that it is detected by a child. photodiode. 10. The stress/strain sensitive element comprises a resistor or a set of resistors. A touch-sensitive light emitting diode according to claim 9, characterized in that: 11. the stress/strain sensitive element is in the form of a piezoelectric or piezoresistive layer; The touch-sensitive light emitting diode according to claim 9, characterized in that: 12. the stress/strain sensitive element is a semiconductor piezoresistor or a transistor; and characterized in that part of its structure is a stress/strain actuated piezoresistor. The touch-sensitive light emitting diode according to item 9. 13. Particularly, the stress/strain sensitive element and the electrical circuit are incorporated into an integrated circuit. The touch-sensitive light emitting diode according to any one of claims 9 to 12, characterized in that Iode. 14. When the plastic dome is contacted with the top of the dome, the stress/ The method includes grooves arranged so that stress is concentrated in the region where the strain sensitive element is arranged. The touch-sensitive light emitting device according to any one of claims 9 to 13 characterized by: diode. 15. When the plastic dome is contacted with the top of the dome, the stress /Includes a cavity arranged so that stress is concentrated at the location of the strain sensitive element. A touch-sensitive light emitting diode according to claims 9 to 14, characterized in that: . 16. The stress/strain temperature sensing element is incorporated on an integrated circuit, and the shape or shape of the integrated circuit is is etched to increase the stress/strain sensitivity of the temperature sensitive element. 10. A touch-sensitive light emitting diode according to claim 9, characterized in that: 17. characterized in that the stress/strain sensitive element includes a capacitor or a capacitive element A touch-sensitive light emitting diode according to claim 9. 18. The optical switch means is connected to an object or fingertip in close proximity to the plastic dome. a light sensor disposed within the dome to detect light reflected from the dome; The touch-sensitive light emitting diode according to claim 1, characterized in that: 19. An integrated circuit is coupled to the diode and the switch means and to the positive as claimed in the preceding claims, characterized in that it is encapsulated in a tick dome. The touch-sensitive light emitting diode according to any one of items 1 to 1. 20. Claims characterized in that the light emitting diode is integrated on the integrated circuit. 17. The touch-sensitive light emitting diode according to item 16. 21. Substantially described herein with reference to and illustrated in the accompanying drawings, A touch-sensitive light emitting diode.