JPS63500554A - Electric circuit manufacturing equipment and method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Electric circuit manufacturing equipment and method field of invention The present invention relates to methods and apparatus for modifying and changing electrical circuits, particularly jumpers. Concerning the structure and manufacture of printed circuit boards and jumper wires using wires. present invention It is also a device for holding and cleaning hot irons used in circuit manufacturing or modification. Regarding location and method. This patent application is filed under U.S. Patent Application No. 7, No. 260, July 1985. This is a continuation-in-part of No. 59.467.

Foreground of the dawn Printed circuit boards often have errors or require changes due to circuit improvements Sometimes. Changes to the circuit board are made by changing the fabrication operations on it. I can do it. However, this is very expensive. The changes are quite extensive. Manually attaching jumper wires to selected locations on a circuit board is expensive even if He is extremely skilled in terms of use. New connections are generally made with exposed jumper wires that are insulated. Place one end of the wire into the plated hole on the circuit board and thread the wire along the intended path into the circuit board. by gluing it to the surface and placing the other exposed end into the other plated hole. It will be done. The circuit board is then passed through a flowing solder bath to plate the wires and the ends of the elements in the holes. Solder all the children. Alternatively, the terminals may be soldered by hand.

The circuit board surface to which jumper wires are glued is often soldered, usually epoxy resin. Coated with resist material. Glue jumper wires to these surfaces. There are various types of MLL agents, including silicone rubber, acrylic resin, and epoxy resin. Including fats, hot melt adhesives, etc. These adhesives are applied by hand. I applied the adhesive Traditional methods for this have various drawbacks. e.g. properly securing the wires to the circuit board the wire for a sufficient period of time to allow sufficient adhesive drying or cooling to occur. must be retained. Generally this is time consuming and requires sufficient cooling or If there is no drying time, the adhesion will be poor.

Another drawback of the traditional method is that it is cluttered. This includes setup and cleaning. The cleaning time increases labor costs. Also, conventional methods are generally It's difficult. This further reduces worker productivity.

A pot placed near the work area where hot melt adhesive is used, if used. It is melted in the pot and removed from the pot when needed. yes to this technology There are some problems. One of them is to melt the ingredients in the pot every time in preparation. It requires a considerable amount of time each day.

Also, adhesives cannot be left in a molten state for long and must be replaced frequently. Must not be. In other words, the glue does not cover the pot inside the pot very long.

Some conventional adhesives are harmful to use or emit harmful odors.

Therefore, they pose a health risk to workers and require special safety measures and/or equipment. It will be necessary to use a

Another problem with using hot melt adhesives is that the tools used to apply the adhesive may not stick to it. Frequent cleaning is required to remove adhesive build-up. this is A cloth can be used, but the cloth will get dirty with the adhesive and must be replaced frequently. The process is difficult because it takes a lot of time to find a clean part of the cloth. It's slow and inefficient. Also, if using a hot iron to melt the adhesive, use a cloth may burn or burn if it comes into contact with it.

A similar problem with cleaning when using a hot iron occurs when using a soldering iron. Occurs when Wet the tip of the iron to wipe off excess solder and flux. A sponge is commonly used. While scrubbing, the sponge dries and carbonizes. Must be replaced relatively frequently.

For insulation, use polytetrafluoroethylene (e.g. Denipon's Teflon). Problems with jumper wires that have a thin coating of high-temperature plastic The problem is that they are not sufficiently resistant to cutting and abrasion. this is it The integration of circuits using these is inferior.

Purpose of invention SUMMARY OF THE INVENTION It is an object of the present invention to overcome the above-mentioned problems and disadvantages of a circuit element such as a printed circuit board. An object of the present invention is to provide an improved method for fixing jumper wires to a wire. other The purpose is to provide an improved wire for use in such methods and To provide improved circuit elements, such as printed circuit boards, using Ru.

A more specific object of the invention is that it is relatively easy and quick to use, and A relatively efficient method for modifying or changing circuits at a reasonable cost and provide wires.

Another object of the invention is that cleaning can be done relatively quickly and easily and that new contaminants can be cleaned up relatively quickly and easily. Non-stick surfaces can now be obtained quickly and easily using adhesives or solders. of a hot iron used to melt or impart circuit manufacturing materials such as An object of the present invention is to provide a device for use in tip cleaning. A more specific purpose is hot iron. By providing a relatively simple and inexpensive purification device that also functions as a holder for Ru. A further objective is to develop equipment and devices that reduce the combustion of purification materials during purification. The purpose of the present invention is to provide purification materials for use in such equipment.

Another object of the invention is to provide a method and apparatus for manufacturing the improved wire of the invention. It is to be.

Summary of the invention According to one aspect of the invention, a wire to be secured to a circuit element such as a printed circuit board The ear has an inner insulating coating and an outer adhesive coat, preferably a hot melt adhesive. It consists of a conductor with a ring.

In one embodiment of the invention, the wire is precut to the desired length and insulated at both ends. The body is stripped to form a pre-finished jumper wire. This jumper The layer is pre-bent into a desired shape and ready for use.

In use, both ends of this wire are electrically connected to the terminals of the circuit element and the wire is The ear is fixed by simply heat-pressing its adhesive coating to the surface of the element. Set.

This adhesive coating applies the right amount of contact to all spots along the entire length of the wire. Provides adhesive and as a protective layer for the wire's relatively thin insulating coating It serves two purposes: acting.

Preferably, the adhesive straddles the wire and presses it against the surface of the circuit element. The surface is heated by a heating device like a hot iron with a curved tip. Being forced.

This adhesive coating and the tip of the iron allow a relatively small amount of adhesive to be applied to the hot iron. By melting the adhesive in a relatively short time, the adhesive can be melted at a similar speed. Dimensioned so that it can be cured.

Regarding pressing down on the wire, the hot iron touches the circuit board surface and localizes it. It is best to heat it.

For this reason, the tip of the hot iron is deeper than the diameter of the insulating layer but deeper than the diameter of the adhesive. It has a long narrow groove.

Adhesives often have relatively high melting temperatures, which can significantly heat the circuit board. Adhesive in bonding jumper wires to circuit boards when passed through flow soldering equipment Softening is minimal. Also, epoxy or Relatively high iron to ensure good adhesive adhesion to most of other materials It is best to use the

The wire insulation should be able to withstand the temperatures of this heating device without melting. be. Therefore, this insulation is made of thermosetting material, i.e., it does not soften upon reheating. It is preferable to make it from free materials. polytetrafluoroethylene (PTFE) (e.g. Irradiation-crosslinked polymers such as Dupont's Teflon) are suitable for this insulating layer. It is a thermosetting material. PTFE also works well with the adhesive of the present invention at high temperatures in hot irons. It can also withstand coating processes.

Adhesive coating is done by heating the adhesive container to a liquid state and passing the wire through it. A wire with a coating of PTFE is applied by passing it through a die.

Preferably, the surface of the PTFE insulation is etched to improve adhesion of the adhesive coating. the thickness of the adhesive coating by passing the wire vertically through the container. Make it uniform.

According to the present invention, the problem of cleaning the tip of a hot iron can be easily renewed. The solution is to provide a cleaning element with a cleaning surface. this The surface removes the outer layer of the laminated cleaning element to expose a new layer. It can be easily replaced with a new one.

A cleaning element suitable for use on the tip of a hot iron with a groove is preferred. Suitably, it is made of multiple layers of fibrous material sized to fit within the groove. Preferably this The cleaning material is preferably wound in the form of a spool. Ordinary cotton thread is excellent And it is an inexpensive twisted fibrous material. This is simply wound onto a spool It is then undone to expose new layers as needed.

Alternatively, especially for cleaning soldering irons, this cleaning surface can be used with cloth tape. This cloth tape has a pressure-sensitive adhesive backing to remove the tape from the roll. Peel it off and cut it off to reveal a new surface.

A combination of iron holder and iron cleaner is also provided.

If you need to moisten the cleaning material with water, provide a water reservoir and use it to moisten the cleaning material. the coating material is in contact with each other.

This cleaning material should not burn or burn when it comes in contact with a hot iron. Treated with flame retardant material.

Various other objects, advantages and features of the invention will become apparent from the following detailed description and drawings. or it will be readily apparent from them.

Brief description of the drawing In the drawing, FIG. 1 is a perspective view of the insulated wire of the present invention.

2 is a side view of a heating device used for the wire of FIG. 1; FIG.

Figure 3 shows the use of the wires of Figure 1 and the heating device of Figure 2 to repair printed circuit boards. FIG.

Figure 4 is an enlarged side view of the tip of the heating device in Figure 2 in contact with the wire in Figure 1; It is.

Figure 5 is a side view similar to Figure 4 after the tip of the heating device has separated from the wire. .

6, 6A and 6B are enlarged side views of the embodiment of the tip of the heating device of FIG. Figure 3 shows a top view, a bottom view and an end view, respectively.

Figure 7 shows how the tip of the heating device in Figure 6 melts the adhesive covering the wire in Figure 1. FIG.

FIG. 8 is an enlarged perspective view of another embodiment of the tip of the heating device of the present invention.

9 is an enlarged side view showing the tip of FIG. 8 in contact with the wire of FIG. 1; FIG.

FIG. 10 is an enlargement of another embodiment of the tip of the heating device of the invention in contact with the wire of FIG. It is a large side view.

Figure 11 shows the tip of Figure 10 being pressed against the wire of Figure 1 and removed. FIG. 10 is a side view similar to FIG. 9 showing the state after the operation.

FIG. 12 is an enlarged view of another embodiment of the tip of the heating device of the present invention.

FIG. 13 is a bottom view of the apparatus of FIG. 2.

Figure 14 shows an insulated wire coated with an outer coating of hot melt adhesive. 1 is a schematic perspective view of a device for monitoring.

Figure 15 shows the thermal melting of 2Fi used to coat the wire of the present invention. 1 is a graph showing viscosity versus temperature characteristics for adhesives;

FIG. 16 shows an embodiment of a device for holding and cleaning a heating device according to the present invention. FIG.

FIG. 17 is a cross-sectional view taken along line 17--17 in FIG. 16.

FIG. 18 is a perspective view of a holder/cleaner of another heating device.

FIG. 19 is a cross-sectional view taken along line 19--19 in FIG. 18.

FIG. 20 is a partially schematic diagram showing the cleaning action of the cleaning device of the present invention. FIG.

FIG. 21 is a sectional view of another embodiment of the holder/cleaner.

FIG. 22 is a perspective view of the materials used in the apparatus of FIG. 21;

FIG. 1 shows a jumper wire 10 of the present invention. Wire 10 is an inner conductor 12, insulated It consists of a coating 14 and a hot melt adhesive coating 16 thereon.

Figure 2 shows the handle 17, receptacle 18, electric heating element 26 and special 2 shows an electrically heated iron 19, like a soldering iron, with a tip 23 of a generally shaped shape. No. As shown in Figure 6-7, this tip 23 is flattened in the shape of a screwdriver. . The lower edge of the tip has a length that fits outside the wire 10 so that the tip surrounds the wire. A groove 41 (Fig. 6-6B) is provided so that when the tip is pushed down by the wire, the groove 41 (Fig. 6-6B) As shown in Figure 7, the side parts 44 on both sides of this groove 41 span the wire. There is.

In FIG. 3, a jumper wire 11 having the structure of the wire 10 in FIG. 1 and a jumper wire 11 having the structure of the wire 10 in FIG. Heating device 19 is shown in use for repairing or modifying printed circuit 28 .

First, if jumper wire 11 is not pre-cut to the proper length, then The insulation on one end of the layer 10 is stripped and bent, and the plated holes 25 in the circuit board 28 are removed. will be deducted. The heated tip 23 of the device 19 is then applied to the wire 10 in the vicinity of the hole 25. It is pressed down and held there for 1-2 seconds before being released. This wire then bent to make wires 13 and 14, and hot iron 19 is turned into wire again. A similar method is used to secure it to the surface of circuit board 28 at appropriate points along the line. Then Jean When the correct length of power wire is determined, cut the wire accordingly and disconnect the other end. Peel off the edges, bend and insert into the other plated holes 27. then jumper wire Both ends of the soldering iron or gun or preferably all of the connection points on the circuit board 28 The holes 25 and 27 are soldered using a flow soldering device that simultaneously solders the holes 25 and 27.

The jumper wire 11 must be cut to an appropriate length in advance and the insulation removed from both ends. In this case, the insulation stripping and cutting steps described above are not necessary. Also, wire point 13.1 5 and the bends at both ends can be made in advance with a bending die. In that case The user only needs to attach the wires to the circuit board.

29. The printed conductor portions on the circuit board 28. Shown at 31°33. conductor 29 and 31 is electrically connected to jumper wire 11 through plated holes 25 and 27. however , the jumper wire 11 has no insulation on the wire and no conductor on the circuit board. electrically due to the epoxy solder resist coating on top of at least some crosses the conductor 33 and others without making contact.

The tip 23 heats the hot-melt adhesive 16 and melts it rapidly, causing it to flow as shown in FIG. and adhere to the surface of the circuit board 28. Some of the adhesive cools quickly to form a bond do.

Then, after being held in place for a short period of time, the tip 23 is removed and the remaining adhesive is removed. Cools to form a fixed bond between the wire and the circuit board surface.

The jumper wire process and equipment described above are easy to use and are further described below. Understand the benefits of

A. Wire structure The wire 10 of FIG. 1 has an inner conductor 12, which may be, for example, a copper wire with a diameter of about 0.25 mm. include. It has very thin (approximately 0.005 to 0.013 + sm) silver on its outer surface. It may have plating.

Insulator 14 is a thermosetting heat resistant material to withstand the high temperatures encountered during use of the present invention. Preferably it is a polymer. A suitable material is polytetrafluorocarbon cross-linked by irradiation. There are polymers such as ethylene (PTFE), polyvinyl chloride and polyvinyl chloride. It may also be a thermosetting polymer such as a polyolefin such as ethylene. like that Insulating layer 14 is typically about 0.13 mm thick.1. and in the preferred embodiment The outer surface of the adhesive layer 16 is coated with e.g. Etching chemically, such as with a solution. The thickness of the insulating layer 14 is preferably It is approximately 45% to 55% of the diameter of body 12.

It is sufficient as long as it is thick enough to make a portion. For example, an adhesive layer of about 0,1 degree thick, In other words, it is preferable that the thickness be approximately equal to the thickness of the insulating layer 14. For the reasons mentioned below, A suitable hot melt adhesive is Hysole type XPA-1245 or type 7901. It is. These materials are polyamide sold by Dista Corporation. It is de.

B. Heating device The heating device 19 in FIG. 2 may be a conventional soldering iron, but the tip may be replaced with a special one 23. ing.

The device of Figure 2 is used to bend the ends of the wires in a desired manner in order to secure them to the circuit board at the contact points. It can be used to guide the wire by pressing it against the wire near the I can do it. When this iron is used to press down the wire, the wire rotates. The point of contact of its tip with the road plate 28 is bent to cause the wire to change direction. this is This is desirable because the wire can be bent and fixed at the same time.

A preferred tip 23 is shown in Figures 4-7. As shown in Figure 6, this tip has one end. There is a screw 35 in the receptacle 18 (FIG. 2), which is screwed into a screw hole in the receptacle 18 (FIG. 2). that Therefore, the tip 23 can be used with many different shaped eyes, such as soldering irons with interchangeable tips. It can be used for Ron. The tip 23 is long and thin at its lower end and contains many elements and Alternatively, it facilitates access to areas of circuit board 28 where conductors are located.

The tip 23 is cylindrical at the upper threaded end 35 and points outward as shown in FIG. and with the tabers facing inward as shown in Figure 6B. . Taber's angle θ is V4 m.

The metal at each end of groove 41 is removed to create a rounded edge 37, as shown in FIG. . This allows the tip 23 to be tilted while using one of the edges as a pivot. Press the ear down and place one end of the melted adhesive so that the entire tip touches the wire. It can cool and harden faster than when you touch it. This rounded edge 37 prevents metal from penetrating the wire insulator 14.

The depth of the groove 41 is preferably 65% or more of the total set of wires 10 with the adhesive layer intact. is the diameter of the insulated wire plus the thickness of the adhesive layer. be.

Groove 41 forms a leg 44 (Fig. 7) having a lower end 43 (Fig. 6).

When the tip 23 melts the adhesive 16, the lower edge of the leg 44 forms a circuit as shown in Figure 4.7. This corresponds to the epoxy solder resist coating 47 on the plate 28. This is the circuit board material Apply some heat to promote adhesion. Figure 7 shows that this tip 23 is connected to the melted adhesive. This adhesive extends outward from leg 44 as shown at 45. Ru. This diffusion effect appears to promote rapid cooling and hardening of the adhesive.

The preferred temperature range for the tip 23 when using High Sole XPA adhesive is approximately 288°C. to 343°C. A temperature of about 316°C is preferred.

In most cases, you only need to iron for 1-2 seconds.

One reason for this speed is that the mass of melted adhesive is This is because it is also small. The adhesive coating fills the space between the legs 44 and the wires 10. Thick enough to fill with adhesive or slightly more. do it. Another reason is that the adhesive extends over a relatively long section of wire, and therefore The holding force is suitable for securing the wire to the circuit board without holding the wire down. The adhesive quickly cools and hardens by removing the iron. This is because it covers a large area so that it can

Another tip 22 for a heating device is shown in Figure 10.11.

The tip 22 is cylindrical and surrounded by a coil spring 24, and the above configuration Before or during melting of the adhesive under normal conditions that do not result in sufficiently rapid cooling. and the spring then forces the wire against the circuit board. One end of the spring 24 is heated It is fixed to the heating element 26 (FIG. 2) of the device 19. At the other end this spring extends beyond the end of tip 2.

As shown in FIG. 11, spring 24 pushes wire 10 downwardly against circuit board 28. Put on. When heating device 19 is pushed down further, spring 24 causes tip 22 to touch the wire. Further compression is applied to heat a portion of the adhesive layer 16 when pressed.

After the adhesive has melted, the heating device 19 can be held free from the wire as shown in FIG. the tip 22 is lifted off the wire, but the spring 24 rotates the wire. Leave it pressed against the road plate 28. This allows the wire to be connected to the circuit board 2 due to its elasticity. To allow time for the adhesive 16 to cool and harden without separating it from the adhesive 8.

Another tip 32 of the heating device 19 is shown in FIG. The tip 32 has three spherical legs 34 has. As shown in FIG. 9, these legs have their tips 32 pressed against the circuit board 28. Allows you to straddle the wire when you are thrown. These legs also undergo a gluing process. It also serves to properly position the tip over the middle wire 10.

Another tip 40 of the heating device 19 is shown in FIG. 12.13.

The tip 40 has the same V as the tip 23 described above. One end (not shown) has a screw. and screwed into the hole of the hexagonal member 38. This member 38 serves as the heating element of the device. Screwed in.

The tip 40 has a cylindrical groove. The groove 42 has a tip pressed against the circuit board 28. It separates a long leg 44 which acts as a leg to straddle the wire 10 when it is inserted. No. As in the embodiment of Figures 6-7, the tip 40 straddles the wire 10 and connects it to the circuit. Pressing against board 28 locally heats the circuit board to provide better adhesion. spring 24 is not necessary. Grooves 42 align with the two corners of hexagonal member 38.

This allows the user to match the temperature of the wire and a normal flowing solder bath by giving the user a matching reference surface. is about 260°C or slightly higher. With normal flow soldering process For a short period of time, the metal in the bath is only exposed to the underside of the printed circuit board, i.e. the side without any elements attached. ゛Contact. However, the upper portion of the circuit board often exceeds approximately 149°C. becomes the temperature.

Therefore, the melting temperature of the adhesive should be set so that the jumper wire does not loosen during flow soldering. Should be as high as possible, but at least about 149°C to about 177°C . Therefore, the two adhesives suitable for use in the present invention have the highest melting points and Surface of epoxy circuit board filled with lath and epoxy solder resist coating It has the ability to adhere to adhesive materials.

The approximate viscosity-temperature curve of the high sole adhesive suitable for use in the present invention is It is shown in Figure 5. Both have the advantage that their viscosity is relatively high at temperatures just below the melting point. be.

Standard ring and ball testing per ASTM E28-67 for High Sole 7901 The melting point determined at is approximately 171°C. Similarly, the melting point of XPA1245 is The temperature is approximately 200°C. XPA1245 has a high melting point and temperatures above the melting point. It is suitable because of its high viscosity. However, for example, about 288℃ Adhesives with higher melting points are better.

The maximum melting temperature of adhesives is actually not critical.

However, a tip temperature of at least about 260°C to about 343°C is sufficient for good adhesion. It has been found that adhesives and solders should be used to ensure compatibility. child Higher tip temperatures can be used, but there are problems. Therefore, the melt temperature below about 288°C Melting point is desirable.

The activity-temperature curve in Figure 15 is a guideline, and the actual values may differ slightly. Ru. Therefore, the precisely defined melting point of each material determines the adhesive's holding power at high temperatures. It should be used as the most reliable guide.

D. Adhesive coating process Figure 12 is a device for coating the wire 10 in Figure 1 with hot-melt adhesive! 48 is shown. The adhesive-free wire 60 preferably has PTFE insulation, which Etched in a corrosive chemical solution to promote adhesion of adhesive layer 16 to edge layer 14. be tinged. Well known solutions can be used for this etching process.

Device 48 has an adhesive supply reservoir 52 essentially driven by a variable speed motor (not shown). It consists of a melting pot 50 and a die 66 through which a wire 60 is passed vertically.

The adhesive is placed in the pot 50 in the form of pellets and electrically heated to form the part. It is melted by ta. The melted adhesive is monitored by a thermocouple 54 and reaches approximately 204 m The water is stored in a reservoir 54 kept at a constant temperature of .degree. Reservoir 52 is a coating chamber It also acts as Open the tube 56 and send nitrogen gas into the pot 50 to remove the melted contact. Suppresses oxidation of adhesive.

A wire 60 without adhesive is placed on the supply reel 58 and passed through the guide pulley 62 to the reservoir 5. Leads to 2. The wire 60 passes vertically through the guide 64 and into the sump 52 where it melts. coated with adhesive. The wire 60 then exits the reservoir 52 to determine the thickness of the adhesive layer. A determining die 66 is passed.

The orifice size of the die 66 changes the thickness of the adhesive and allows wires of various sizes to be produced. Adjustable to fit.

After coating, wire 10 is moved a sufficient distance to cure the adhesive.

This distance is determined by adhesive thickness, wire speed, and ambient temperature. Then the wire 10 is passed through a precision pulley 70. This pulley 70 is integrated with a counter mechanism 71 This counter is used to measure the length of coated wire. Count the number of revolutions of the pulley 70.

Next, the wire 10 passes through the level winder lift 2 and is evenly wound around the winding reel 74. It will be destroyed. Reel 74 is driven at a variable speed to speed wire 10 through device 1f48. Pull at a relatively constant speed.

By passing the adhesive-free wire 60 through the die 66 vertically rather than horizontally, gravity Non-uniformity in the adhesive coating caused by this is eliminated. This results in an even coat of adhesive. can be obtained economically.

A device 76 for cleaning the tip of the heating device 19 is shown in FIG. 16.17. . The device 76 also acts as a holder for a heating iron.

Cleaner/holder device f! 76 is made of aluminum or other suitable metal. Has a frame. This frame has a base plate 78 and an upwardly curved end. 82, a cleaning device 79, a bolt, and a washer. an iron holder 88 fixed to the base plate at one end by a combination 89; Become. The cleaning device *79 includes a spool 80 and a long thread such as real cotton thread. The fiber material is sown in multiple layers. .

The spool 80 has a tapered helical spring forming a holder 88 and the end 8 of the base. The tip 23 is shaped like a wedge between the upper edge 85 of the spool 80 and the upper edge 85 of the spool 80. release the spool into a position such that it is scraped across the cleaning surface 84 to be Hold it in place.

The spool 80 has a cylindrical core and a flange 9 for holding the thread wound on the cylindrical core. There are 2. The spool 80 may be, for example, a normal fishing spool. This is the edge The upper edge 85 of the portion 82 is retained by tabs 83 at both ends.

Preferably the cotton thread is treated with a flame retardant solution. A suitable solution is borax and boric acidff1j It is an aqueous solution containing 2% of each in l.

The cleaning process is illustrated in FIGS. 17 and 20 and FIG. 16. The tip 23 is It is moved over cleaning surface 84 in direction 87 (FIG. 17). in this direction The groove 41 is aligned with the thread 106 to remove residual adhesive, as shown in FIG. The thread 106 enters the groove 41. The lower edge 43 of the leg 44 and the outer surface of the leg are also cleared with the adjacent thread. -ning.

Of course, the gap 84 can be used to melt the adhesive as shown in Figures 8-13 regardless of the shape of the tip. The tip of the iron can also be cleaned.

According to the invention, a new cleaning surface is applied to the surface in one of two ways. It will be done. First, rotate the spool 80 slightly to expose a clean surface of the surface 84. I can do that. The second method is used when there are no more clean surfaces. Sunawa The thread is then unwound on the spool until a new layer of thread emerges. Either method Easy and quick (can be done)

Other cleaning surfaces can be used. For example, Figure 21 shows the back of relatively soft absorbent cloth. 9 shows a cleaning surface formed by a roll 97 of adhesive tape with dents. nine If a lean rubbing surface is required, the user can rotate the spool 8o or use the tape 97. It is possible to peel off one layer of the material. Above the base part! 185' is the table be sharpened or also serrated to facilitate cutting.

FIG. 22 is an enlarged cross-section of the tape 97 of FIG. 21.

The adhesive is designated at 99 and the soft cloth backing is designated at 101. This format The tape is used to indicate support for heels, knees and other body parts. This is the so-called ``athletic'' tape. Tape 97 won't unravel. Since an adhesive is required, this adhesive can be relatively weak. The cloth 101 is It should be treated with flame-retardant materials as mentioned above.

The embodiment of the invention shown in Figure 21.22 cleans the tip of a soldering iron. It is suitable for Use the adhesive-adhesive iron shown in Figure 2-7 with a tape-like cream. If you try to clean using the cleaning surface, the groove at the tip will be connected to the tape 97. Cleaning is particularly good when using Roy cloth. The edge of this cloth is around the roll. The cloth can be rubbed in the direction of 87 in the light.

The cleaning surface on the soldering iron should be wet. Therefore, water reservoir 9 3 to the base plate 78 (Fig. 17) so that the roll of yarn 80 is immersed therein. I will do it. The thread is always wet because water is absorbed by all the fibers of the thread from the reservoir 93. It will remain as it is. A similar reservoir 93 can be used with the tape of FIG. Ru. If desired, soak the thread before placing the thread spool on the base plate 78. A flame retardant chemical substance may be added to the reservoir 93 instead.

If necessary, the water in the reservoir 93 can be filled with a well-known water replenishment device such as that used for goldfish, small birds, etc. You can also replenish it automatically using . With such a device, the inlet tube 95 can be You can then add water.

An improved cleaner/holder arrangement 94 is shown in Figures 18.19. Equipped with f94 is V Consists of a single aluminum plate that is perforated and bent to create a U-shaped structure. Has a frame. This frame has a lower base portion 96, an angled front portion 10 0 and top 98. The upper part 98 has a rectangular hole 102, which is connected to the spool 8. 0, but other dimensions are the flange of spool 80. Somewhat smaller than the diameter of 92. Due to the weight of the spool, the edge of the flange 92 becomes the hole 10. Pressed against the edge of 2. This moves the spool along its surface while the tip crosses its surface 84. Acts as a brake to hold it in position.

Front portion 100 has a circular hole into which a long cylindrical bushing 86 fits. Bushin The clip 86 is made of heat-resistant material and has a circular retaining clip 1 as shown in FIG. 04 to fix it in place. Bushing 86 is used when heating device 19 is not used. It acts as a holding device to hold it when it is needed.

In the embodiment shown in Fig. 16.17.21.22, a water reservoir 93 is also provided for cleaning. You can keep the playing surface wet. In addition, the shape of the tape in Figures 21 and 22 is Can be used with the holder shown in Figure 8゜19.

! In each of the embodiments of FIGS. 16-21, the hot iron is pressed against the spool 80. baseplate to prevent the device from slipping on the surface it stays on while It has rubber feet 19 on the seat.

Although the present invention has been particularly shown and described with respect to preferred embodiments, Various modifications are possible within the scope of the invention. The attached claims are as stated above. and various other modifications.

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Claims (59)

[Claims] 1. an electrical conductor, an insulating coating thereon, and an electrical conductor over the insulating coating It usually consists of a coating of a solid, inert adhesive; activated by applying a tool at each of multiple positions along the length of the A conductive wire that is attached to a substantially flat support surface at a position. 2. Claim 1, wherein the adhesive is a hot melt adhesive and the tool is a heated tool. The wire according to item 1. 3. Claim 1, wherein the support surface is an epoxy resin surface of a printed circuit board. wire. 4. The adhesive is a polyamide resin having a melting point of about 149°C to about 288°C. The wire according to claim 2. 5. 2. The adhesive has a melting point of about 171°C to 204°C. Wires listed. 6. Claims: The thickness of the adhesive coating is approximately equal to the thickness of the adhesive. The wire according to item 1. 7. The pressure of the adhesive coating is applied to the application that spans and surrounds the wire. the area between the insulated wire and the flat surface when a material is applied thereto; The wire according to claim 1, which is substantially sufficient to satisfy the requirements. 8. The insulating coating can be removed relatively easily and the adhesive coating can be removed relatively easily. The heating tool is heated for 1 to 2 seconds at a temperature considerably higher than the melting point of the adhesive. The second contact causes the wire to melt and create a bond between the wire and the surface. The wire according to claim 2, wherein 9. Insulation stripped at at least one end with the inner conductor, precut to a predetermined length on the wire with the coating and the remaining insulating coating on this wire an adhesive coating, and this adhesive has multiple Activated by applying a tool to the location, the wire is activated to a substantially flat surface. Prefabricated jumper wires ready to be glued. 10. The insulation on both ends of the wire is removed and the wire is placed on the flat surface. so that it is pre-bent into the desired shape so that it follows the desired path when attached to a surface. A jumper wire according to claim 9. 11. The adhesive is activated by applying a heated tool. The wire according to claim 9. 12. The wire according to claim 11, wherein the adhesive is a hot melt polyamide adhesive. I don't like it. 13. A conductor, an adhesive surrounding the conductor, and an adhesive that can be bonded to a non-adhesive surface by heating. a hot melt adhesive coating surrounding said insulating layer to protect said insulating layer; The layer is polytetrachlorethylene (PTFE) to promote adhesion with the adhesive layer above. is etched in a corrosive solution in order to have a lower melting point than the above insulating layer. A wire that looks like it's in your possession. 14. 12. The adhesive layer has a melting point between about 149°C and about 288°C. The wire according to item 1. 15. 7. The adhesive layer has a melting point between about 171°C and about 204°C. The wire according to item 1. 16. 2. The insulator layer having a thickness equal to about 45% of the diameter of the conductor. The wire according to item 1 of the box. 17. Claim 1: The adhesive layer has a thickness approximately equal to the thickness of the insulating layer. Wire as described in section. 18. Prepare a wire made of a conductor with an insulating layer and an adhesive layer on it, and Connect both ends of the body electrically to the circuit member and apply an applicator to the above wire to apply it. The adhesive is usually inert and is not suitable for application. an electrical circuit member that is activated by applying a licator to it. How to fix wires. 19. 19. The method of claim 18, wherein the preadhesive layer comprises a hot melt adhesive. 20. 19. The method of claim 18, wherein said support is a printed circuit board. 21. The hot-melt adhesive is heated and compressed across the wire. Claim 1, further comprising the step of pressing the circuit board with a heating device having an end. The method according to item 20. 22. The tip has a long groove over the wire, and the depth of the groove is equal to the depth of the insulating layer. The method according to claim 21, wherein the diameter is larger than the diameter and smaller than the diameter of the adhesive layer. . 23. by providing a heated member at a temperature of about 288°C to about 343°C. 20. The method of claim 19, including the step of heating the adhesive layer. 24. The adhesive layer is heated by a heating device having a heated tip and a spring element. Pressed against the printed circuit board, the spring element has the heated tip facing the wire. When the wire is moved and comes into contact with it, it presses against the wire and the heated tip touches the wire. Claims in which the circuit board continues to be pressed against the circuit board when being pulled back from the The method according to paragraph 20. 25. a stage for electrically connecting both ends of the conductor to terminals of the circuit board by soldering; 21. The method of claim 20, comprising a floor. 26. Has a non-printed wire interconnect that surrounds the conductor. an insulating layer surrounding the conductor over substantially the entire length of this layer; electrically connected to the printed circuit board at both ends and bonded between the ends by the adhesive layer. A printed circuit board that is mechanically connected to a printed circuit board. 27. 23. The printed circuit board of claim 22, wherein the adhesive layer is a hot melt adhesive. . 28. Claim 2, wherein said adhesive layer has a melting point of about 149°C to about 288°C. The printed circuit board according to item 3. 29. Claim 24: The conductor is electrically connected at both ends by solder. Printed circuit board as described. 30. 24. The printed circuit board of claim 23, wherein said insulating layer comprises a thermosetting material. . 31. comprising a handle, a heating element, and a heating tip extending from the heating element. , the tip has a long bottom side in one direction, and has both ends to straddle the wire during heating. An adhesive-coated insulator with long grooves forming legs on the sides. Heating device for heating edge conductors. 32. The heating element maintains the tip at a temperature between about 280°C and about 343°C. 2. The heating device according to claim 1, wherein 33. The long groove at the tip is larger than the diameter of the insulator and smaller than the diameter of the adhesive layer. the leg has a small depth, and the tip is attached to the wire after the adhesive in the vicinity has melted. such that it has dimensions such that it touches the flat surface on which the wire is placed while The heating device according to claim 1. 34. The tip has a rectangular cross section with one side larger than the other, and the groove is formed on the longer side. The heating device according to claim 1, wherein the heating device extends along the sides. 35. Said tip has a coil spring coaxial therewith, and said spring extends forward on said tip. Claim 1 fixed to the heating device and extending beyond the tip. The heating device according to item 31. 36. The edges of the groove are beveled so that the tip can be attached to the wire without damaging it. The claim is capable of pivoting around one of said edges while being placed on the wire. The heating device according to claim 31. 37. a support and a plurality of fibers mounted on the support and extending in substantially the same direction; a cleaning surface consisting of a shaped thread; For cleaning the tip of a heated iron for melting solid materials equipment. 38. comprising multiple layers of said yarn, each top layer being removed from the layer below it to create a new 38. The apparatus of claim 37, wherein the apparatus is adapted to expose a large cleaning surface. 39. The support member is shaped to hold a thread of fibrous material wound therearound. and the cleaning surface has one winding over the shape as a plurality of turns. 39. The device of claim 38, comprising a layer of cotton thread. 40. The holder includes a friction brake for suppressing movement of the support member. The device according to item 39. 41. the iron has a grooved tip for melting hot melt adhesive on the wire; Said thread has at least one material pressed into said groove with said tip aligned therewith. Claim 3 has dimensions such that it fits into the groove when being basted. The device according to item 7. 42. 38. The apparatus of claim 37, wherein said thread includes a flame retardant material. 43. The flame retardant material is from the group consisting of boric acid, borax and combinations of both. 43. The device of claim 42, which is selected. 44. 40. The apparatus of claim 39, wherein said support member is a cylindrical spool. 45. A base and a holding member attached to this base for retention when not in use. a cleaning device in the form of a fibrous material disposed thereon, and a cleaning device for cleaning the same. It consists of a grip device for holding the iron stationary when it comes into contact with the iron during work; The textile material is movably mounted on the base for cleaning the iron. Hot iron support and cleaning structure. 46. The holding member is an elastic device mounted on the base, and the holding member is an elastic device mounted on the base. A lip device presses the fibrous material against a portion of the base to act as a friction brake. Claim No. 1 consisting of the above-mentioned holding device adapted to operate The device according to item 53. 47. the fibrous material is on a rotatable spool and the gripping device is in a hole The hole is slightly smaller on one side than the diameter of the spool. It is very narrow, and is slightly larger on other sides than its length. , the above plate is inserted into the above hole when the above spool is inserted so that gravity pulls it into the above hole Claims that are arranged so as to pull against one side of the object to brake it. 46. Apparatus according to paragraph 45. 48. The cleaning device is effective for cleaning the hot iron. consisting of a cylindrical spool wrapped with a roll of adhesive tape having a cloth backing; The gripping device has a plate in the vicinity of and in contact with the roll; Each time the plate acts as a cutting blade to cut the part of the tape to be removed. 46. The apparatus according to claim 45. 49. The hot iron is adapted to heat a hot melt adhesive, and such as having a handle, a heating element, and a tip having a long fluted lower edge. 49. The apparatus according to claim 48. 50. having a surface consisting of continuous fiber threads wound in multiple layers on a support member; Hot ironing allows the layers above these layers to be removed to expose new layers. Cleaning device for cleaning the tip of the gun. 51. 51. The apparatus of claim 50, wherein the fibrous material comprises a flame retardant material. 52. The fibrous material was selected from the group consisting of boric acid, borax and combinations thereof. 51. The device of claim 50, wherein the device is immersed in a solution. 53. 51. The apparatus of claim 50, wherein the fibrous material is absorbent cotton thread. 54. 51. The method of claim 50, wherein the fibrous material is an absorbent corduroy yarn. Device. 55. Claim 1, wherein the fibrous material is an adhesive tape with an absorbent fabric backing. The device according to item 50. 56. each time the reservoir is fitted so that the liquid comes into contact with said fibrous material and wets it; 51. The apparatus according to claim 50. 57. Throw the cleaning element made of multi-layer fiber material and hot iron Cleaningly pass the tip of the its outermost layer so that when the outer layer becomes dirty it exposes a clean layer of the element. How to clean a hot iron by removing it. 58. The fibrous material forming each of the layers is placed on a support thereof. Claim 5 includes the step of soaking in a flame retardant solution once before or after or during use. The method described in Section 7. 59. The hot melt adhesive is melted in a heated chamber, and the melt inside this chamber is Thread the uncoated, insulated conductive wire through the adhesive Maintain a uniform coating by pulling vertically from the chamber through the chair and then The lever coating is insulated with a hot melt adhesive by cooling and solidifying. method of coating conductive wire.