JPS6346885U - - Google Patents
Info
- Publication number
- JPS6346885U JPS6346885U JP14152686U JP14152686U JPS6346885U JP S6346885 U JPS6346885 U JP S6346885U JP 14152686 U JP14152686 U JP 14152686U JP 14152686 U JP14152686 U JP 14152686U JP S6346885 U JPS6346885 U JP S6346885U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- aluminum substrate
- cover body
- resist layer
- bending line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
Landscapes
- Casings For Electric Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図は、折り曲げ加工させたカバー体を示す
斜視図、第２図は、折り曲げ加工前の平板状のカ
バー体を示す斜視図、第３図は、折り曲げ部分を
示す断面概略図、第４図は、折り曲げた部分を示
す断面概略図、第５図は、他の実施例における折
り曲げ部分を示す断面概略図、第６図は、同折り
曲げた部分を示す断面概略図である。
１……カバー体、１１……底面、１２，１３…
…側面、２……アルミ基板、３，３ａ，３ｂ……
導電体パターン、４，４ａ，４ａ……ソルダーレ
ジスト層、Ｃ……切欠部、Ｌ……折り曲げ線、Ｏ
……半田代。
1 is a perspective view showing the cover body after being bent; FIG. 2 is a perspective view showing the flat cover body before being bent; FIG. 3 is a schematic cross-sectional view showing the folded portion; 5 is a schematic cross-sectional view showing the bent portion in another embodiment. FIG. 6 is a schematic cross-sectional view showing the bent portion in another embodiment. 1... Cover body, 11... Bottom surface, 12, 13...
...Side surface, 2... Aluminum substrate, 3, 3a, 3b...
Conductor pattern, 4, 4a, 4a...Solder resist layer, C...Notch, L...Bending line, O
... Handayo.
Claims (1)
の上にソルダーレジスト層を設け、前記アルミ基
板を折り曲げ線に沿つて上面側に折り曲げて底面
及び側面に導電体パターンを配置したカバー体を
形成するものであつて、前記ソルダーレジスト層
を折り曲げ線に沿つて切欠して前記導電体パター
ンの入隅部に半田代を設けたことを特徴とする音
響機器のカバー体。 A conductor pattern is provided on the upper surface of an aluminum substrate, and a solder resist layer is further provided on the upper surface of the aluminum substrate, and the aluminum substrate is bent toward the upper surface side along the bending line to form a cover body in which the conductor pattern is arranged on the bottom and side surfaces. A cover body for an audio device, characterized in that the solder resist layer is cut out along a bending line to provide a solder margin at an inner corner of the conductor pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14152686U JPH0316303Y2 (en) | 1986-09-16 | 1986-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14152686U JPH0316303Y2 (en) | 1986-09-16 | 1986-09-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6346885U true JPS6346885U (en) | 1988-03-30 |
| JPH0316303Y2 JPH0316303Y2 (en) | 1991-04-08 |
Family
ID=31049391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14152686U Expired JPH0316303Y2 (en) | 1986-09-16 | 1986-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316303Y2 (en) |
-
1986
- 1986-09-16 JP JP14152686U patent/JPH0316303Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0316303Y2 (en) | 1991-04-08 |