JPS6344925Y2 - - Google Patents

Description

[Detailed explanation of the invention] This invention is a method for connecting both sides of the board at the farthest distance from the ground terminal when a high frequency relay is mounted on a double-sided board using the microstripline method. The present invention relates to a mounting structure of a high frequency relay in which a jumper pin is provided.

The present applicant has previously provided an inexpensive high-frequency relay in which a contact portion is housed in a resin case and the housing chamber is surrounded by a shield housing. In this high frequency relay, the shield housing is grounded by two symmetrical ground terminal pins corresponding to each contact portion.

For this reason, when mounting using the microstrip line method, if the ground pattern leading to the ground terminal pin protruding from the back side of the double-sided board is to be electrically connected to the solid ground on the front side of the board, the two ground terminal pins In order to minimize the impedance between the ground terminal pin and the solid ground, it is preferable to connect the ground terminal pin with a jumper pin at the shortest distance from the ground terminal pin.

However, since the relay case is placed closely in the center between the ground terminal pins, which is the shortest distance from the two ground terminal pins, there is a problem that the jumper pin must be placed close to the side of the case. It was hot.

Therefore, in order to solve the above-mentioned problem, the purpose of this invention is to obtain a mounting structure in which both sides of the board can be electrically connected by jumper pins at the shortest distance from the ground terminal protruding from the bottom surface of the relay.

In order to achieve the above object, this invention forms a recess on the bottom surface of the case at the center between the ground terminal pins of the high-frequency relay, and inserts a jumper pin through the top and bottom surfaces of the board within the recess to connect the ground pattern and solid ground. The present invention provides a mounting structure for a high frequency relay, which is characterized in that it is configured to conduct.

An embodiment of this invention will be described below in detail with reference to the drawings.

As shown in FIGS. 1 and 2, a housing is comprised of a box-shaped case 1 and a cover 2 made of synthetic resin. This case 1 is provided with a recess 1a for accommodating a contact circuit section, which will be described later, and a recess 1f for accommodating an electromagnet section. A conductive thin film is formed on the entire surface by plating, vapor deposition, etc.

Insulating blocks 3d, 4d, 5d made of insulating resin are fitted into the recess 1a of the case 1, and three rod-shaped fixed terminals 3, 4, 5 are held by these insulating blocks 3d, 4d, 5d. The contact parts 3a, 4a, 5a are inside the case 1, and the terminal part 3
b, 4b, and 5b are fixed so as to protrude outside the case 1. The cards 9 and 10 are slidably supported by guide grooves 1d and 1e formed in the case 1, and movable contact pieces 11 and 12 are fixed approximately at the center of the cards 9 and 10, respectively. Both ends of this movable contact piece 11 are connected to the terminal 3,
4, and both ends of the movable contact piece 12 face the fixed terminals 4, 5 so as to be contactable.
Further, the contact portions 11 of the movable contact pieces 11 and 12
Four earth contact portions 1b, 1b, . . . projecting to one side of the movable contact are formed on the side wall of the recessed portion 1a of the case 1, which faces the recessed portions 1a, 11a, 12a, 12a.

As shown in an enlarged view in FIG. 4, this ground contact portion 1b is formed into a protruding shape at a protrusion formed on the side wall of the recess 1a by forming a conductive thin film 1c on the surface of the case 1. It is.

When a metal plate shield cover 13 is attached to cover the recess 1a, the shield cover 13 and the conductive thin film 1c on the inner surface of the recess 1a form a shield housing that surrounds the contact circuit section.

On the bottom surface of this shield housing, four rod-shaped ground terminals 6a, 6b are placed at the shortest distance from the four ground contacts through the conductive thin film 1c.
7a and 7b are fixed. The insides of the recesses 1a of these ground terminals 6a, 6b, 7a, and 7b are electrically connected to the conductive thin film on the inner bottom surface of the recesses 1a, and the portions protruding to the outside of the case 1 are electrically connected to the conductive thin film on the outside of the case 1. ing. In addition, the ground terminals 6a, 6b, 7a are provided on the outer bottom surface of the case 1 at the parts where the ground terminals 6a, 6b, 7a, and 7b protrude.
Recesses 1i and 1i are provided at the center between and 7b, respectively. The internal volume of this recess is formed to be such that, when the jumper pin 8 is passed through the double-sided board and soldered, the soldered portion is sufficiently accommodated.

In addition, there is an iron core 1 in the recess 1f of the case 1.
4, an electromagnet consisting of a coil 15, a spool 16, a yoke 17, a movable iron piece 18, and a return spring 19 is fixed.

The return spring 19 has its base sandwiched between the yoke 17 and the protrusion 1g of the case 1, and can be moved by pressing the pressing piece 19a at the free end against the movable iron piece 18 hingedly supported on the yoke 17. A restoring force is applied to the iron piece 18. Both ends of the connecting plate 20 are fitted into the holes 9a and 10a of the cards 9 and 10, so that the cards 9 and 10 are interlocked. A hole 21a is formed in the center of the spring plate 21, and openings 21b are formed on both sides of the hole 21a. death,
It is held in the case 1 by pressing its both ends against the protrusions 1h, 1h on both sides of the case 1 so as to bend the entire body.

When the high frequency relay configured as described above is mounted on a double-sided board, as shown in FIG. When a relay is mounted later, the recesses 1i,
The jumper pin 8 is inserted in a position such that the jumper pin 1i is directly above the jumper pin 8, and soldered on the upper and lower surfaces of the board to connect the solid ground side 23 and the ground pattern 24.
After this, if the high frequency relay is mounted on the solid earth side 23 of the upper surface, the soldered portion of the jumper pin 8 is housed in the recess 1i of the relay, so the lower surface of the relay can be brought into close contact with the upper surface of the board. The jumper pins 8 are set between the ground terminals 6a and 6b, and 7a and 7b, respectively, and are electrically connected to the ground terminals 6a, 6b, 7a, and 7b on the lower surface ground pattern 24 side of the board 22. Moreover, these are ground terminals 6a, 6b, 7.
This means that a and 7b are electrically connected to the upper surface solid earth 23 through the shortest distance.

As explained above, in the mounting structure of the high frequency relay according to this invention, a recess is formed on the lower surface of the case at the center between the ground terminal pins, and a jumper pin is passed through the upper and lower surfaces of the board within the recess to establish a solid ground. Because it is electrically connected to the ground pattern, compared to conventional high-frequency relays that do not have a recess on the bottom of the case, a jumper pin that provides electrical continuity to the solid ground on the top surface can be installed at the shortest distance from the relay's ground terminal. The relay body can be tightly fixed to the board surface.

This makes it possible to minimize the impedance between the earth terminal and the conductive point to the solid earth, thereby improving the grounding effect of the earth contact portion in the contact circuit of the relay.
In addition, the shielding effect of the shield housing which covers the contact circuit is improved, allowing the high frequency relay to operate with its optimum characteristics.

In addition, since the jumper pin is inserted into the double-sided board and the upper and lower ground parts of the double-sided board are connected as before, there is no change in the work process, and by forming a recess on the bottom of the case, that part is wasted. It is possible to remove the resin and prevent sink marks during case molding.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway plan view showing a high-frequency relay according to an embodiment of this invention, and Fig. 2 is a partially cutaway plan view showing the high-frequency relay shown in Fig. 1 mounted on a double-sided board.
-A sectional view, FIG. 3 is an exploded perspective view of parts constituting the movable part of this invention, and FIG. 4 is an enlarged sectional view showing the vicinity of the ground contact portion. 1...Case, 1b...Earth contact part, 1c...
...Conductive thin film, 1i...Concavity, 6a, 6b, 7
a, 7b...earth terminal, 8...jumper pin,
22... Double-sided board, 23... Solid earth, 24...
...Earth pattern.

Claims (1)

[Scope of utility model registration request] A solid ground is formed on the top surface of the double-sided board, and a ground pattern is formed on the bottom surface.A high-frequency relay is mounted on the top side of this double-sided board, and the ground terminal pin protruding from the bottom surface of this high-frequency relay is passed through the board vertically. In the mounting structure of the high-frequency relay, a recess is formed on the lower surface of the case at the center between the ground terminal pins, and a jumper pin is passed through the upper and lower surfaces of the board within this recess. A mounting structure of a high frequency relay, characterized in that the structure is configured such that a ground pattern and a solid ground are electrically connected.