JPS6344453U - - Google Patents
Info
- Publication number
- JPS6344453U JPS6344453U JP1986138006U JP13800686U JPS6344453U JP S6344453 U JPS6344453 U JP S6344453U JP 1986138006 U JP1986138006 U JP 1986138006U JP 13800686 U JP13800686 U JP 13800686U JP S6344453 U JPS6344453 U JP S6344453U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- power transistor
- metal heat
- transistor chip
- scrubbing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 238000005201 scrubbing Methods 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986138006U JPS6344453U (sv) | 1986-09-10 | 1986-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986138006U JPS6344453U (sv) | 1986-09-10 | 1986-09-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6344453U true JPS6344453U (sv) | 1988-03-25 |
Family
ID=31042590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986138006U Pending JPS6344453U (sv) | 1986-09-10 | 1986-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6344453U (sv) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6241071U (sv) * | 1985-08-27 | 1987-03-11 |
-
1986
- 1986-09-10 JP JP1986138006U patent/JPS6344453U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6241071U (sv) * | 1985-08-27 | 1987-03-11 |