JPS6344348Y2 - - Google Patents

Description

[Detailed Description of the Invention] Technical Field of the Invention The present invention is a packaging case for semiconductor devices that is conventionally made of plastic material, but is made of thick plate material. This relates to a packaging case that can store.

Conventional technology Traditionally, what is called an IC magazine is a shaped extruded product of plastic (mainly PVC) used as a case for semiconductor devices.
In order to prevent electrostatic damage to MOS ICs, there were cases made of conductive plastic with specially treated carbon mixed into the plastic, and cases where conductive paint was applied to the surface of ordinary plastic. The disadvantage of these is that the mode of use is one-way (disposable).
Therefore, disposal of the plastic became a problem, and the use of a special conductive material led to disadvantages such as high cost. In addition, a printed circuit board storage box has been proposed in Japanese Utility Model Application Publication No. 54-22150, in which a conductive coating is provided on the inner wall of cardboard and a partition plate is erected inside so that it can be divided and stored when necessary. The board is a separate piece, so manufacturing is complicated.
Moreover, it was not possible to completely divide it into two rooms.

Purpose The present invention aims to improve these shortcomings and provide an easy-to-manufacture case that can accommodate two levels of semiconductor devices in one case and can be made from a single sheet of paperboard. be.

Configuration The packaging case for semiconductor devices of the present invention has the following configuration.

A paperboard material with a conductive coating on the back side is folded in half so that the conductive coating is on the top side to form a diagonal partition plate of a square prism cylinder, and the circumference is shaped into a square cylinder so that two triangular chambers are formed. The ends are bent and glued so that the conductive coating faces the interior of each chamber.

Example Next, embodiments of the present invention will be described with reference to the drawings.

Figure 1 is a diagram showing a packaging case for semiconductor devices as an example of a conventionally used plastic profile extrusion product.The case material itself is conductive or the inner surface is coated with a conductive coating. It is formed by applying

On the other hand, as shown in FIG. 2, the packaging case 2 for semiconductor devices according to the present invention has a square prism-like outer shape, and a partition plate 3 that is continuous with the square prism is folded into the interior diagonally. There is. To explain this in detail, as shown in Figs. 3 and 4, the case 2 has a conductive film 4, for example, aluminum foil of 7μ or 9μ, coated on the inner surface of a paperboard material 5 with a strength of 200 g/m ² or more. Paste together and make the shape shown in Figure 4 by folding line 6.
It is bent inward along the lines and glued together at the glue margin 7 to form a rectangular prism tube shape with the conductive coating on the inside as shown in FIG. Then, in the diagonal part of the rectangular prism cylindrical body, a part that becomes the partition plate 3, which is added continuously to the end of the paperboard material 5, is folded in two along the fold line and folded in a state that it reciprocates on the diagonal line. .

The bifold partition plate 3 divides the rectangular prism tube into two triangular prism-shaped spaces, and the conductive coating faces each chamber. Semiconductor elements are housed in each space partitioned by a partition plate 3.

Note that there is a viewing window 11 for reading the symbol attached to the semiconductor element 8 inside the case.
may be provided as necessary.

Further, as shown in FIG. 4, insertion lids 9 may be provided on the paperboard material 5 to cover both ends of the case 2.

In addition, as the conductive film in the present invention, not only aluminum foil but also conductive paint or conductive film may be used.Also, in order to further increase the strength of the square columnar cylindrical case, both ends of the partition plate 3 may be If it is bonded to the opposing corners, it becomes a complete double triangular prism cylinder, increasing its strength against external pressure. Furthermore, after use as a packaging case, it can be pressed flat and folded, making subsequent handling easier.

Effects Since the case for packaging semiconductor devices according to the present invention is constructed as described above, two sets of cases are formed in one container and a large number of devices can be stored, and the packaging case is made of paperboard material. Since it is formed by simply bending and joining a conductive film attached to a wafer, the inner surface of the packaging case is kept at the same potential, and the packaging case remains in the state of a single piece of paperboard until just before the semiconductor element is stored. It is easy to transport and assemble on the spot, and after being used as a case, it can be easily disposed of by incineration or folded flat, and it has the advantage of being inexpensive to manufacture.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an example of a conventionally known packaging case for semiconductor devices, FIG. 2 is a perspective view of a packaging case for semiconductor devices according to the present invention, FIG. 3 is a sectional view of FIG. 2, and FIG. It is a developed view of the outside of the second illustrated case. 2... Packaging case for semiconductor elements, 3... Partition plate, 4... Conductive coating, 5... Paperboard material, 7... Gluing space.

Claims (1)

[Scope of utility model registration request] A paperboard material with a conductive coating on the back side is folded in half so that the conductive coating is on the top side to form a diagonal partition plate of a square prism cylinder, and the circumference is shaped into a square cylinder so that two triangular chambers are formed. A packaging case for semiconductor devices, which is made by bending and gluing the ends so that a conductive film faces the inside of each chamber.