JPS6343447U - - Google Patents
Info
- Publication number
- JPS6343447U JPS6343447U JP1986136415U JP13641586U JPS6343447U JP S6343447 U JPS6343447 U JP S6343447U JP 1986136415 U JP1986136415 U JP 1986136415U JP 13641586 U JP13641586 U JP 13641586U JP S6343447 U JPS6343447 U JP S6343447U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- resin sealing
- bent
- utility
- outer edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000945 filler Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986136415U JPS6343447U (fr) | 1986-09-05 | 1986-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986136415U JPS6343447U (fr) | 1986-09-05 | 1986-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6343447U true JPS6343447U (fr) | 1988-03-23 |
Family
ID=31039505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986136415U Pending JPS6343447U (fr) | 1986-09-05 | 1986-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6343447U (fr) |
-
1986
- 1986-09-05 JP JP1986136415U patent/JPS6343447U/ja active Pending