JPS6338326U - - Google Patents

Info

Publication number
JPS6338326U
JPS6338326U JP12948386U JP12948386U JPS6338326U JP S6338326 U JPS6338326 U JP S6338326U JP 12948386 U JP12948386 U JP 12948386U JP 12948386 U JP12948386 U JP 12948386U JP S6338326 U JPS6338326 U JP S6338326U
Authority
JP
Japan
Prior art keywords
semiconductor device
post
metal electrode
compressive force
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12948386U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12948386U priority Critical patent/JPS6338326U/ja
Publication of JPS6338326U publication Critical patent/JPS6338326U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP12948386U 1986-08-27 1986-08-27 Pending JPS6338326U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12948386U JPS6338326U (cs) 1986-08-27 1986-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12948386U JPS6338326U (cs) 1986-08-27 1986-08-27

Publications (1)

Publication Number Publication Date
JPS6338326U true JPS6338326U (cs) 1988-03-11

Family

ID=31026092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12948386U Pending JPS6338326U (cs) 1986-08-27 1986-08-27

Country Status (1)

Country Link
JP (1) JPS6338326U (cs)

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