JPS6338203A - Ptc device - Google Patents
Ptc deviceInfo
- Publication number
- JPS6338203A JPS6338203A JP18299086A JP18299086A JPS6338203A JP S6338203 A JPS6338203 A JP S6338203A JP 18299086 A JP18299086 A JP 18299086A JP 18299086 A JP18299086 A JP 18299086A JP S6338203 A JPS6338203 A JP S6338203A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- ptc
- resin
- resistance
- substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000126 substance Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 13
- 239000011888 foil Substances 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 15
- -1 polyethylene Polymers 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
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- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
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- 238000003466 welding Methods 0.000 description 2
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
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- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
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- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
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- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000004599 antimicrobial Substances 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
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- 150000001805 chlorine compounds Chemical class 0.000 description 1
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- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
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- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Thermistors And Varistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は、電気抵抗素子に関し、より詳細には温庶上
胃に伴って比較的狭い温度領域で電気抵抗が急増する性
質(P T C特性(Positivetempera
ture coeHicient ) )を有する抵抗
素光重なわら、P T C素子に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an electrical resistance element, and more specifically, the property that electrical resistance rapidly increases in a relatively narrow temperature range with a warm stomach (P T C Characteristic (Positive temperature)
The present invention relates to a resistive element having an optical superposition (PTC element).
(従来の技術)
PTC特竹を右づ゛る物質は、一定の温度に上屏づると
発熱が止まるヒータ、正特性サーミスタ(PTCthc
rmister) 、感熱センυ、乾電池などで短絡し
たとぎ回路を開き他方その短絡が取り除かれたとぎ回路
が閉じる保護素子などに利用することができる。したが
って、PTC特性を有する物質の開発が従来から進めら
れ、現在BaT!03に1価または3価の金属酸化物を
添加したもの、ポリエチレンなどの結晶性重合体にS電
性物質が分散されたものなどがある。(Prior technology) The materials that make up PTC Thc
It can be used as a protection element that opens a short-circuited circuit using a heat-sensitive sensor υ, a dry battery, etc., and then closes the circuit once the short-circuit is removed. Therefore, the development of materials with PTC properties has been progressing for some time, and currently BaT! Examples include those in which a monovalent or trivalent metal oxide is added to 03, and those in which an S-electric substance is dispersed in a crystalline polymer such as polyethylene.
PTC特竹を有する抵抗素子(以下、PTC素子と略す
)1は、第2図に示づようにPTC特性を有する物質2
と、これを挟持ηる電極板3aおよび3bと、電極板に
接続されたリード板(端子)4aおよび4bとからなる
。As shown in FIG.
, electrode plates 3a and 3b which sandwich the same, and lead plates (terminals) 4a and 4b connected to the electrode plates.
このPTC素子の製造は、次のとおりである。The manufacture of this PTC element is as follows.
PTC特性を有する物質(組成物)をまず調製し、この
PTC組成物をフィルム状に成形し、フィルムの上下に
圧延ニッケルnへの′、43極を熱圧着して積層体を形
成する。この1?1層体を所定の寸法に切断し、この積
層体の電極表面にリード板を半田fU【プなとで溶接し
てPTC素子を製造する。A substance (composition) having PTC characteristics is first prepared, this PTC composition is formed into a film, and poles of ' and 43 are bonded to rolled nickel n on the upper and lower sides of the film to form a laminate. This one-layer body is cut to a predetermined size, and a lead plate is welded to the electrode surface of this laminated body with solder fU to manufacture a PTC element.
PTC素子として好ましい特性は、第1図に示すように
、高温で抵抗値(ピーク抵抗r2)が大きいことと共に
、室温で100mΩ以下の低い抵抗値(室温抵抗r1)
を右1することである。+i″渇での低抵抗化のlこめ
に、l) 1− CI+成物中のカーボンブラック(導
電性粒子)のfit彬を増吊りることが考えられるが、
充分なピー911(杭、/室温抵抗の比を得ることがて
・きない。に1k、l) I C組成物と電極どの接触
抵抗、電極とリード板との接触抵抗を低減する方法が秤
ノZ提案されている(米国特許第4.238.812号
明細書、および特開昭53−95298号公報)。As shown in Figure 1, desirable characteristics for a PTC element are a high resistance value (peak resistance r2) at high temperatures and a low resistance value of 100 mΩ or less at room temperature (room temperature resistance r1).
It is to right 1. In order to lower the resistance at +i'', it is possible to increase the fit of carbon black (conductive particles) in the 1-CI+ composition.
It is not possible to obtain a sufficient P911 (pile/room temperature resistance ratio.) The contact resistance between the IC composition and the electrode, and the method for reducing the contact resistance between the electrode and the lead plate are weighed. No.Z has been proposed (U.S. Pat. No. 4,238,812 and Japanese Patent Application Laid-open No. 53-95298).
(発明が解決しにつとする問題点)
PTC素子を回路保護素子として使用する場合、室温で
の電気エネルギーのロスを少なくするために室温抵抗r
1はできる限り低い方が望ましく、特に40mΩ以下が
望ましい。(Problems to be Solved by the Invention) When using a PTC element as a circuit protection element, room temperature resistance r is required to reduce electrical energy loss at room temperature.
1 is preferably as low as possible, particularly preferably 40 mΩ or less.
しかしながら、従来のPTC素子では、十分に高いピー
ク抵抗r2を保ちながら室温抵抗r1を低くすることは
困難である。However, with conventional PTC elements, it is difficult to lower the room temperature resistance r1 while maintaining a sufficiently high peak resistance r2.
この発明は上述の背景にもとずいてなされたものであり
、その目的するところは充分なピーク抵抗/室温抵抗の
比を右η−るPTC素子を提供することである。The present invention has been made based on the above-mentioned background, and its object is to provide a PTC element with a sufficient peak resistance/room temperature resistance ratio of .eta.-.
(問題点を解決ザるための手段)
本発明らは、上述の目的達成のために種々の試験・研究
の結果、高いピーク抵抗はPTC物質の性能に主に依存
し、他方、室温抵抗は主にPTC物71ど電極との接触
抵抗に依存するとの知見を得、この知見にもとずいて良
好な電極材料を検討した結果、完全焼鈍した比較内軟い
金属箔をTi極に用いればこの発明の目的達成に有効で
あることを見出しこの発明を完成づ゛るに到った。(Means for Solving the Problems) In order to achieve the above-mentioned objectives, the present inventors have conducted various tests and studies, and have found that high peak resistance mainly depends on the performance of the PTC material, while room temperature resistance We obtained the knowledge that it mainly depends on the contact resistance with the PTC material 71 electrode, and based on this knowledge, we investigated good electrode materials.We found that if a completely annealed soft metal foil was used for the Ti electrode, We have found that this invention is effective in achieving the object of the invention, and have completed the invention.
すなわち、この発明のl) T C素子は、P T C
特性を有づる物質と、該物質を挟持して電気的に接続し
た電極と、該電極と電気的に接続しlc端子とからなる
1〕IC素子であっで、該電極が完全焼鈍された圧延金
属箔、例えば、Fl−延ニッケル的であり、好ましくは
、イの厚さを3 Q 71 m以[としたことを特徴と
する。That is, l) T C element of this invention is P T C
1) A rolled IC element consisting of a substance having characteristics, an electrode sandwiching the substance and electrically connected to it, and an LC terminal electrically connected to the electrode, the electrode being completely annealed. The metal foil is, for example, Fl-rolled nickel, and is preferably characterized by having a thickness of 3 Q 71 m or more.
この発明の好ましい態様として、この金属電極をビッカ
ース硬1立で75〜9011 Vをイjするものとする
ことができる。In a preferred embodiment of the present invention, the metal electrode can have a Vickers hardness of 75 to 9011 V.
この発明において用いることのできるl) T C特性
を有づる物質としては、例えば、重合体と導電性粒子と
の混合物がある。この重合体として、ポリエチレン、ポ
リエチレンオキシド、1−4−ポリブタジェン、ポリT
チレンノlクリレート、エチレン−エチルアクリレ−1
〜共千合体、」ヂレンーアクリル酸共Φ合体、ポリTス
ーj−ル、ポリアミド、ポリエーテル、ポリカプロラク
タム、フッ素化エチレン−プロピレン共重合体、塩素化
ポリエチレン、クロロスルホン化エチレン、エチレン−
酢酸ビニル共重合体、ポリプロピレン、ボリスヂレン、
スチレン−アクリロニトリル共重合体、ポリ塩化ビニル
、ポリ塩化ビニリデン、ポリ酢酸ビニル、ポリカーボネ
ー1−、ポリアセタール、ポリアルキレンオキシド、ポ
リフェニレンオキシド、ポリスルボン、フッ素樹脂、お
よびこれらのブレンドポリマーなどが、PTC特性を有
する物質の調製に用いることができる。重合体の種類、
組成比などは、所望の性能、用途等に応じて適宜変更す
ることができる。Materials having l) T C properties that can be used in the present invention include, for example, mixtures of polymers and conductive particles. This polymer includes polyethylene, polyethylene oxide, 1-4-polybutadiene, polyT
Ethylene-ethyl acrylate, ethylene-ethyl acrylate-1
~ Co-copolymer, "Dylene-acrylic acid co-Φ polymer, PolyT-soul, polyamide, polyether, polycaprolactam, fluorinated ethylene-propylene copolymer, chlorinated polyethylene, chlorosulfonated ethylene, ethylene-
Vinyl acetate copolymer, polypropylene, borisdylene,
Styrene-acrylonitrile copolymer, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, polycarbonate 1-, polyacetal, polyalkylene oxide, polyphenylene oxide, polysulfone, fluororesin, and blend polymers thereof, etc. have PTC properties. It can be used in the preparation of substances. type of polymer,
The composition ratio and the like can be changed as appropriate depending on desired performance, use, etc.
まICS重合体に分散される導電性粒子としては、カー
ボンブラックの伯、黒鉛、スズ、銀、金、銅などの導電
性物質を用いることができる。As the conductive particles dispersed in the ICS polymer, conductive substances such as carbon black, graphite, tin, silver, gold, and copper can be used.
PTC特性を有する物質の調製に際して、上記の重合体
、1m性粒子以外に、必要に応じて種々の添加剤を況合
することもできる。添加できる物質として、例えばアン
チモン化合物、リン化合物、塩素化合物および臭素化合
物などの難燃剤もしくは耐燃剤、酸化防止剤などがある
。In preparing a substance having PTC characteristics, in addition to the above-mentioned polymer and 1m particles, various additives may be added as necessary. Examples of substances that can be added include flame retardants such as antimony compounds, phosphorus compounds, chlorine compounds, and bromine compounds, and antioxidants.
この発明においてPIG特性を右4る物質は、この原材
料、例えば重合体、導電性粒子、その他添加剤を所定の
割合で混合して調製される。In the present invention, the substance exhibiting PIG characteristics is prepared by mixing these raw materials, such as polymers, conductive particles, and other additives, in a predetermined ratio.
この発明のPTC素子の積層体は、1述のPTC特竹を
有する物質ど、Cの物質を挟持する電極板とからなって
いる。ここで用いることのできる電極板としては、通常
の電極どして用いることのできる金属であり、例えば、
ニッケル、銅、銀、鉄(ステンレス鋼を含む)、コバル
ト、亜鉛、アルミニウム、金、クロム、スズ、鉛、白金
などがある。The laminate of the PTC element of the present invention is composed of electrode plates sandwiching a material C, such as the material having the PTC special bamboo mentioned above. The electrode plate that can be used here is a metal that can be used as a normal electrode, for example,
These include nickel, copper, silver, iron (including stainless steel), cobalt, zinc, aluminum, gold, chromium, tin, lead, and platinum.
この発明の特徴の一つは、電極が完全焼鈍された圧延金
属箔である。ここで焼鈍は、金属を所定温度に加熱後、
徐冷却して行なわれる。加熱速度、加熱温度、加熱時間
、加熱雰囲気、冷IJ′I速度、冷却雰囲気などの焼鈍
条件は、熱処理対象物である金属電極の材質によって適
宜変更」ノで完全焼鈍になるように選択する。この発明
にJ3いて用いる電極は、好ましくは30μm以上の厚
さを有するもづるからである。金属は、完全焼鈍ににつ
て応力、歪みなどが除去され、比較内軟かくなる。この
発明において用いる電極の硬さは、ビッカース硬度で6
0〜100、好ましくは75〜90HVである。このに
うな硬度を有することにJ:って、トリップ時および外
部からの加熱により生じる箔の応力緩和がなくなり、ま
たそれにより生じる電極のそり等による樹脂との剥離が
なくなるからである。One of the features of this invention is that the electrode is a fully annealed rolled metal foil. Here, annealing is carried out after heating the metal to a specified temperature.
This is done by slow cooling. The annealing conditions such as heating rate, heating temperature, heating time, heating atmosphere, cold IJ'I speed, and cooling atmosphere are selected to achieve complete annealing by appropriately changing them depending on the material of the metal electrode to be heat treated. This is because the electrode used in this invention preferably has a thickness of 30 μm or more. When a metal is completely annealed, stress, strain, etc. are removed, and the metal becomes comparatively softer. The hardness of the electrode used in this invention is 6 on Vickers hardness.
0 to 100 HV, preferably 75 to 90 HV. Having this hardness eliminates the stress relaxation of the foil caused by tripping and external heating, and also eliminates peeling from the resin due to warping of the electrodes.
ここで挟持する方法としては、導電性接着剤を用いて電
極板とPTC特性を有する物質とを接合ゴる方法、PT
C特性を有する物質を融点近くまで加熱しこれに¥i電
極板熱圧着する方法などがある。次いで、通常の技術、
スポット溶接等で電極にリード板などの端子が電気的に
接続される。The sandwiching method here includes a method of bonding the electrode plate and a substance having PTC characteristics using a conductive adhesive, a method of bonding the electrode plate and a substance having PTC characteristics,
There is a method of heating a substance having C characteristics to near its melting point and thermally pressing an i-electrode plate onto the material. Then the usual techniques,
A terminal such as a lead plate is electrically connected to the electrode by spot welding or the like.
この発明のPTC素了の表面に必要に応じて樹脂膜を形
成させることができる。この発明にJ5いて用いること
のできる樹脂の種類は、この発明の目的に反しない限り
制限され4rい。その樹脂の例として、ポリエチレン、
ボリア1]ピレン、ポリスレチン、ポリ塩化ビニル、ポ
リ耐酸ビニル、ポリビニルアルコール、アクリル樹脂、
フッ素樹脂、ポリアミド樹脂、ボリアJ−ボネート樹脂
、ポリアセタール樹脂、ポリアルキレン71−1シト、
飽和ポリエステル樹脂、ポリノエニレンオキシド、ポリ
スルホン、ポリp−キシリレン、ポリイミド、ポリアミ
ドイミド、ポリアミドイミド、ポリベンゾイミダゾール
、ボリフ■ニレンスルフィド、ケイ素樹脂、フェノール
樹脂、尿素樹脂、メラミン樹脂、フラン樹脂、アルキド
樹脂、不飽和ポリエステル樹脂、ジアリルツクレート樹
脂、エポキシ樹脂、ポリウレタン樹脂、これらのブレン
ドポリマー、化学試薬との反応、放(ト)線橋か【J、
共重合体などの改質された上記樹脂などがある。これら
のうら特に好ましいものはエポキシ樹脂およびフェノー
ル樹脂ある。A resin film can be formed on the surface of the PTC material of this invention if necessary. The types of resins that can be used in this invention are limited as long as they do not contradict the purpose of this invention. Examples of such resins include polyethylene,
Boria 1] Pyrene, polysretin, polyvinyl chloride, polyacid-resistant vinyl, polyvinyl alcohol, acrylic resin,
Fluororesin, polyamide resin, boria J-bonate resin, polyacetal resin, polyalkylene 71-1 site,
Saturated polyester resin, polynoenylene oxide, polysulfone, polyp-xylylene, polyimide, polyamideimide, polyamideimide, polybenzimidazole, borif nylene sulfide, silicon resin, phenol resin, urea resin, melamine resin, furan resin, alkyd resin , unsaturated polyester resins, diallyl chloride resins, epoxy resins, polyurethane resins, blend polymers thereof, reactions with chemical reagents, radioactive bridges [J,
Examples include modified resins such as copolymers. Among these, particularly preferred are epoxy resins and phenolic resins.
これらの樹脂には、種々の添加剤、例えば可塑剤、滑剤
、橋か【づ剤、加硫剤、硬化剤、酸化防11−一 8
−
剤、紫外線吸収剤、充てlυ剤、強化剤、補強剤、改質
剤、帯電防止剤、難燃剤、着色剤、熱安定剤、軟化剤、
粘着性付与剤、結合剤、粘着防止剤、表面処理剤、(=
1香剤、防カビ剤、白アリ防除剤、ネズミ忌避剤などを
添加してもよい。These resins contain various additives such as plasticizers, lubricants, crosslinking agents, vulcanizing agents, curing agents, and antioxidants.
- agents, ultraviolet absorbers, fillers, reinforcing agents, modifiers, antistatic agents, flame retardants, colorants, heat stabilizers, softeners,
Tackifier, binder, anti-tack agent, surface treatment agent, (=
1. Flavoring agents, antifungal agents, termite repellents, rat repellents, etc. may be added.
この発明において用いることのできる樹脂は、少なくと
b絶縁性を有しており、好ましくは電極表面、およびP
TC物質表面に対して密着性を有している。The resin that can be used in this invention has at least b insulating properties, and preferably has an electrode surface and a P
Adhesive to the surface of the TC material.
樹脂膜の被覆法は、この発明において特に限定されず、
例えば噴霧、塗り付け、樹脂液への浸漬などである。樹
脂膜の被覆は、少なくとも、電極で覆われていないPT
C物質表面に行なわれると共に、電極間にわたって行な
われることが好ましい。しかし、それ以外の素子表面を
被覆してもよい。The method of coating the resin film is not particularly limited in this invention,
For example, spraying, painting, dipping in resin liquid, etc. The coating of the resin film is at least the PT that is not covered with the electrode.
It is preferable that the process be carried out on the surface of the C substance and also between the electrodes. However, other element surfaces may be coated.
樹脂の塗布後の硬化は、化学処即、加熱、放射線照射等
の樹脂に応じた通常の方法によって実施づることがでさ
る。樹脂膜の厚さは、樹脂の種類、素子の用途および寸
法等に応じて迫害変更することができる。Curing of the resin after coating can be carried out by a conventional method depending on the resin, such as chemical treatment, heating, or radiation irradiation. The thickness of the resin film can be changed depending on the type of resin, the use and dimensions of the device, etc.
(作 用)
この発明は上述の構成からなるので、P 1’ C素子
として次のように作動・作用する。(Function) Since the present invention has the above-described configuration, it operates and functions as a P 1'C element as follows.
この発明のPTC素子の金属電極は、ブ、−全焼鈍した
圧延金属箔であり、甲に圧延しただ【Jの金属箔の硬度
と仕べて軟かく、さらにその表面は粗くなっている。そ
の熱処理した金属箔を[〕IC物質と圧着させるので、
電極表面に1)−I’ C物質が密に接触し、電気的に
はその接触抵抗が低下づる。The metal electrode of the PTC element of this invention is a rolled metal foil that has been completely annealed. Since the heat-treated metal foil is pressure-bonded with the IC material,
1) The -I'C substance comes into close contact with the electrode surface, and its electrical contact resistance decreases.
このようなPTC素子を、例えば回路保護素子として使
用でると、正常に回路が動作しr/lトれる電流が通常
である場合、I−) T CXイの室温抵抗が小さいの
で、背渇することt>なく、ジ]−ル熱としての電気二
1ネルギーの損失は殆lυどない。他/J、短絡して過
大の電流が流れた場合、ジコール熱により昇渇し、PT
C特f!1よりP■C索子の抵抗が急激に増加して実質
的に短絡電流が止まる。When such a PTC element is used, for example, as a circuit protection element, if the circuit operates normally and the r/l current is normal, the room temperature resistance of In fact, there is almost no loss of electrical energy as dielectric heat. Others/J, If an excessive current flows due to a short circuit, it will rise and dry due to dicol heat, and the PT
C special f! 1, the resistance of the PC cord increases rapidly and the short circuit current substantially stops.
(発明の効果)
この発明のPTC素子によって次の効果を1!Vること
ができる。(Effects of the Invention) The PTC element of this invention provides the following effects! V can be done.
この発明のPTC素子の電極はPTC物質と密に電気的
に接触しているので、電極とP王C物質との間の接触抵
抗は小さく、使方PTC物質に熱的劣化を引ぎ起す原因
となる処理を必要としないので、ピーク抵抗を保持する
ことができる。したがって、充分なピーク抵抗/室渇抵
抗の比をイjするPTC索了を得ることかできる。Since the electrodes of the PTC element of this invention are in close electrical contact with the PTC material, the contact resistance between the electrodes and the PTC material is small, which may cause thermal deterioration to the PTC material. Since no further processing is required, the peak resistance can be maintained. Therefore, it is possible to obtain a PTC ratio that provides a sufficient ratio of peak resistance to thirst resistance.
(実施例) この発明を以下の例によってより具体的に説明する。(Example) This invention will be explained more specifically by the following examples.
実」L刈」− 十記絹成のPTC特性を右J−る物質を調製した。Fruit "L-kari"- A substance exhibiting the PTC properties of Juki Silk was prepared.
プリマ]−ル3460)
スターリングV)
添 加 剤二酸化防庄剤 2U(イルガ
ノックス1010 )
上記のl〕T C組成物をI]−ル温1σ1巳i 0
’Cの2本[1−ルミルで10分間混練した。これを2
tnm厚に成形し、それを冷)Jl 112.20
X 2 !’i 111111に切断した。1 tnm
厚の常炭素Ni板を60μまで冷間It延した後、アン
モニア分解ガス中Q 600℃30分間の焼鈍処理して
4!−1られた完全焼鈍Ni箔(骨内金属箔粉■業製)
を準備した。Primal 3460) Starling V) Additive Dioxide antiseptic agent 2U (Irganox 1010)
Two bottles of 'C were kneaded for 10 minutes using 1-Lumil. This 2
Molded to a thickness of tnm and cooled) Jl 112.20
X2! 'i Cut to 111111. 1 tnm
After cold rolling a normal carbon Ni plate with a thickness of 60 μm, it was annealed in ammonia decomposition gas at 600°C for 30 minutes. -1 completely annealed Ni foil (manufactured by intraosseous metal foil powder)
prepared.
なお、このNi箔は、JIS Z2251に規定され
た微少硬ざ試験にJ:るマイク【コビツカース硬度で8
0Hv (0,05)の硬度を有し−Cいた。In addition, this Ni foil passed the microhardness test stipulated in JIS Z2251.
It had a hardness of 0 Hv (0,05) and was -C.
完全焼鈍Ni箔を40 X 55 mmに切断し、この
箭の間にP T C組成物を挿入し、ホットプレスで積
層・圧着した。これを10.5X10.5#に切り出し
、N1Piのリード(端子)を電極にスポット溶接など
の通常の方法で電気的に接続した。A completely annealed Ni foil was cut into a size of 40 x 55 mm, a PTC composition was inserted between the edges, and the pieces were laminated and crimped using a hot press. This was cut into a size of 10.5×10.5#, and N1Pi leads (terminals) were electrically connected to the electrodes by a usual method such as spot welding.
この例によるPTC索子は室温抵抗40mΩを、ピーク
抵抗1.2kQを右しCいIこ。The PTC cable according to this example has a room temperature resistance of 40 mΩ and a peak resistance of 1.2 kQ.
比較例
電極どして従来の焼鈍されていない圧延Ni箔を用いた
こと以外、実施例1と同様に実施した。Comparative Example A comparative example was carried out in the same manner as in Example 1, except that a conventional non-annealed rolled Ni foil was used as the electrode.
1!1られたPTC素子の室温抵抗は70mΩであっl
こ 。The room temperature resistance of the PTC element with 1!1 is 70 mΩ.
child .
第1図はPFC特性を示す線図、第2図は、PTC索子
の例を示づ“斜視図である。
1・・・PTC素子、2・・・PTC組成物、3・・・
電極、4・・・リード板。FIG. 1 is a diagram showing PFC characteristics, and FIG. 2 is a perspective view showing an example of a PTC cord. 1... PTC element, 2... PTC composition, 3...
Electrode, 4... Lead plate.
Claims (1)
的に接続した電極と、該電極と電気的に接続した端子と
からなるPTC素子であって、該電極が完全焼鈍された
圧延金属箔であることを特徴とするPTC素子。 2、電極が30μm以上の厚さを有する、特許請求の範
囲第1項記載のPTC素子。 3、電極がニッケルからなる特許請求の範囲第1項また
は第2項記載のPTC素子。 4、電極がビッカース硬度で75〜90Hvを有する、
特許請求の範囲第1項、第2項または第3項記載のPT
C素子。[Scope of Claims] 1. A PTC element consisting of a substance having PTC characteristics, electrodes sandwiching the substance and electrically connected to it, and terminals electrically connected to the electrode, wherein the electrode is A PTC element characterized in that it is a completely annealed rolled metal foil. 2. The PTC element according to claim 1, wherein the electrode has a thickness of 30 μm or more. 3. The PTC element according to claim 1 or 2, wherein the electrode is made of nickel. 4. The electrode has a Vickers hardness of 75 to 90 Hv.
PT according to claim 1, 2 or 3
C element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18299086A JPS6338203A (en) | 1986-08-04 | 1986-08-04 | Ptc device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18299086A JPS6338203A (en) | 1986-08-04 | 1986-08-04 | Ptc device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6338203A true JPS6338203A (en) | 1988-02-18 |
Family
ID=16127825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18299086A Pending JPS6338203A (en) | 1986-08-04 | 1986-08-04 | Ptc device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6338203A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6031203A (en) * | 1983-07-29 | 1985-02-18 | 株式会社東芝 | Resistance element |
-
1986
- 1986-08-04 JP JP18299086A patent/JPS6338203A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6031203A (en) * | 1983-07-29 | 1985-02-18 | 株式会社東芝 | Resistance element |
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