JPS633740Y2 - - Google Patents
Info
- Publication number
- JPS633740Y2 JPS633740Y2 JP15682782U JP15682782U JPS633740Y2 JP S633740 Y2 JPS633740 Y2 JP S633740Y2 JP 15682782 U JP15682782 U JP 15682782U JP 15682782 U JP15682782 U JP 15682782U JP S633740 Y2 JPS633740 Y2 JP S633740Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder wire
- roller
- solder
- wire receiving
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 54
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920001875 Ebonite Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Accessories And Tools For Shearing Machines (AREA)
Description
【考案の詳細な説明】
本考案ははんだ線の溝切り装置の改良に関する
ものである。中空はんだ線のその中空部にフラツ
クスを充填した、所謂ヤニ入りはんだにおいて
は、高い温度のこて先と接触するはんだ付け時
に、フラツクスが急激に膨張してフラツクスの飛
散及びはんだ粒の飛散が生じ易く、かゝる飛散を
防止するために第１図に示すように、はんだ線
１′に、フラツクス２′に達する切溝３′を設ける
ことが公知である。[Detailed Description of the Invention] The present invention relates to an improvement of a solder wire grooving device. In so-called resin-filled solder, in which the hollow part of a hollow solder wire is filled with flux, the flux expands rapidly during soldering when it comes into contact with a high-temperature iron tip, causing flux scattering and solder particles to scatter. In order to easily prevent such scattering, it is known to provide the solder wire 1' with a groove 3' that reaches the flux 2', as shown in FIG.
而して、はんだ線に上記切溝を施すには、はん
だ線受溝を有するはんだ線受ローラと該ローラ上
においてはんだ線に溝を切込むロールカツターと
よりなる装置が用いられている。従来のこの種装
置においては、はんだ線受ローラの上下位置調整
が可能であり、はんだ線の線径が多少変つてもは
んだ線受ローラの上下位置調整で対処できる。し
かしながら、はんだ線受ローラのはんだ線受溝の
溝径とはんだ線の線径との差が余り大きくなる
と、はんだ線の横ぶれが著しくなり、従つて、は
んだ線受溝の溝径との関係ではんだ線の線径範囲
に応じ、はんだ線受ローラを交換する必要があ
る。 To cut the solder wires with the above-mentioned grooves, a device is used that includes a solder wire receiving roller having a solder wire receiving groove and a roll cutter that cuts the grooves into the solder wire on the roller. In conventional devices of this type, the vertical position of the solder wire receiving roller can be adjusted, and even if the wire diameter of the solder wire changes somewhat, this can be dealt with by adjusting the vertical position of the solder wire receiving roller. However, if the difference between the groove diameter of the solder wire receiving groove of the solder wire receiving roller and the wire diameter of the solder wire becomes too large, the horizontal runout of the solder wire becomes significant. It is necessary to replace the solder wire receiving roller depending on the wire diameter range of the solder wire.
而るに、はんだ線受溝の溝径をある程度可変に
できれば、はんだ線受ローラのはんだ線径に対す
る適用範囲をそれだけ拡大でき、はんだ線受ロー
ラの交換頻度、準備しておくべきはんだ線受ロー
ラの種類をそれだけ少なくできて有利であるが、
従来のはんだ線受ローラにおいては、はんだ線受
溝が不動であり、かゝる有利性は望めない。 If the groove diameter of the solder wire receiving groove can be made variable to some extent, the range of application of the solder wire receiving roller to the solder wire diameter can be expanded accordingly, and the frequency of replacing the solder wire receiving roller and the number of solder wire receiving rollers that should be prepared can be increased accordingly. It is advantageous to be able to reduce the number of types of
In conventional solder wire receiving rollers, the solder wire receiving grooves are immovable, and such advantages cannot be expected.
本考案に係るはんだ線の溝切り装置は上述の点
に鑑みて案出されたものであり、はんだ線受溝を
有する弾性胴を押板により圧縮調整可能なように
挟持してなるはんだ線受ローラと、該ローラ上に
おいてはんだ線に溝を切込むカツターローラを備
えていることを特徴とする構成である。 The solder wire grooving device according to the present invention has been devised in view of the above-mentioned points, and is a solder wire receiver formed by sandwiching an elastic body having a solder wire receiving groove with a press plate so that the compression can be adjusted. This structure is characterized by comprising a roller and a cutter roller that cuts a groove in the solder wire on the roller.
以下、図面により本考案を説明する。 The present invention will be explained below with reference to the drawings.
第２図において、１，１は支持台である。２は
カツターローラであり、そのローラ軸２０は支持
台１，１に軸承３，３を介して回転自在に支持さ
れている。このカツターローラ２はカツター２１
と支持ローラ２２，２２とから構成されており、
ローラ軸２０に螺合された調整ネジ４１，４２に
よつて左右方向への位置調整が可能である。５は
はんだ線受ローラであり、Ｖ又は半円形のはんだ
線受溝５１１を有する弾性胴（硬質ゴム、シリコ
ーン製）５１と押板５２，５２とからなり、ロー
ラ軸５０に螺合された調整ネジ６によつて弾性胴
５１の圧縮調整が可能である。はんだ線受ローラ
５のローラ軸５０は、支持台１，１に軸承７，７
を介して回転自在に支持されており、これらの軸
承７，７は微調整ネジ８，８により上下位置調整
が可能である。従つて、はんだ線受ローラ５の上
下位置調整も可能である。 In FIG. 2, 1, 1 is a support stand. Reference numeral 2 denotes a cutter roller, and its roller shaft 20 is rotatably supported by support stands 1, 1 via bearings 3, 3. This cutter roller 2 is a cutter 21
and support rollers 22, 22,
Adjustment screws 41 and 42 screwed into the roller shaft 20 allow the position to be adjusted in the left-right direction. 5 is a solder wire receiving roller, which is composed of an elastic body (made of hard rubber or silicone) 51 having a V or semicircular solder wire receiving groove 511 and push plates 52, 52, and an adjusting roller screwed onto the roller shaft 50. The compression of the elastic body 51 can be adjusted by the screw 6. The roller shaft 50 of the solder wire receiving roller 5 is mounted on the support bases 1, 1 with bearings 7, 7.
These shaft bearings 7, 7 can be vertically adjusted by fine adjustment screws 8, 8. Therefore, it is also possible to adjust the vertical position of the solder wire receiving roller 5.
上記において、はんだ線受ローラ５のはんだ線
受溝５１１の寸法は、はんだ線Ａの線径に充分に
適合していることが必要である。而るに、はんだ
線Ａが変り、その線径が変つても、弾性胴５１の
圧縮状態を押板５２，５２の加圧力の加減により
調整して、そのはんだ線受溝５１１の寸法をはん
だ線Ａの線径によく適合できる。 In the above, the dimensions of the solder wire receiving groove 511 of the solder wire receiving roller 5 need to sufficiently match the wire diameter of the solder wire A. In addition, even if the solder wire A changes and its wire diameter changes, the compression state of the elastic body 51 can be adjusted by adjusting the pressing force of the press plates 52, 52, and the dimensions of the solder wire receiving groove 511 can be changed. It can be well adapted to the wire diameter of wire A.
このように、本考案に係るはんだ線の溝切り装
置によれば、はんだ線の線径が多少変つても、弾
性胴の圧縮状態の調整によりはんだ線受ローラの
寸法をはんだ線の線径に充分に適合させ得るか
ら、はんだ線の線径変化に対するはんだ線受ロー
ラの交換頻度を少なくでき、それに伴い準備して
おくべきはんだ線受ローラの種類も少なくでき
る。 As described above, according to the solder wire grooving device of the present invention, even if the wire diameter of the solder wire changes slightly, the dimensions of the solder wire receiving roller can be adjusted to the wire diameter of the solder wire by adjusting the compression state of the elastic cylinder. Since the solder wire receiving roller can be sufficiently adapted, the frequency of replacing the solder wire receiving roller in response to changes in the wire diameter of the solder wire can be reduced, and accordingly, the number of types of solder wire receiving rollers to be prepared can be reduced.
第１図は切溝入りはんだ線を示す説明図、第２
図は本考案に係るはんだ線の溝切り装置を示す説
明図である。
図において、２はカツターローラ、５１は弾性
胴、５２，５２は押板、５１１ははんだ線受溝、
Ａははんだ線である。
Figure 1 is an explanatory diagram showing a solder wire with grooves, Figure 2
The figure is an explanatory view showing a solder wire grooving device according to the present invention. In the figure, 2 is a cutter roller, 51 is an elastic cylinder, 52 and 52 are push plates, 511 is a solder wire receiving groove,
A is a solder wire.
Claims (1)
調整可能なように挟持してなるはんだ線受ローラ
と、該ローラ上においてはんだ線に溝を切込むカ
ツターローラを備えていることを特徴とするはん
だ線の溝切り装置。 A solder wire comprising a solder wire receiving roller formed by holding an elastic body having a solder wire receiving groove in a compression-adjustable manner by a press plate, and a cutter roller for cutting a groove in the solder wire on the roller. Line grooving device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15682782U JPS5962886U (en) | 1982-10-15 | 1982-10-15 | Solder wire grooving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15682782U JPS5962886U (en) | 1982-10-15 | 1982-10-15 | Solder wire grooving device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5962886U JPS5962886U (en) | 1984-04-25 |
| JPS633740Y2 true JPS633740Y2 (en) | 1988-01-29 |
Family
ID=30345932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15682782U Granted JPS5962886U (en) | 1982-10-15 | 1982-10-15 | Solder wire grooving device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5962886U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2520265Y2 (en) * | 1993-11-29 | 1996-12-11 | 明生 渡▲辺▼ | Feeding mechanism for solder wire containing tar |
| JP4999148B2 (en) * | 2006-04-22 | 2012-08-15 | 正一 北野 | Flux dissipation prevention thread solder grooving |
-
1982
- 1982-10-15 JP JP15682782U patent/JPS5962886U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5962886U (en) | 1984-04-25 |
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