JPS6335770A - Packing plate for sputtering target - Google Patents

Abstract

PURPOSE:To conveniently and easily exchange a target by forming a packing plate for a sputtering target with two parts, joining the parts with screws, and pouring a metal which is liquid at room temp. into the joint. CONSTITUTION:The target 101 for sputtering is fixed to a first packing plate 103 with a solder 102, the packing plate 103 is joined to a second packing plate 107 by screws 104, and alloy of InGa, etc., which is liquid at room temp. is poured into the joint 105 between both packing plates 103 an 107, the second packing plate 107 is fixed to a cathode main body 109 with screws 106, and a refrigerant such as water is passed through a space 108 formed by the plate 107 and the main body 109. When the target 101 is exchanged, the screws 104 are loosened, and the target is exchanged along with the first packing plate 103. The target on be conveniently and easily exchanged in this way without touching at a the cooling zone 108 in the cathode 109 with the hand.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to the structure of a backing plate for a sputtering target.

[Conventional technology]

FIG. 2 shows an example of a state in which a conventional sputtering target and backing plate are attached to a cathode body. In FIG. 2, a backing plate (204) is bonded to a backing plate (204) through a brazing material (202) i.

The backing plate is attached to the cathode body (206) by screws (203) or the like. A cooling medium flows in the space (203) behind the backing plate and cools the target through heat conduction of the backing plate.

[Problem that the invention seeks to solve]

However, in the prior art described above, when the target is replaced, the backing plate separates from the cathode body, so the cooling medium (water in most cases) is exposed to the inside of the vacuum chamber. Moisture is very harmful in a vacuum chamber, so careful handling is required every time the target is replaced, and sufficient shielding between the backing plate and the cathode body is required.

Further, generally, the backing plate is subjected to atmospheric pressure from the cooling medium side and the target side is in a high vacuum, so the backing plate is required to have strength that can withstand atmospheric pressure.

Therefore, the backing plate becomes thick and has a considerable weight when combined with the target. Especially when the target has a large area for mass production, it becomes very difficult to handle due to its weight.

Therefore, the present invention aims to solve these problems.
The purpose is to provide a backing plate that makes it easier to replace sputtering targets.

[Failure to solve the problem]

The backing plate for sputtering of the present invention is composed of two parts: (1) a part in contact with the cooling medium and a part in contact with the sputtering target; (2) the above two parts.
The parts are physically joined by screws or the like. 3) A liquid of a low melting point metal is poured into the joint.

[Effect]

According to the above configuration of the present invention, when replacing the target, there is no need to remove the backing plate in contact with the cooling medium, there is no possibility that the cooling medium will adhere to the inside of the vacuum chamber, and handling is easy. It becomes easy. Additionally, the backing plate in contact with the target does not need to be strong enough to withstand atmospheric pressure, making it lighter in weight and easier to handle.

Furthermore, since the joint between the two parts is screwed together, the thermal conductivity is low. Therefore, in order to improve thermal conductivity, a low melting point metal liquid was poured into the joint to improve thermal conductivity.

〔Example〕

FIG. 1 is a cross-sectional view of the sputtering target and backing plate attached to the cathode body in this embodiment. The target (101) is a brazing filler metal (
102) to a backing plate (103) that fixes the target. The backing plate (103) is secured by screws (104) to withstand external pressure and conduct heat from the refrigerant.
7) is fixed. backing play) (103)
In this example, a liquid InGa alloy was poured into the joint (103) between and (107) at room temperature to improve the thermal conductivity. The backing plate (107) is attached to the cathode body (109) with screws (106) or the like. A cooling medium is flowing through (1, o a ). When replacing the target, remove the screw (104) and replace the part above the backing plate (103).

In this example, backing plate (1o7)
and the cathode body (109) do not need to be separate;
It may be integrated.

〔Effect of the invention〕

As described above, according to invention 1, the sputtering target backing plate is composed of two parts, the part in contact with the cooling medium and the part in contact with the sputtering target, which are physically joined with screws or the like. By pouring a low-melting metal liquid into the joint, the cooling medium will not be released into the chamber when replacing the target, and the weight of the target with backing plate will be lighter than conventional ones, making it easier to handle. This has the effect of simplifying the process.

[Brief explanation of the drawing]

FIG. 1 is a main sectional view of the sputtering target and backing plate of the present invention. FIG. 2 is a main cross-sectional view of a conventional sputtering target and backing plate. that's all

Claims (3)

[Claims] (1) A backing plate for a sputtering target characterized by being composed of two parts: a part in contact with a cooling medium and a part in contact with a sputtering target. (2) The backing plate for a sputtering target according to claim 1, wherein the two parts are physically joined by screws or the like. (3) The backing plate for a sputtering target according to claim 1, wherein a liquid of a low melting point metal is poured into the joint portion.