JPS6335650A - Thermoplastic resin composition - Google Patents
Thermoplastic resin compositionInfo
- Publication number
- JPS6335650A JPS6335650A JP17769486A JP17769486A JPS6335650A JP S6335650 A JPS6335650 A JP S6335650A JP 17769486 A JP17769486 A JP 17769486A JP 17769486 A JP17769486 A JP 17769486A JP S6335650 A JPS6335650 A JP S6335650A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- arom
- diamine
- acid
- polyether resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 14
- 229920005992 thermoplastic resin Polymers 0.000 title claims description 8
- 239000004952 Polyamide Substances 0.000 claims abstract description 28
- 229920002647 polyamide Polymers 0.000 claims abstract description 28
- 125000003118 aryl group Chemical group 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 19
- 229920000570 polyether Polymers 0.000 claims abstract description 19
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims abstract description 12
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 24
- -1 aliphatic diamine Chemical class 0.000 claims description 19
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 12
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 8
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical group NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 claims description 4
- 239000002904 solvent Substances 0.000 abstract description 11
- 150000004985 diamines Chemical class 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 150000003839 salts Chemical class 0.000 abstract description 4
- 229920001519 homopolymer Polymers 0.000 abstract description 3
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 abstract description 2
- 229920001577 copolymer Polymers 0.000 abstract description 2
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 abstract description 2
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 abstract 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920001955 polyphenylene ether Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- FKUJGZJNDUGCFU-UHFFFAOYSA-N 2,5-dimethylterephthalic acid Chemical compound CC1=CC(C(O)=O)=C(C)C=C1C(O)=O FKUJGZJNDUGCFU-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、機械的強度、成形性、さらには１酎溶剤性に
優れた高耐熱性熱可塑性樹脂組成物に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a highly heat-resistant thermoplastic resin composition that is excellent in mechanical strength, moldability, and solvent resistance.
［従来の技術］
芳香族ポリエーテル系樹脂は、機械的性質、電気的性質
、耐熱性が優れており、エンジニアリングプラスチック
スとして注目されているが、成形加工性、耐衝撃強度、
さらには耐溶剤性及び耐油性に劣ることが大きな欠点で
ある。[Prior art] Aromatic polyether resins have excellent mechanical properties, electrical properties, and heat resistance, and are attracting attention as engineering plastics. However, they have poor moldability, impact resistance,
Furthermore, a major drawback is that it has poor solvent resistance and oil resistance.
芳香族ポリエーテル系樹脂の成形加工性を改良する為に
ポリアミドを配合することが特公昭４５−９９７号公報
に提案されているが、この技術によれば、ポリエーテル
系樹脂とポリアミドとは非常に相溶性が悪く、得られた
組成物は機械的特性に劣り、射出成形により得られた成
形品は層状剥離現象を示し、好ましい成形品が得られな
い。また、特公昭５９−４１６６３号公報には芳香族ポ
リエーテル系樹脂７０〜５重量％と脂肪族ポリアミド３
０〜９５重液％を溶融混練することにより樹脂組成物を
製造する方法が、又特開昭６０−１５４５３号公報には
芳香族ポリエーテル系樹脂に芳香族ジアミンと脂肪族ジ
カルボン酸とを縮重合して得られるポリアミド及び芳香
族を有するω−アミノ−ω′−力ルポキシル化合物を反
応して得られるポリアミドを配合することが提案されて
いるが、しかしながらこれらの技術によって得られた樹
脂組成物は耐溶剤性は改良されるものの１機械的特性、
９．νに高温雰囲気下での機械的特性が充分でなかった
。Japanese Patent Publication No. 45-997 proposes blending polyamide with aromatic polyether resin in order to improve its moldability, but according to this technology, polyether resin and polyamide are very different from each other. The resulting composition has poor mechanical properties, and molded products obtained by injection molding exhibit a delamination phenomenon, making it impossible to obtain desirable molded products. Furthermore, in Japanese Patent Publication No. 59-41663, 70 to 5% by weight of aromatic polyether resin and 3% aliphatic polyamide are disclosed.
A method for producing a resin composition by melt-kneading 0 to 95% heavy liquid is also disclosed in JP-A-60-15453, in which an aromatic diamine and an aliphatic dicarboxylic acid are condensed into an aromatic polyether resin. It has been proposed to blend a polyamide obtained by polymerization and a polyamide obtained by reacting an ω-amino-ω′-rupoxyl compound having an aromatic group, but the resin compositions obtained by these techniques, however, Although the solvent resistance is improved, the mechanical properties are
9. ν did not have sufficient mechanical properties in a high-temperature atmosphere.
すなわち、機械的強度、成形性、さらには耐溶剤性に優
れた高ｒｆｒＩＪ熱性熱可塑性樹脂組成物はこれまで知
られていない。That is, a high rfr IJ thermal thermoplastic resin composition excellent in mechanical strength, moldability, and solvent resistance has not been known so far.
［発明が解決しようとする問題点］
本発明者等は、高温雰囲気下での機械的特性に優れ、か
つ成形性及び耐溶剤性に優れた熱可塑性樹脂組成物を得
るべく鋭意検討した結果、芳香族ポリエーテル系樹脂と
特定の芳香族ポリアミドからなる樹脂組成物が前記目的
を満足できることを見い出し本発明に到達した。[Problems to be Solved by the Invention] As a result of intensive studies by the present inventors to obtain a thermoplastic resin composition that has excellent mechanical properties in a high-temperature atmosphere, as well as excellent moldability and solvent resistance, the present inventors have found that: The present invention was achieved by discovering that a resin composition comprising an aromatic polyether resin and a specific aromatic polyamide can satisfy the above object.
［問題点を解決するための手段及び作用］本発明は芳香
族ポリエーテル系樹脂５〜９５重量％と、芳香族ジカル
ボン酸と脂肪族ジアミンから得られる主鎖中に芳香項を
含むポリアミド９５〜５重量％とからなる熱可塑性樹脂
組成物に関する。[Means and effects for solving the problems] The present invention provides a polyamide containing an aromatic term in the main chain obtained from 5 to 95% by weight of an aromatic polyether resin, an aromatic dicarboxylic acid, and an aliphatic diamine. 5% by weight of the thermoplastic resin composition.
本発明の熱可塑性樹脂組成物は、芳香族ポリエーテル系
樹脂と、脂肪族ジカルボン酸と芳香族ジアミンとから得
られるポリアミドとからなる樹脂組成物に比べ、高温雰
囲気下での機械的性質に特に優れ、また射出成形によっ
て得られた成形品に層状の剥離現象も認められない、こ
れは芳香族ポリエーテル系樹脂と特定のポリアミドとの
組み合せに於て初めて認められる現象である。The thermoplastic resin composition of the present invention has particularly good mechanical properties in a high temperature atmosphere compared to a resin composition consisting of an aromatic polyether resin and a polyamide obtained from an aliphatic dicarboxylic acid and an aromatic diamine. It is excellent, and no delamination phenomenon is observed in molded articles obtained by injection molding, a phenomenon that is first observed in the combination of an aromatic polyether resin and a specific polyamide.
本発明の芳香族ポリエーテル系樹脂とは。What is the aromatic polyether resin of the present invention?
一般式
を繰り返し単位とし、構成単位が（Ｉ）又はＣＩ）及び
（ＩＩ ）からなる単独重合体あるいは共重合体、およ
び該重合体にスチレンなどをグラフト重合させたグラフ
ト共重合体などを言う。It refers to a homopolymer or copolymer whose general formula is a repeating unit and whose structural units are (I) or CI) and (II), and a graft copolymer obtained by graft polymerizing styrene or the like to the polymer.
ポリフェニレンエーテルの単独重合体の代表例としては
、ポリ（２，６−シメチルー１．４−フェニレン）エー
テル、ポリ（２−メチル−６−エチル−１，４−フエニ
レン）エーテル、ポリ（２，６−ダニチル−１，４−フ
エニレン）エーテル、ポリ（２−エチル−６−＋＋−プ
ロピルー１．４−フェニレン）エーテル、ポリ （２，
６−ジーｎ−プロピル−１，４−フェニレン）エーテル
、ポリ（２−メチル−６−ｎ−ブチル−１，４−フェニ
レン）エーテル、ポリ（２−エチル−６−イソプロビル
−１，４−フエニレン）エーテル、ポリ（２−メチル−
６−クロル−１，４−フェニレン）エーテル、ポリ（２
−メチル−６−ヒドロキシエチル−１，４−フェニレン
）エーテル、ポリ（２−メチル−６−クロロエチル−１
，４−フェニレン）エーテル等のホモポリマーが挙げら
れる。Representative examples of homopolymers of polyphenylene ether include poly(2,6-dimethyl-1,4-phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, and poly(2,6-dimethyl-1,4-phenylene) ether. -danityl-1,4-phenylene) ether, poly(2-ethyl-6-++-propyl-1,4-phenylene) ether, poly(2,
6-di-n-propyl-1,4-phenylene) ether, poly(2-methyl-6-n-butyl-1,4-phenylene) ether, poly(2-ethyl-6-isopropyl-1,4- phenylene)ether, poly(2-methyl-
6-chloro-1,4-phenylene)ether, poly(2
-Methyl-6-hydroxyethyl-1,4-phenylene)ether, poly(2-methyl-6-chloroethyl-1)
, 4-phenylene) ether and the like.
ポリフェニレンエーテル共重合体は、オルトクレゾール
又は一般式
で表わされる２、３．６−ドリメチルフエノール等のア
ルヤル置換フェノールと共重合して得られるボリフェニ
レンエーテル構造を主体としてなるポリフェニレンエー
テル共重合体を包含する。The polyphenylene ether copolymer is a polyphenylene ether copolymer mainly composed of a polyphenylene ether structure obtained by copolymerizing with an alrylated phenol such as orthocresol or 2,3,6-dolimethylphenol represented by the general formula. include.
更に上記ポリフェニレンエーテルにスチレン単独または
スチレンと共重合可能な単量体をグラフト共重合させた
ものを用いても良い。Furthermore, styrene alone or a monomer copolymerizable with styrene may be graft copolymerized with the polyphenylene ether.
本発明に用いるポリアミドは、芳香族ジカルボン酸と脂
肪族ジアミンとの塩を縮重合して得られ−るポリアミド
である。ポリアミドを得るために用いられる芳香族ジカ
ルボン酸としては、イソフタル酸、テレフタル酸、２−
メチルテレフタル酸、２．５−ジメチルテレフタル酸等
が単独、又は二種以上の組み合せで用いることができる
。又、目的を損なわない範囲で、上記ジカルボン酸に加
えて、コハク酸、アジピン酸、スペリン酸、セバシン酸
、ドデカンニ酸等の脂肪族ジカルボン酸を併用して良い
。又、脂肪族ジアミンとしては、テトラメチレンジアミ
ン、ヘキサメチレンジアミン、２．５−ジメチルヘキサ
メチレンジアミン、トリメチルへキサメチレンジアミン
等が単独又は、二種以上の組み合せで用いることができ
る。The polyamide used in the present invention is a polyamide obtained by polycondensation of a salt of an aromatic dicarboxylic acid and an aliphatic diamine. Aromatic dicarboxylic acids used to obtain polyamide include isophthalic acid, terephthalic acid, 2-
Methyl terephthalic acid, 2,5-dimethyl terephthalic acid, etc. can be used alone or in combination of two or more. Furthermore, in addition to the above-mentioned dicarboxylic acids, aliphatic dicarboxylic acids such as succinic acid, adipic acid, sperinic acid, sebacic acid, and dodecanoic acid may be used in combination as long as the purpose is not impaired. Further, as the aliphatic diamine, tetramethylene diamine, hexamethylene diamine, 2,5-dimethylhexamethylene diamine, trimethylhexamethylene diamine, etc. can be used alone or in combination of two or more types.
本発明のポリアミドとして、さらに具体的には、テレフ
タル酸、イソフタル酸を用いた場合に、テレフタル酸及
びイソフタルＩ％ｔ ｍが、全モノマー１モルに対して
、０．３〜０．５モルであり、テレフタル酸／イソフタ
ル酸のモル比は、４７６〜６／４の範囲であることが好
ましい０機械的特性、耐溶剤性において特に優れている
のは、この比が４、ｓ１５．ｉ：〜５．５／４．５の範
囲であり、ジアミン成分としてヘキサメチレンジアミン
を用いることで得ることができる。又、テレフタル酸を
用いた場合にはジアミン成分として２．５−ジメチルヘ
キサメチレンジアミンを用いて得られるポリアミドが特
に好ましい。More specifically, when terephthalic acid and isophthalic acid are used as the polyamide of the present invention, the terephthalic acid and isophthalic I%t m is 0.3 to 0.5 mol based on 1 mol of all monomers. The molar ratio of terephthalic acid/isophthalic acid is preferably in the range of 476 to 6/4. Particularly excellent mechanical properties and solvent resistance are achieved when this ratio is 4, s15. i: ~5.5/4.5, and can be obtained by using hexamethylene diamine as the diamine component. Further, when terephthalic acid is used, a polyamide obtained using 2,5-dimethylhexamethylene diamine as the diamine component is particularly preferred.
又、本発明で用いるポリアミドは公知の方法で得られる
０例えば、当該ポリアミドの構成成分であるジカルボン
酸とジアミンとで塩を形成せしめ、加圧下に加熱し、縮
合重合させることにより製造することができる。In addition, the polyamide used in the present invention can be obtained by a known method.For example, it can be manufactured by forming a salt with a dicarboxylic acid and a diamine, which are constituent components of the polyamide, heating under pressure, and conducting condensation polymerization. can.
本発明の樹脂組成物における芳香族系ポリエーテル樹脂
とポリアミドとの配合割合は、芳香族ポリエーテル系樹
脂５〜９５重量％、ポリアミド９５〜５重量％である。The blending ratio of aromatic polyether resin and polyamide in the resin composition of the present invention is 5 to 95% by weight of aromatic polyether resin and 95 to 5% by weight of polyamide.
好ましくは芳香族ポリエーテル系樹脂２０〜８０重量％
、ポリアミド８０〜２０重量％である。芳香族ポリエー
テル系樹脂が５重量％より少ないと、高温時の機械的物
性が不良となり。Preferably aromatic polyether resin 20-80% by weight
, 80-20% by weight of polyamide. If the aromatic polyether resin is less than 5% by weight, the mechanical properties at high temperatures will be poor.
９５重量％を越えると成形加工が困難となるばかりでな
く、耐溶剤性が著しく低下する。If it exceeds 95% by weight, not only will molding become difficult, but also the solvent resistance will drop significantly.
本発明の樹脂Ｍｌ成酸物、通常の方法で得ることができ
る０例えば、芳香族ポリエーテル系樹脂とポリアミドと
を常用の二軸押出機等を用いて溶融混練することで得ら
れる。The resin M1 acid compound of the present invention can be obtained by a conventional method, for example, by melt-kneading an aromatic polyether resin and a polyamide using a conventional twin-screw extruder or the like.
以上、本発明の熱可塑性樹脂組成物について詳述したが
、本発明の目的を損わない範囲に於て、これらの組成物
にさらに他の樹脂ポリマー、着色剤、酸化劣化防止剤、
熱安定剤、紫外線吸収剤、滑剤、可・■剤、難燃剤等を
目的に応じて添加することができる。The thermoplastic resin compositions of the present invention have been described in detail above, but these compositions may further include other resin polymers, colorants, oxidative deterioration inhibitors,
Heat stabilizers, ultraviolet absorbers, lubricants, additives, flame retardants, etc. can be added depending on the purpose.
［実施例１
以ド、実施例により本発明の詳細な説明するが、本発明
はこれにより限定されるものではない。[Example 1] Hereinafter, the present invention will be explained in detail with reference to Examples, but the present invention is not limited thereto.
各実施例における成形品物性の測定は次のようにして行
なった。The physical properties of the molded products in each example were measured as follows.
・曲げ物性
ＡＳＴＭ−Ｄ−７９０に従い、２３℃及び１５０℃での
曲げ弾性率を測定した。- Bending properties The bending elastic modulus at 23°C and 150°C was measured according to ASTM-D-790.
・熱変形温度（ＨＯＴ）
ＡＳＴＭ−Ｄ−６４８に従い、高荷重１８．６Ｋｇ／ｃ
＋ｓ２テＪ１１定した。・Heat distortion temperature (HOT) High load 18.6Kg/c according to ASTM-D-648
+s2 Te J11 was fixed.
・１酎溶剤性
試験片を２３°Ｃの四塩化炭素に１２０時間浸漬後取り
出し、屹燥後の試験片のクラック発生状態を肉眼で観察
した。- 1. A solvent test piece was immersed in carbon tetrachloride at 23°C for 120 hours and then taken out, and the state of cracking in the test piece after drying was observed with the naked eye.
・成形品の剥離状態
試験゛片波断面に接着テープを付着させた後テープを取
りはずすという方法で、剥離試験を行った後の状態を肉
眼にて観察した。・Peeling condition test of molded product 《Adhesive tape was attached to the cross section of one wave, and then the tape was removed, and the condition after performing the peeling test was observed with the naked eye.
参考例１
テレフタル１％ｉ３２．２ｋｇ、イソフタル酸３２．２
ｋｇ及びヘキサメチレンジアミン４５ｋｇ及び水１０９
．４ｋｇを予め加熱した反応器に供給し、１２０°Ｃで
５時間かけて造塩及び濃縮を行なった。得られた濃縮液
を２３０℃に保持したオートクレーブに供給し、加圧下
に３１０℃まで昇温した。３１０℃、 １８ｋｇ／ｃｍ
２で２時間反応させた後降圧し、オートクレーブから排
出し冷却固化させてペレットを得た。得られたポリアミ
ドの硫酸粘度ηｒ＝１．７０であった。Reference example 1 Terephthal 1% i 32.2 kg, isophthalic acid 32.2
kg and hexamethylene diamine 45 kg and water 109 kg
．． 4 kg was supplied to a preheated reactor, and salt formation and concentration were performed at 120°C over 5 hours. The obtained concentrate was supplied to an autoclave maintained at 230°C, and the temperature was raised to 310°C under pressure. 310℃, 18kg/cm
After reacting for 2 hours under No. 2, the pressure was lowered, the autoclave was discharged, and the mixture was cooled and solidified to obtain pellets. The sulfuric acid viscosity ηr of the obtained polyamide was 1.70.
実施例１
参考例１のポリアミド３０重量部とη５ｐｉｃ （クロ
ロホルム溶液で測定）のポリ（２，６−ジメチルフェニ
レン−１，４−エーテル）７０重量部を予４ｎ混合し、
二軸押出機を用いて２９０℃で溶融混練し、ペレット化
した。得られたペレットを射出成形機を用いて２９０℃
の温度で試験片に成形し、物性を測定した。その結果を
第１表に示す。Example 1 30 parts by weight of the polyamide of Reference Example 1 and 70 parts by weight of poly(2,6-dimethylphenylene-1,4-ether) of η5pic (measured in a chloroform solution) were mixed in advance for 4N,
The mixture was melt-kneaded at 290°C using a twin-screw extruder and pelletized. The obtained pellets were heated to 290°C using an injection molding machine.
It was molded into a test piece at a temperature of The results are shown in Table 1.
比較例１
参考例１のポリアミドの代りに、ナイロン６を用いた以
外は実施例１と同様にして物性を測定した。その結果を
第１表に示す。Comparative Example 1 Physical properties were measured in the same manner as in Example 1 except that nylon 6 was used instead of the polyamide in Reference Example 1. The results are shown in Table 1.
比較例２
参考例１のポリアミドの代りに、ＭＸＤ−６ナイロン（
三菱瓦斯化学株式会社製、商品名「レニー」）を用いた
以外は実施例１と同様にして物性を測定した。その結果
を第１表に示す。Comparative Example 2 Instead of the polyamide of Reference Example 1, MXD-6 nylon (
The physical properties were measured in the same manner as in Example 1, except that a product (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "Renny") was used. The results are shown in Table 1.
実施例２〜３．比較例３〜４
実施例１と同じポリアミドとポリフェニレンエーテルを
第２表に示す組成に配合し、実施例１と同様にして試験
片を得て、熱変形温度、耐溶剤性及び剥離性を調べた。Examples 2-3. Comparative Examples 3 to 4 The same polyamide and polyphenylene ether as in Example 1 were blended into the composition shown in Table 2, test pieces were obtained in the same manner as in Example 1, and the heat distortion temperature, solvent resistance, and peelability were examined. Ta.
その結果を第２表に示す。The results are shown in Table 2.
第１表
第２表
［発明の効果］
本発明の樹脂Ｍ１成物は機械的物性、１耐熱性、耐溶剤
性、成形性に優れ、さらには高温雰囲気下での剛性低下
が少ないという優れた特性を有しており、高い信頼性が
要求される自動車部品材料、電気部品材料等に用いるこ
とができる。特に自動車アンダーフード部品材料として
有用である。Table 1 Table 2 [Effects of the Invention] The resin M1 composition of the present invention has excellent mechanical properties, heat resistance, solvent resistance, and moldability, and further has excellent properties such as less decrease in rigidity under high temperature atmosphere. It can be used for automobile parts materials, electrical parts materials, etc. that require high reliability. It is particularly useful as a material for automobile underhood parts.
Claims (4)
香族ジカルボン酸と脂肪族ジアミンとから得られる主鎖
中に芳香環を含むポリアミド９５〜５重量％とからなる
熱可塑性樹脂組成物。(1) Thermoplastic resin composition consisting of 5 to 95% by weight of aromatic polyether resin and 95 to 5% by weight of polyamide containing an aromatic ring in the main chain obtained from aromatic dicarboxylic acid and aliphatic diamine. .
チルフェニレン−１，４−エーテル）である特許請求の
範囲第１項記載の樹脂組成物。(2) The resin composition according to claim 1, wherein the aromatic polyether resin is poly(2,6-dimethylphenylene-1,4-ether).
酸である特許請求の範囲第１項記載のポリアミド。(3) The polyamide according to claim 1, wherein the aromatic dicarboxylic acid is terephthalic acid or isophthalic acid.
サメチレンジアミン、２，５−ジメチルヘキサメチレン
ジアミンである特許請求の範囲第１項記載のポリアミド
。(4) The polyamide according to claim 1, wherein the aliphatic diamine is tetramethylene diamine, hexamethylene diamine, or 2,5-dimethylhexamethylene diamine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61177694A JPH07100760B2 (en) | 1986-07-30 | 1986-07-30 | Thermoplastic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61177694A JPH07100760B2 (en) | 1986-07-30 | 1986-07-30 | Thermoplastic resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6335650A true JPS6335650A (en) | 1988-02-16 |
| JPH07100760B2 JPH07100760B2 (en) | 1995-11-01 |
Family
ID=16035471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61177694A Expired - Fee Related JPH07100760B2 (en) | 1986-07-30 | 1986-07-30 | Thermoplastic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07100760B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5073620A (en) * | 1988-03-30 | 1991-12-17 | Sumitomo Chemical Company, Limited | Thermoplastic resin composition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57200447A (en) * | 1981-06-03 | 1982-12-08 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether resin composition |
-
1986
- 1986-07-30 JP JP61177694A patent/JPH07100760B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57200447A (en) * | 1981-06-03 | 1982-12-08 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether resin composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5073620A (en) * | 1988-03-30 | 1991-12-17 | Sumitomo Chemical Company, Limited | Thermoplastic resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07100760B2 (en) | 1995-11-01 |
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