JPS6333916U - - Google Patents
Info
- Publication number
- JPS6333916U JPS6333916U JP12648186U JP12648186U JPS6333916U JP S6333916 U JPS6333916 U JP S6333916U JP 12648186 U JP12648186 U JP 12648186U JP 12648186 U JP12648186 U JP 12648186U JP S6333916 U JPS6333916 U JP S6333916U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- die extension
- cantilever
- supported
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12648186U JPS6333916U (de) | 1986-08-21 | 1986-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12648186U JPS6333916U (de) | 1986-08-21 | 1986-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6333916U true JPS6333916U (de) | 1988-03-04 |
Family
ID=31020320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12648186U Pending JPS6333916U (de) | 1986-08-21 | 1986-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6333916U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010092853A1 (ja) * | 2009-02-10 | 2010-08-19 | 三洋電機株式会社 | フレームパッケージの製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519848A (en) * | 1978-07-31 | 1980-02-12 | Toshiba Corp | Semiconductor element molding die |
-
1986
- 1986-08-21 JP JP12648186U patent/JPS6333916U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519848A (en) * | 1978-07-31 | 1980-02-12 | Toshiba Corp | Semiconductor element molding die |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010092853A1 (ja) * | 2009-02-10 | 2010-08-19 | 三洋電機株式会社 | フレームパッケージの製造方法 |