JPS6333643U - - Google Patents

Info

Publication number
JPS6333643U
JPS6333643U JP1986127387U JP12738786U JPS6333643U JP S6333643 U JPS6333643 U JP S6333643U JP 1986127387 U JP1986127387 U JP 1986127387U JP 12738786 U JP12738786 U JP 12738786U JP S6333643 U JPS6333643 U JP S6333643U
Authority
JP
Japan
Prior art keywords
component
rectifier
vehicle
view
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986127387U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0447972Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986127387U priority Critical patent/JPH0447972Y2/ja
Publication of JPS6333643U publication Critical patent/JPS6333643U/ja
Application granted granted Critical
Publication of JPH0447972Y2 publication Critical patent/JPH0447972Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331Disposition
    • H01L2224/3318Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181On opposite sides of the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Automatic Cycles, And Cycles In General (AREA)
  • Rectifiers (AREA)
JP1986127387U 1986-08-21 1986-08-21 Expired JPH0447972Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986127387U JPH0447972Y2 (enExample) 1986-08-21 1986-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986127387U JPH0447972Y2 (enExample) 1986-08-21 1986-08-21

Publications (2)

Publication Number Publication Date
JPS6333643U true JPS6333643U (enExample) 1988-03-04
JPH0447972Y2 JPH0447972Y2 (enExample) 1992-11-12

Family

ID=31022091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986127387U Expired JPH0447972Y2 (enExample) 1986-08-21 1986-08-21

Country Status (1)

Country Link
JP (1) JPH0447972Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187578A (ja) * 1997-07-09 1999-03-30 Kitagawa Ind Co Ltd 熱伝導スペーサ及びヒートシンク

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201457A (ja) * 1983-04-28 1984-11-15 Toshiba Corp 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201457A (ja) * 1983-04-28 1984-11-15 Toshiba Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187578A (ja) * 1997-07-09 1999-03-30 Kitagawa Ind Co Ltd 熱伝導スペーサ及びヒートシンク

Also Published As

Publication number Publication date
JPH0447972Y2 (enExample) 1992-11-12

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