JPS6333643U - - Google Patents

Info

Publication number
JPS6333643U
JPS6333643U JP1986127387U JP12738786U JPS6333643U JP S6333643 U JPS6333643 U JP S6333643U JP 1986127387 U JP1986127387 U JP 1986127387U JP 12738786 U JP12738786 U JP 12738786U JP S6333643 U JPS6333643 U JP S6333643U
Authority
JP
Japan
Prior art keywords
component
rectifier
vehicle
view
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986127387U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0447972Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986127387U priority Critical patent/JPH0447972Y2/ja
Publication of JPS6333643U publication Critical patent/JPS6333643U/ja
Application granted granted Critical
Publication of JPH0447972Y2 publication Critical patent/JPH0447972Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Automatic Cycles, And Cycles In General (AREA)
  • Rectifiers (AREA)
JP1986127387U 1986-08-21 1986-08-21 Expired JPH0447972Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986127387U JPH0447972Y2 (enrdf_load_stackoverflow) 1986-08-21 1986-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986127387U JPH0447972Y2 (enrdf_load_stackoverflow) 1986-08-21 1986-08-21

Publications (2)

Publication Number Publication Date
JPS6333643U true JPS6333643U (enrdf_load_stackoverflow) 1988-03-04
JPH0447972Y2 JPH0447972Y2 (enrdf_load_stackoverflow) 1992-11-12

Family

ID=31022091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986127387U Expired JPH0447972Y2 (enrdf_load_stackoverflow) 1986-08-21 1986-08-21

Country Status (1)

Country Link
JP (1) JPH0447972Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187578A (ja) * 1997-07-09 1999-03-30 Kitagawa Ind Co Ltd 熱伝導スペーサ及びヒートシンク

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201457A (ja) * 1983-04-28 1984-11-15 Toshiba Corp 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201457A (ja) * 1983-04-28 1984-11-15 Toshiba Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187578A (ja) * 1997-07-09 1999-03-30 Kitagawa Ind Co Ltd 熱伝導スペーサ及びヒートシンク

Also Published As

Publication number Publication date
JPH0447972Y2 (enrdf_load_stackoverflow) 1992-11-12

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