JPS63317333A - Conductive film - Google Patents
Conductive filmInfo
- Publication number
- JPS63317333A JPS63317333A JP62151412A JP15141287A JPS63317333A JP S63317333 A JPS63317333 A JP S63317333A JP 62151412 A JP62151412 A JP 62151412A JP 15141287 A JP15141287 A JP 15141287A JP S63317333 A JPS63317333 A JP S63317333A
- Authority
- JP
- Japan
- Prior art keywords
- film
- conductive
- polyurethane
- conductive film
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004814 polyurethane Substances 0.000 claims abstract description 26
- 229920002635 polyurethane Polymers 0.000 claims abstract description 26
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 21
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 21
- 239000000178 monomer Substances 0.000 claims abstract description 20
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 claims abstract description 11
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 6
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 71
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 12
- 239000000194 fatty acid Substances 0.000 claims description 12
- 229930195729 fatty acid Natural products 0.000 claims description 12
- 150000004665 fatty acids Chemical class 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 9
- 238000007788 roughening Methods 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 6
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229910003437 indium oxide Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920006254 polymer film Polymers 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 150000002736 metal compounds Chemical class 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000000470 constituent Substances 0.000 abstract 5
- 239000002131 composite material Substances 0.000 abstract 2
- 150000002193 fatty amides Chemical class 0.000 abstract 2
- 229920005749 polyurethane resin Polymers 0.000 abstract 1
- 239000002585 base Substances 0.000 description 31
- -1 polyethylene Polymers 0.000 description 29
- 238000000576 coating method Methods 0.000 description 13
- 239000010410 layer Substances 0.000 description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- 239000006185 dispersion Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 10
- 239000004094 surface-active agent Substances 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 125000003277 amino group Chemical group 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 7
- 125000000542 sulfonic acid group Chemical group 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 125000002843 carboxylic acid group Chemical group 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000003863 ammonium salts Chemical class 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 159000000000 sodium salts Chemical class 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- FSSPGSAQUIYDCN-UHFFFAOYSA-N 1,3-Propane sultone Chemical compound O=S1(=O)CCCO1 FSSPGSAQUIYDCN-UHFFFAOYSA-N 0.000 description 2
- ALRHLSYJTWAHJZ-UHFFFAOYSA-N 3-hydroxypropionic acid Chemical compound OCCC(O)=O ALRHLSYJTWAHJZ-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003995 emulsifying agent Substances 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 238000009775 high-speed stirring Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- XOAAWQZATWQOTB-UHFFFAOYSA-N taurine Chemical compound NCCS(O)(=O)=O XOAAWQZATWQOTB-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- AJRKQHPIXFOWJR-UHFFFAOYSA-N 1-amino-4-methylcyclohexa-2,4-diene-1-sulfonic acid Chemical compound CC1=CCC(N)(S(O)(=O)=O)C=C1 AJRKQHPIXFOWJR-UHFFFAOYSA-N 0.000 description 1
- QRVKXDOIGCOWLZ-UHFFFAOYSA-N 1-aminobutyl hydrogen sulfate Chemical compound CCCC(N)OS(O)(=O)=O QRVKXDOIGCOWLZ-UHFFFAOYSA-N 0.000 description 1
- KJEPTVKCXKLZLQ-UHFFFAOYSA-N 1-hydroxybutyl hydrogen sulfate Chemical compound CCCC(O)OS(O)(=O)=O KJEPTVKCXKLZLQ-UHFFFAOYSA-N 0.000 description 1
- WDJUECGLWKIEOV-UHFFFAOYSA-N 1-hydroxyethyl hydrogen sulfate Chemical compound CC(O)OS(O)(=O)=O WDJUECGLWKIEOV-UHFFFAOYSA-N 0.000 description 1
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 description 1
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 description 1
- UHAMPPWFPNXLIU-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)pentanoic acid Chemical compound CCCC(CO)(CO)C(O)=O UHAMPPWFPNXLIU-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- IXPWKHNDQICVPZ-UHFFFAOYSA-N 2-methylhex-1-en-3-yne Chemical compound CCC#CC(C)=C IXPWKHNDQICVPZ-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- GGZCIOXAKUOXRP-UHFFFAOYSA-N 3-hydroxypropyl hydrogen sulfate Chemical compound OCCCOS(O)(=O)=O GGZCIOXAKUOXRP-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- SJZRECIVHVDYJC-UHFFFAOYSA-N 4-hydroxybutyric acid Chemical compound OCCCC(O)=O SJZRECIVHVDYJC-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N Benzoic acid Natural products OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000008051 alkyl sulfates Chemical class 0.000 description 1
- 229940045714 alkyl sulfonate alkylating agent Drugs 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- HXBPYFMVGFDZFT-UHFFFAOYSA-N allyl isocyanate Chemical compound C=CCN=C=O HXBPYFMVGFDZFT-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 229960004050 aminobenzoic acid Drugs 0.000 description 1
- OBESRABRARNZJB-UHFFFAOYSA-N aminomethanesulfonic acid Chemical compound NCS(O)(=O)=O OBESRABRARNZJB-UHFFFAOYSA-N 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- WXBLLCUINBKULX-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1.OC(=O)C1=CC=CC=C1 WXBLLCUINBKULX-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229940031574 hydroxymethyl cellulose Drugs 0.000 description 1
- 229920003063 hydroxymethyl cellulose Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- WARQUFORVQESFF-UHFFFAOYSA-N isocyanatoethene Chemical compound C=CN=C=O WARQUFORVQESFF-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007759 kiss coating Methods 0.000 description 1
- SFIHQZFZMWZOJV-HZJYTTRNSA-N linoleamide Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(N)=O SFIHQZFZMWZOJV-HZJYTTRNSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- WFKDPJRCBCBQNT-UHFFFAOYSA-N n,2-dimethylprop-2-enamide Chemical compound CNC(=O)C(C)=C WFKDPJRCBCBQNT-UHFFFAOYSA-N 0.000 description 1
- HZHRYYYIOGLPCB-UHFFFAOYSA-N n,n-bis(hydroxymethyl)prop-2-enamide Chemical compound OCN(CO)C(=O)C=C HZHRYYYIOGLPCB-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- YOZHLACIXDCHPV-UHFFFAOYSA-N n-(methoxymethyl)-2-methylprop-2-enamide Chemical compound COCNC(=O)C(C)=C YOZHLACIXDCHPV-UHFFFAOYSA-N 0.000 description 1
- ULYOZOPEFCQZHH-UHFFFAOYSA-N n-(methoxymethyl)prop-2-enamide Chemical compound COCNC(=O)C=C ULYOZOPEFCQZHH-UHFFFAOYSA-N 0.000 description 1
- ZZJXLPCLJWLLIZ-UHFFFAOYSA-N n-[(dodecanoylamino)methyl]dodecanamide Chemical compound CCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCC ZZJXLPCLJWLLIZ-UHFFFAOYSA-N 0.000 description 1
- UAXZKOFYXXDTFH-UHFFFAOYSA-N n-[2-(hexadecanoylamino)ethyl]hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCC UAXZKOFYXXDTFH-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 1
- BPCNEKWROYSOLT-UHFFFAOYSA-N n-phenylprop-2-enamide Chemical compound C=CC(=O)NC1=CC=CC=C1 BPCNEKWROYSOLT-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- LTHCSWBWNVGEFE-UHFFFAOYSA-N octanamide Chemical compound CCCCCCCC(N)=O LTHCSWBWNVGEFE-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- MHYFEEDKONKGEB-UHFFFAOYSA-N oxathiane 2,2-dioxide Chemical compound O=S1(=O)CCCCO1 MHYFEEDKONKGEB-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- LADXKQRVAFSPTR-UHFFFAOYSA-M sodium;2-hydroxyethanesulfonate Chemical compound [Na+].OCCS([O-])(=O)=O LADXKQRVAFSPTR-UHFFFAOYSA-M 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229960003080 taurine Drugs 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、基材フィルムと導電性の層との密着性が改良
された導電性フィルムに関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a conductive film with improved adhesion between a base film and a conductive layer.
〈従来の技術〉
従来、ガラスや石英のような材料に導電性の層を形成さ
せた、例えば[ネサガラス]が知られ、液晶やEL、エ
レクトロクロミック等のディスプレーの電極、太陽電池
の電極、あるいは帯電防止。<Prior art> Conventionally, Nesa Glass, which is a material in which a conductive layer is formed on a material such as glass or quartz, is known, and is used as electrodes for displays such as liquid crystal, EL, and electrochromic, electrodes for solar cells, and antistatic.
EMIシールド材に使用されていた。It was used as an EMI shielding material.
しかしながら基材がガラス等である為、可撓性・加工性
、耐衝撃性に劣る欠点があった。However, since the base material is glass or the like, it has the disadvantage of being inferior in flexibility, workability, and impact resistance.
近年、基材として高分子フィルムを用いその上に導電性
の層を形成した導電性フィルム特に透明導電性フィルム
が注目をあびており、入出力の透明スイッチの電極とし
て、又可撓性を特徴としたEL、エレクトロクロミック
等のディスプレイの電極として利用され、今後ますます
需要の増大が予想されている。In recent years, conductive films, especially transparent conductive films, in which a polymer film is used as a base material and a conductive layer is formed thereon, have been attracting attention. It is used as an electrode for EL, electrochromic, and other displays, and demand is expected to increase in the future.
しかし、導電性フィルムは、基材フィルムと導電性の層
との密着性が充分でなく、前記の電極として用いた場合
、使用中に、基材フィルムと導電性の層とのはくりが発
生し耐久性が低下する問題があった。However, conductive films do not have sufficient adhesion between the base film and the conductive layer, and when used as the electrode, the base film and conductive layer peel off during use. However, there was a problem of decreased durability.
〈発明が解決しようとする問題点)
本発明は、かかる問題に鑑みなされたもので、基材フィ
ルムと導電性の層との密着性が高く実用耐久性のすぐれ
た導電性フィルムを提供するものである。(Problems to be Solved by the Invention) The present invention has been made in view of the above problems, and provides a conductive film that has high adhesion between the base film and the conductive layer and has excellent practical durability. It is.
〈問題点を解決するための手段〉
即ち、本発明は、前記の導電性フィルムにおいて、基材
フィルムと導電性の層との間に、ポリウレタン(A)、
アクリル系樹脂(B)、脂肪酸アミド又はビスアミド(
C)を主成分とする組成物よりなる層をもうけた導電性
フィルムである。<Means for Solving the Problems> That is, the present invention provides the above-mentioned conductive film, in which polyurethane (A), polyurethane (A),
Acrylic resin (B), fatty acid amide or bisamide (
It is a conductive film having a layer made of a composition containing C) as a main component.
本発明に使用される基材フィルムの高分子フィルムとし
ては、例えば、ポリエステル、ポリエチレン、ポリイミ
ド、ポリシーボネート、ポリ塩化ビニール、ポリフッ化
ビニール、ポリサルホン。Examples of the polymer film of the base film used in the present invention include polyester, polyethylene, polyimide, polybonate, polyvinyl chloride, polyvinyl fluoride, and polysulfone.
アクリル、ポリプロピレン、ポリエーテルサルホン、ポ
リエーテルケトン、ニトリルフェノールなどがあり、い
ずれも使用出来る。通常、寸法安定性9機械的強度1価
格の点からポリエステルが好んで用いられる。Acrylic, polypropylene, polyether sulfone, polyether ketone, nitrile phenol, etc. can be used. Usually, polyester is preferably used because of its dimensional stability, mechanical strength, and cost.
導電性の問としては次のもの即ち、
(1)金、銀、パラジウム、アルミニウムなどの金属の
薄膜
(2)沃化銅、酸化インジウム、酸化スズ、M化チタン
、酸化カドミウムなどを主成分とする金属化合物の薄膜
が知られている。本発明はこれらいずれも使用出来るが
、酸化スズを2〜20wt%ドープした酸化インジウム
の場合に本発明の効果が大きい。Regarding electrical conductivity, the following items are considered: (1) Thin films of metals such as gold, silver, palladium, and aluminum (2) Thin films containing copper iodide, indium oxide, tin oxide, titanium Mide, cadmium oxide, etc. as main components. Thin films of metal compounds are known. Although any of these can be used in the present invention, the effect of the present invention is greatest when indium oxide is doped with 2 to 20 wt % of tin oxide.
これらの導電性の層の膜厚は、目的とする用途により異
なるが、通常、1!電性、透明性、生産性等の面から電
極用としては100〜500^、帯電防止用としては2
0〜200人である。The thickness of these conductive layers varies depending on the intended use, but is usually 1! In terms of conductivity, transparency, productivity, etc., 100 to 500^ is recommended for electrodes, and 2 is used for antistatic purposes.
0 to 200 people.
これら導電性の層の形成は、物理蒸着法等従来公知の方
法により行なわれる。通常、真空R着払。These conductive layers are formed by conventionally known methods such as physical vapor deposition. Usually, vacuum R cash on delivery.
スパッタリング法、イオンブレーティング法が好んで用
いられる。Sputtering method and ion blating method are preferably used.
本発明の基材フィルムと′S電性の層との間にもうけら
れる密着性を高める層(以降“密着層″と略称)は、基
材フィルムの製膜途中に、又は一旦製膜の完了したフィ
ルムへ加工される。塵等の異物の付着防止、生産性等の
面から基材フィルムの製膜途中に加工するインライン加
工が好ましい。The layer for enhancing adhesion (hereinafter referred to as "adhesion layer") formed between the base film of the present invention and the S-electroconductive layer can be formed during the film formation of the base film or once the film formation is completed. processed into a film. In-line processing, which is performed during the production of the base film, is preferred from the viewpoint of preventing the adhesion of foreign substances such as dust and productivity.
例えば、ポリエステルフィルムの場合は、板状にポリエ
ステル樹脂を溶融押出し、常法でフィルム状となし、結
晶配向が完了する前のフィルムの片面に密着層を塗布し
、次いで乾燥、延伸、熱処理を施して結晶配向を完了せ
しめることにより密着層付基材フィルムを得ることがで
きる。For example, in the case of a polyester film, polyester resin is melt-extruded into a plate shape, formed into a film using a conventional method, an adhesive layer is applied to one side of the film before crystal orientation is completed, and then drying, stretching, and heat treatment are performed. By completing the crystal orientation, a base film with an adhesive layer can be obtained.
本発明の密着層の前記成分(A)のポリウレタンは水性
ポリウレタンが好ましく、該水性ポリウレタンは、好ま
しくは、カルボン酸塩基、スルホン酸塩基または硫酸半
エステル塩基によって水への親和性が高められたもので
あり、通常かかる水親和性付与基はポリウレタン合成時
ないし合成後に導入される。The polyurethane of the component (A) of the adhesive layer of the present invention is preferably a water-based polyurethane, and the water-based polyurethane is preferably one whose affinity for water is increased by a carboxylic acid group, a sulfonic acid group, or a sulfuric acid half-ester base. Such a water affinity-imparting group is usually introduced during or after polyurethane synthesis.
例えば、カルボン酸塩基の導入は、ポリウレタン合成時
、原料ポリとドロキシ化合物の1つとしてカルボン酸基
含有ポリヒドロキシ化合物を用いるか、未反応イソシア
ネート基を有するポリウレタンの該イソシアネート基に
水酸基含有カルボン酸やアミノ基含有カルボン酸を反応
させ、次いで反応生成物を高速撹拌下でアルカリ水溶液
中に添加し、中和する等によって行なうことができる。For example, a carboxylic acid group can be introduced by using a carboxylic acid group-containing polyhydroxy compound as one of the raw material poly and droxy compounds during polyurethane synthesis, or by introducing a hydroxyl group-containing carboxylic acid group into the isocyanate group of a polyurethane having unreacted isocyanate groups. This can be carried out by reacting an amino group-containing carboxylic acid, then adding the reaction product to an alkaline aqueous solution under high speed stirring, and neutralizing it.
また、スルホン酸塩基または硫酸半エステル塩基の導入
は、通常ポリヒドロキシ化合物、ポリイソシアネート及
び鎖延長剤からプレポリマーを生成させ、これに末端イ
ソシアネート基と反応しうるアミノ基または水酸基とス
ルホン酸塩基または硫酸半エステル塩基とを分子内に有
する化合物を添加1反応させ、最終的に分子内にスルホ
ン酸塩基または硫酸半エステル塩基を有する水性ポリウ
レタンを得ることで行なうことができる。その際生成反
応は有機溶剤中で行ない、次いで水を加えてから該溶剤
を除去することが好ましい。また伯の方法としてはスル
ホン酸基を有する化合物を原料の一つとして使用してス
ルホン酸基を有するポリウレタンを合成し、次いで該ポ
リウレタンを高速撹拌下でアルカリ水溶液中に添加し、
中和する方法、ポリウレタの主鎖又は側鎖の1級又は2
級アミノ基にアルカリの存在下で下記サルトン化合物を
付加してスルホン酸アルカリ塩(例えば−8O3Na等
)を導入する方法等があげられる。In addition, the introduction of a sulfonic acid group or a sulfuric acid half-ester base is usually carried out by forming a prepolymer from a polyhydroxy compound, a polyisocyanate, and a chain extender, and adding an amino group or a hydroxyl group that can react with the terminal isocyanate group and a sulfonic acid group or This can be carried out by adding and reacting a compound having a sulfuric acid half ester base in its molecule, and finally obtaining an aqueous polyurethane having a sulfonic acid group or a sulfuric acid half ester base in its molecule. In this case, it is preferable to carry out the formation reaction in an organic solvent, then add water and then remove the solvent. Moreover, in Haku's method, a polyurethane having a sulfonic acid group is synthesized using a compound having a sulfonic acid group as one of the raw materials, and then the polyurethane is added to an alkaline aqueous solution under high speed stirring.
Method of neutralizing primary or secondary polyurethane main chain or side chain
Examples include a method in which an alkali sulfonic acid salt (for example, -8O3Na, etc.) is introduced by adding the following sultone compound to a class amino group in the presence of an alkali.
アルカリ水溶液としては水酸化ナトリウム、水酸化カリ
ウム、アンモニア、アルキルアミン等の水溶液を用いる
ことが好ましいが、該アルカリが被覆膜〈下塗り膜)中
に残留しないアンモニア、乾固条件で揮発するアミンが
特に好ましい。As the alkaline aqueous solution, it is preferable to use an aqueous solution of sodium hydroxide, potassium hydroxide, ammonia, alkylamine, etc., but the alkali does not remain in the coating film (undercoating film), such as ammonia and amines that volatilize under drying conditions. Particularly preferred.
カルボン酸塩基、スルホン酸塩基、硫酸半エステル塩基
等の塩基の間は0.5〜15重t%が好ましい。塩基の
割合が少なすぎるとポリウレタンの水親和性が不足して
塗布液の調製が難しくなり、また多すぎるとポリウレタ
ン本来の特性が損われるので、好ましくない。かかる水
性ポリウレタンは、所望により分散助剤を用いて、安定
な水分散液を形成するものないし水溶液を形成するもの
である。The amount of bases such as carboxylic acid bases, sulfonic acid bases, and sulfuric acid half ester bases is preferably 0.5 to 15% by weight. If the proportion of the base is too small, the water affinity of the polyurethane will be insufficient, making it difficult to prepare a coating solution, and if it is too large, the inherent properties of the polyurethane will be impaired, which is not preferable. Such aqueous polyurethane forms a stable aqueous dispersion or aqueous solution using a dispersion aid if desired.
ポリウレタンの合成に用いるポリヒドロキシ化合物とし
ては、例えばポリエチレングリコール。Examples of polyhydroxy compounds used in the synthesis of polyurethane include polyethylene glycol.
ポリプロピレングリコール、ポリエチレン・プロピレン
グリコール、ポリテトラメチレングリコール、ヘキサメ
チレングリコール、テトラメチレングリコール、1,5
−ベンタンジオール、ジエチレングリコール、トリエチ
レングリコール、ポリカプロラクトン、ポリへキサメチ
レンアジペート。Polypropylene glycol, polyethylene propylene glycol, polytetramethylene glycol, hexamethylene glycol, tetramethylene glycol, 1,5
-bentanediol, diethylene glycol, triethylene glycol, polycaprolactone, polyhexamethylene adipate.
ポリへキサメチレンセバケート、ポリテトラメチレンア
ジペート、ポリテトラメチレンセバケート。Polyhexamethylene sebacate, polytetramethylene adipate, polytetramethylene sebacate.
トリメチロールプロパン、トリメチロールエタン。Trimethylolpropane, trimethylolethane.
ペンタエリスリトール、グリセリン等を挙げることがで
きる。Examples include pentaerythritol and glycerin.
ポリイソシアネート化合物としては、例えばヘキサメチ
レンジイソシアネート、ジフェニルメタンジイソシアネ
ート、トリレンジイソシアネート。Examples of the polyisocyanate compound include hexamethylene diisocyanate, diphenylmethane diisocyanate, and tolylene diisocyanate.
イソホロンジイソシアネート、トリレンジイソシアネー
トとトリメチロールプロパンの付加物、ヘキサメチレン
ジイソシアネートとトリメチロールエタンの付加物等を
挙げることができる。カルボン酸含有ポリオールとして
は、例えばジメチロールプロピオン酸、ジメチロール酪
酸、ジメチロール吉草酸、トリメリット酸ビス(エチレ
ングリコール)エステル等を挙げることができる。Examples include isophorone diisocyanate, an adduct of tolylene diisocyanate and trimethylolpropane, and an adduct of hexamethylene diisocyanate and trimethylolethane. Examples of the carboxylic acid-containing polyol include dimethylolpropionic acid, dimethylolbutyric acid, dimethylolvaleric acid, and trimellitic acid bis(ethylene glycol) ester.
アミノ酸含有カルボン酸としては、例えばβ−アミノプ
ロピオン酸、γ−アミノ酪if1. P−アミノ安息香
酸等を挙げることができる。水酸基含有カルボン酸とし
ては、例えば3−ヒドロキシプロピオン酸、γ−ヒドロ
キシ酪酸、P−(2−ヒドロキシエチル)安息香酸、リ
ンゴ酸等を挙げることができる。Examples of amino acid-containing carboxylic acids include β-aminopropionic acid, γ-aminobutyroif1. Examples include P-aminobenzoic acid. Examples of the hydroxyl group-containing carboxylic acid include 3-hydroxypropionic acid, γ-hydroxybutyric acid, P-(2-hydroxyethyl)benzoic acid, and malic acid.
アミノ基または水酸基とスルホン基を有する化合物とし
ては、例えばアミノメタンスルホン酸。Examples of compounds having an amino group or a hydroxyl group and a sulfonic group include aminomethanesulfonic acid.
2−アミノエタンスルホン酸、2−アミノ−5−メチル
ベンゼン−2−スルホン酸、β−ヒドロキシェタンスル
ホン酸ナトリウム、脂肪族ジ第1級アミン化合物のプロ
パンサルトン、ブタンサルトン付加生成物等が挙げられ
、好ましくは脂肪族ジ第1級アミン化合物のプロパンサ
ルトン付加物があげられる。Examples include 2-aminoethanesulfonic acid, 2-amino-5-methylbenzene-2-sulfonic acid, sodium β-hydroxyethanesulfonate, propane sultone and butane sultone addition products of aliphatic diprimary amine compounds, etc. Preferred examples include propane sultone adducts of aliphatic diprimary amine compounds.
更にアミン基または水酸基と硫酸半エステル呈を含有す
る化合物としては、例えばアミノエタノール5AM、エ
チレンジアミンエタノール硫酸、アミノブタノール硫酸
、ヒドキシエタノール硫酸。Examples of compounds containing an amine group or a hydroxyl group and a sulfuric acid half ester include aminoethanol 5AM, ethylenediamineethanol sulfate, aminobutanol sulfate, and hydroxyethanol sulfate.
γ−ヒドロキシプロパツール硫酸、α−ヒドロキシブタ
ノール硫酸等があげられる。Examples include γ-hydroxypropanol sulfate and α-hydroxybutanol sulfate.
これら化合物を用いてのポリウレタンの合成は従来から
良く知られている方法で合成することができる。Polyurethane can be synthesized using these compounds by conventionally well-known methods.
次に、同じく本発明の密着層の前記成分(B)のアクリ
ル系樹脂としては、メチルメタクリレート成分斥40〜
80モル%であり、これらと共重合可能な他のビニルモ
ノマー成分が20〜60モル%である水性アクリル樹脂
が好ましい。Next, as the acrylic resin as the component (B) of the adhesive layer of the present invention, the methyl methacrylate component ranges from 40 to 40.
Preferably, the aqueous acrylic resin contains 80 mol % of the vinyl monomer component and 20 to 60 mol % of other vinyl monomer components copolymerizable therewith.
上記アクリル系樹脂中のメチルメタクリート成分が40
モル%未満では、塗膜が強度低下、軟質化傾向を示し、
耐ブロッキングの悪化によるハンドリング性の低下等で
好ましくない。一方、メチルメタクリレート成分が80
モル%を越えると、塗膜が硬質化傾向を示して脆くなり
、更に基材との密着性が低下したり、造膜性が劣る等で
好ましくない。The methyl methacrylate component in the above acrylic resin is 40%
If it is less than mol%, the coating film tends to decrease in strength and become soft,
This is undesirable due to the deterioration of handling properties due to deterioration of blocking resistance. On the other hand, the methyl methacrylate component is 80%
If the amount exceeds mol %, the coating film tends to harden and become brittle, and furthermore, the adhesion to the base material decreases and the film forming property is deteriorated, which is not preferable.
アクリル系樹脂の構成成分であるメチルメタクリレート
と共重合可能な他のビニルモノマー(共重合モノマー)
としては、例えば、アルキルアクリレート(アルキル基
としてはメチル基、エチル基、n−プロピル基、イソプ
ロピル基、n−ブチル基、イソブチル基、t−ブチル基
、2−エチルヘキシル基、シクロヘキシル基、フェニル
基、ベンジル基、フェニルエチル基等):アルキルメタ
クリレート(アルキル基としては、上記アルキルアクリ
レートのアルキル基として例示したものでメチル基を除
いたもの):2−ヒドロキシエチルアクリレート、2−
ヒドロキシエチルメタクリレート、2−ヒドロキシプロ
ピルアクリレート、2−ヒドロキシプロピルメタクリレ
ート等の如きヒドロキシ含有モノマーニアクリルアミド
、メタクリルアミド、N−メチルメタクリルアミド、N
−メチルアクリルアミド、N−メチロールアクリルアミ
ド、N−メチロールメタクリルアミド。Other vinyl monomers (copolymerizable monomers) that can be copolymerized with methyl methacrylate, which is a component of acrylic resins.
Examples include alkyl acrylate (alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, 2-ethylhexyl group, cyclohexyl group, phenyl group, benzyl group, phenylethyl group, etc.): Alkyl methacrylate (the alkyl group is one exemplified as the alkyl group of the above-mentioned alkyl acrylate, excluding the methyl group): 2-hydroxyethyl acrylate, 2-
Hydroxy-containing monomers such as hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, etc. Niacrylamide, methacrylamide, N-methylmethacrylamide, N
-Methylacrylamide, N-methylol acrylamide, N-methylol methacrylamide.
N、N−ジメチロールアクリルアミド、N−メトキシメ
チルアクリルアミド、N−メトキシメチルメタクリルア
ミド、N−フェニルアクリルアミド等の如さアミド基含
有モノマー;N、N−ジエチルアミノエチルアクリレー
ト、N、N−ジエチルアミノエチルメタクリレート等の
如きアミノ基含有モノマー:グリシジルアクリレート、
グリシジルメタクリレート、アリルグリシジルエーテル
等の如き工、ボキシ基含有モノマー:スチレンスルホン
酸、ビニルスルホン酸およびそれらの塩(ナトリウム塩
、カリウム塩、アンモニウム塩等)等の如きスルホン酸
基またはその塩を含有するモノマー;クロトン酸、イタ
コン酸、アクリル酸、マレイン酸、フマール酸及びそれ
らの塩(ナトリウム塩、カリウム塩、アンモニウム塩等
)等の如きカルボキシル基またはその塩を含有するモノ
マー:無ホマレイン酸、無水イタコン酸等の如き酸無水
物を含有するモノマー;その他、ビニルイソシアネート
、アリルイソシアネート、スチレン、ビニルメチルエー
テル、ビニルエチルエーテル、ビニルトリスアルコキシ
シラン、アルキルマレイン酸モノエステル、アルキルフ
マール酸モノエステル。Amide group-containing monomers such as N,N-dimethylolacrylamide, N-methoxymethylacrylamide, N-methoxymethylmethacrylamide, N-phenylacrylamide; N,N-diethylaminoethyl acrylate, N,N-diethylaminoethyl methacrylate, etc. Amino group-containing monomers such as: glycidyl acrylate,
Boxy group-containing monomers such as glycidyl methacrylate, allyl glycidyl ether, etc. Containing sulfonic acid groups or their salts such as styrene sulfonic acid, vinyl sulfonic acid, and their salts (sodium salt, potassium salt, ammonium salt, etc.) Monomers: Monomers containing carboxyl groups or salts thereof such as crotonic acid, itaconic acid, acrylic acid, maleic acid, fumaric acid and their salts (sodium salts, potassium salts, ammonium salts, etc.): Fomaleic anhydride, itaconic anhydride Monomers containing acid anhydrides such as acids; others, vinyl isocyanate, allyl isocyanate, styrene, vinyl methyl ether, vinyl ethyl ether, vinyl tris alkoxysilane, alkyl maleic acid monoester, alkyl fumaric acid monoester.
アクリロニトリル、メタクリロニトリル、アルキルイタ
コン酸モノエステル、塩化ビニリデン、酢酸ビニル、塩
化ビニル等が挙げられる。Examples include acrylonitrile, methacrylonitrile, alkyl itaconic acid monoester, vinylidene chloride, vinyl acetate, and vinyl chloride.
これら共重合モノマーは1種若しくは2種以上の組合せ
で自由に選択されるが、アクリル系樹脂への親水性付与
、水性液の分散安定性、基材との密着性等から、水酸基
、アミド基やカルボキシル基またはその塩(ナトリウム
塩、カリウム塩、アンモニウム塩等)等の官能基を有す
るものが好ましい。These copolymerizable monomers can be freely selected singly or in combination of two or more, but from the viewpoint of imparting hydrophilicity to the acrylic resin, dispersion stability of the aqueous liquid, adhesion to the base material, etc., hydroxyl groups, amide groups, etc. Those having a functional group such as a carboxyl group or a salt thereof (sodium salt, potassium salt, ammonium salt, etc.) are preferable.
また、塗膜の耐熱性1強度、耐水性等の改善には、熱硬
化タイプが好適であり、例えば、エポキシ基含有モノマ
ーとアミノ基、酸無水物基、カルボキシル基、ヒトOキ
シル基またはN−メチロール基含有モノマーとの組合せ
:N−メチO−ルまたはN−メチロールエーテル基含有
モノマーとカルボキシル基またはアミノ基含有モノマー
との組合せ等が例示でき、また、カルボン酸塩基やメチ
ロール基のように単独でも熱硬化性を有する場合も含ま
れる。これらの反応性基の1種または2種以上の組合せ
は、1種のアクリル系樹脂または2種以上のアクリル系
樹脂に任意に導入することができ、要すれば、加熱時互
いに反応し得る基を有するアクリル系樹脂の組合せにす
れば良い。また、低分子吊物質(例えば、アルキロール
化メラミン等)でアクリル系樹脂中の反応性基と加熱時
互いに反応し得る基を有するものを1種以上添加するこ
ともできる。In addition, thermosetting types are suitable for improving the heat resistance 1 strength, water resistance, etc. of coating films. For example, epoxy group-containing monomers and amino groups, acid anhydride groups, carboxyl groups, human oxygen groups or N - Combination with a monomer containing a methylol group: Examples include a combination of a monomer containing an N-methylol or N-methylol ether group and a monomer containing a carboxyl group or an amino group. It also includes cases where it has thermosetting properties even when used alone. One type or a combination of two or more of these reactive groups can be optionally introduced into one type of acrylic resin or two or more types of acrylic resins, and if necessary, groups that can react with each other during heating may be introduced. A combination of acrylic resins having the following properties may be used. Furthermore, one or more types of low-molecular weight substances (eg, alkylolated melamine, etc.) having groups that can react with the reactive groups in the acrylic resin when heated can also be added.
アクリル系樹脂の水性液の製造法は、公知の任意の方法
で実施できる。例えば、水分散系での乳化重合法を例示
すると、イオン交換水に乳化分散剤(ドデシルベンゼン
スルホン酸ナトリウム等の界面活性剤)、水溶性重合開
始剤(過硫酸アンモニウム等の過酸化物)1重合促進剤
(酸性亜硫酸ナトリウム等の還元剤)を適当量添加し、
所定の温度(例えば、50〜90℃)で、所定の撹拌速
度で撹拌しながら、モノマー所定量のおよそ10〜50
重口%となるように添加し、重合が開始されたら、短時
間添加を中断後、残りの七ツマ−を一定速度で添加し、
同一条件で数時間乳化重合することによって、アクリル
系樹脂の水性分散液を製造することが出来る。The aqueous liquid of acrylic resin can be produced by any known method. For example, to illustrate an emulsion polymerization method in an aqueous dispersion system, one polymerization of an emulsifying dispersant (a surfactant such as sodium dodecylbenzenesulfonate) and a water-soluble polymerization initiator (a peroxide such as ammonium persulfate) is carried out in ion-exchanged water. Add an appropriate amount of accelerator (reducing agent such as acidic sodium sulfite),
Approximately 10-50% of a given amount of monomer is added at a given temperature (e.g. 50-90°C) and with stirring at a given stirring speed.
When polymerization has started, the addition is interrupted for a short time, and the remaining 70% is added at a constant rate.
An aqueous dispersion of acrylic resin can be produced by emulsion polymerization under the same conditions for several hours.
上記反応に用いられる界面活性剤の添加量は共重合モノ
マー成分に対して5重量%以下、好ましくは1〜2重量
%が良好であり、平均粒子径的0.2μm以下の微細粒
径のものが得られる。尚、必要に応じて、分子i′a整
剤(例えばメルカプタン類)や分散補助剤(例えばポリ
ビニル−アルコール、ヒドロキシメチルセルロース等の
高分子保護コロイド類)等を添加しても良い。The amount of the surfactant used in the above reaction is preferably 5% by weight or less, preferably 1 to 2% by weight based on the copolymerization monomer component, and the surfactant has a fine particle size of 0.2 μm or less in terms of average particle size. is obtained. Incidentally, if necessary, a molecular i'a conditioner (for example, mercaptans), a dispersion aid (for example, polyvinyl alcohol, polymeric protective colloids such as hydroxymethylcellulose), etc. may be added.
その他、上記の低分子量界面活性剤に代る高分子量界面
活性剤の応用0反応性界面活性剤の応用。In addition, applications of high molecular weight surfactants in place of the above-mentioned low molecular weight surfactants; applications of zero-reactive surfactants;
界面活性剤を含有しない所謂ソープフリー重合による製
造法も採用し得る。A production method using so-called soap-free polymerization that does not contain a surfactant may also be adopted.
次に、同じく本発明の密着層の成分(C)の脂肪酸アミ
ド又はビスアミドとしては、炭素数6〜22の飽和又は
不飽和脂肪酸のアミド、炭素数13〜50で分子ffl
200〜800のN、N’ −アルキレンビスアミド
等が好ましく挙げられる。更に具体的には、N、N’
−メチレンビス−ステアリン酸アミド、N、N’ −エ
チレンビスパルミチン酸アミド。Next, as the fatty acid amide or bisamide of the component (C) of the adhesive layer of the present invention, an amide of a saturated or unsaturated fatty acid having 6 to 22 carbon atoms, a molecule ffl having 13 to 50 carbon atoms,
200 to 800 N,N'-alkylene bisamide and the like are preferably mentioned. More specifically, N, N'
-methylenebis-stearamide, N,N'-ethylenebispalmitic acid amide.
N、N’−メチレンビスラウリン酸アミド、リノール酸
アミド、カプリル酸アミド、ステアリン酸アミド等を例
示できる。これらのうち特に下記式%式%
(但し、RCO−:脂肪酸残基、n=1又は2)で示さ
れるビスアミドが好ましい。Examples include N,N'-methylenebislauric acid amide, linoleic acid amide, caprylic acid amide, and stearic acid amide. Among these, bisamides represented by the following formula % (where RCO-: fatty acid residue, n=1 or 2) are particularly preferred.
これらの脂肪酸アミド又はビスアミドは有様溶剤に溶解
するか又はエマルジョンや懸濁液として水性液の形で用
いることができる。この場合、乳化剤や界面活性剤を用
いてもよい。These fatty acid amides or bisamides can be dissolved in a specific solvent or used in the form of an aqueous liquid as an emulsion or suspension. In this case, an emulsifier or a surfactant may be used.
本発明に於て、上記ポリウレタン(A)、アクリル系樹
脂(B)、及び脂肪酸アミド又はビスアミド(C)の水
溶液又は分散液もしくは乳化液が用いられるが、必要な
らば、易滑性をもたせるために、粗面化物質(D)が混
入されていてもよい。In the present invention, an aqueous solution, dispersion, or emulsion of the above-mentioned polyurethane (A), acrylic resin (B), and fatty acid amide or bisamide (C) is used. A surface roughening substance (D) may be mixed into the surface roughening substance (D).
粗面化物質(D)としてはポリスチレン、ポリメチルメ
タクリレート、メチルメタクリレート共重合体、ポリテ
トラフルオロエチレン、ポリビニリデンフルオライド若
しくはポリアクリロニトリル。The roughening substance (D) is polystyrene, polymethyl methacrylate, methyl methacrylate copolymer, polytetrafluoroethylene, polyvinylidene fluoride or polyacrylonitrile.
ベンゾグアナミン樹脂等の如き有機質微粉末、またはシ
リカ、アルミナ、二酸化チタン、カオリン。Organic fine powder such as benzoguanamine resin, or silica, alumina, titanium dioxide, kaolin.
タルク、グラファイト、炭酸カルシウム、長石。Talc, graphite, calcium carbonate, feldspar.
二硫化モリブデン、カーボンブラックもしくは硫酸バリ
ウム等の如き無機質微粉末等が挙げられ、これらは乳化
剤等を用いて水性分散液としたものであってもよく、ま
た、微粉末状でポリウレタン水性液、アクリル系樹脂水
性液、脂肪酸アミド又はビスアミド水性液等に添加でき
るものであってもよい。Examples include fine inorganic powders such as molybdenum disulfide, carbon black, or barium sulfate, which may be made into an aqueous dispersion using an emulsifier or the like; It may be one that can be added to an aqueous resin solution, a fatty acid amide or bisamide aqueous solution, or the like.
この粗面化物質(D)は平均粒径0.15μm以下の微
粒子であり、好ましくは0.01〜0.1μmである。This surface roughening substance (D) is fine particles with an average particle size of 0.15 μm or less, preferably 0.01 to 0.1 μm.
また、これら粗面化物質(D)は水分散液中で沈降する
のを避けるため、比重が3を超えない超微粒子を選ぶこ
とが好ましい。Furthermore, in order to avoid sedimentation of these surface roughening substances (D) in the aqueous dispersion, it is preferable to select ultrafine particles whose specific gravity does not exceed 3.
本発明の密着層の主成分たるポリウレタン(A)、アク
リル系樹脂(B)、脂肪酸アミド又はビスアミド(C)
の混合割合は通常、[(A)+ (B)]/ (C)=
98/2〜40/ 60且っ(A)/ (B ) =9
0/10〜10/90(固形分換篩:重1%)の範囲で
あることが好ましい。なお粗面化物質(D)を混入する
場合の混合割合は、[(A>+(B)+ (C)]/
(D)=98/2〜40/ 60の範囲が好ましい。Polyurethane (A), acrylic resin (B), fatty acid amide or bisamide (C) which is the main component of the adhesive layer of the present invention
The mixing ratio of is usually [(A)+(B)]/(C)=
98/2~40/60 (A)/(B) = 9
It is preferably in the range of 0/10 to 10/90 (solid content exchange sieve: 1% by weight). In addition, when mixing the surface roughening substance (D), the mixing ratio is [(A>+(B)+(C)]/
(D) is preferably in the range of 98/2 to 40/60.
アクリル系樹脂<8)や、脂肪酸アミド又はビスアミド
(C)の混合割合が少なすぎると、摩擦力が上昇して、
ハンドリング性を悪化させ、また多すぎると基材フィル
ムとの密着性を低下させたり、フィルムの易滑性が低減
してくる。If the mixing ratio of acrylic resin <8), fatty acid amide or bisamide (C) is too small, the frictional force will increase,
Handling properties are deteriorated, and if the amount is too large, the adhesion to the base film is reduced and the slipperiness of the film is reduced.
本発明において、基材フィルム表面に密着層を円滑に塗
設できるようにするために、予備処理としてフィルム表
面にコロ±放電処理をほどこすか、または密着層の組成
物とともにこれと化学的に不活性な界面活性剤を併用す
ることが好ましい。In the present invention, in order to be able to smoothly coat the adhesive layer on the surface of the base film, the film surface is subjected to colloidal discharge treatment as a preliminary treatment, or it is chemically incompatible with the composition of the adhesive layer. It is preferable to use an active surfactant in combination.
かかる界面活性剤は組成物水性液の表面張力を40dy
ne/ cm以下に降下できるようなポリエステルフィ
ルム等の高分子フィルムへの濡れを促進するものであり
、例えば、ポリオキシエチレンアルキルフェニルエーテ
ル、ポリオキシエチレン−脂肪酸エステル、ソルビタン
脂肪酸エステル、グリセリン脂肪酸エステル、脂肪酸金
属石鹸、アルキル硫酸塩、アルキルスルホン酸塩、アル
キルスルホコハク酸塩等のアニオン型、ノニオン型界面
活性剤等を挙げることができる。更に、本発明の効果を
消失させない範囲において、例えば帯電防止剤。Such surfactants lower the surface tension of the aqueous composition by 40 dy.
It promotes wetting of polymer films such as polyester films that can drop to below ne/cm, and includes, for example, polyoxyethylene alkylphenyl ether, polyoxyethylene fatty acid ester, sorbitan fatty acid ester, glycerin fatty acid ester, Examples include anionic and nonionic surfactants such as fatty acid metal soaps, alkyl sulfates, alkyl sulfonates, and alkyl sulfosuccinates. Furthermore, antistatic agents, for example, may be used within a range that does not impair the effects of the present invention.
紫外線吸収剤、潤滑剤等の他の添加剤を混合することが
できる。Other additives such as UV absorbers, lubricants, etc. can be mixed.
本発明においてはかくして調整された水性液は好ましく
は前述の通り例えば結晶配向が完了する前のポリエステ
ルフィルム等の少なくとも片面に塗布される。その際の
水性液の固形分濃度は、通常の30重積%以下であり、
15重量%以下が好ましい。粘度は100cps以下、
好ましくは20cps以下が適当である。塗布量は走行
しているフィルム1′rrL当り約0.5〜209更に
は1〜10gが好ましい。換言すれば、最終的に得られ
る基材フィルムにおいて、フィルムの一表面に1尻当り
約0.001〜1g、更には約0.01〜0.3gの固
形分が好ましい。In the present invention, the aqueous liquid thus prepared is preferably applied to at least one side of the polyester film, etc., before the crystal orientation is completed, as described above. The solid content concentration of the aqueous liquid at that time is less than the usual 30% by weight,
It is preferably 15% by weight or less. Viscosity is less than 100 cps,
Preferably, 20 cps or less is appropriate. The coating amount is preferably about 0.5 to 209 g, more preferably 1 to 10 g, per 1'rrL of the running film. In other words, in the base film finally obtained, the solid content is preferably about 0.001 to 1 g, more preferably about 0.01 to 0.3 g per surface of the film.
塗布方法としては、公知の任意の塗工法が適用できる。Any known coating method can be used as the coating method.
例えばロールコート法、グラビアコート法、ロールプラ
ッシュ法、スプレーコート法、エアーナイフコート法、
含浸法およびカーテンコート法などを単独または組み合
せて適用するとよい。For example, roll coating method, gravure coating method, roll plush method, spray coating method, air knife coating method,
It is preferable to apply an impregnation method, a curtain coating method, etc. alone or in combination.
本発明においては、ポリエステルの場合は上記水性液は
縦−軸延伸が施された直後のフィルムに塗布され、次い
で該フィルムを横延伸および熱固定のためのテンターに
導くのが、特に好ましい。In the present invention, in the case of polyester, it is particularly preferred that the aqueous liquid is applied to the film immediately after longitudinal-axial stretching, and then the film is introduced into a tenter for transverse stretching and heat-setting.
塗布物は、未固化の塗膜の状態でフィルムの延伸に伴っ
てその面積が拡大されかつ加熱されて水を揮散し、二輪
配向されたフィルム表面に強固に固着される。The area of the coated product is expanded as the film is stretched in an unsolidified state, and is heated to volatilize water and firmly adhere to the surface of the two-wheel oriented film.
この加熱は、好ましくは約100〜約240’Cの温度
で約1〜約20秒間行われる。This heating is preferably performed at a temperature of about 100 to about 240'C for about 1 to about 20 seconds.
〈作用効果〉
本発明の導電性フィルムは、基材フィルムと導電性の層
との密着性が高いので、実用耐久性が著しく向上する。<Effects> Since the conductive film of the present invention has high adhesion between the base film and the conductive layer, its practical durability is significantly improved.
従って下記の通り広範囲に適用される。特に下記に述べ
るタッチパネルの最重要品質である打鍵寿命が著しく向
上している事は実施例で明白である。Therefore, it is widely applicable as described below. In particular, it is clear from the examples that the keystroke life, which is the most important quality of a touch panel described below, has been significantly improved.
かかる導電性フィルムのうち透明なものは、たとえば透
明タッチパネル;固体発光素子、光電変換素子、ファク
シミリ用記録体、ELディスプレイ、液晶ディスプレイ
、エレクトロクロミックディスプレイなどの光と電場の
相互作用を利用したちのニスライドフィルム、マイクロ
フィルムなどの電子写真用基材として利用される。また
自動車や飛行機その他乗物のフロントガラス、信号灯。Among these conductive films, transparent ones are used for applications that utilize the interaction of light and electric fields, such as transparent touch panels; solid-state light emitting devices, photoelectric conversion devices, facsimile recording media, EL displays, liquid crystal displays, and electrochromic displays. Used as a base material for electrophotography such as Nislide film and microfilm. Also, windshields and signal lights of cars, airplanes, and other vehicles.
冷凍ショーケースなどの結露、凍結防止用発熱体。Heating element to prevent condensation and freezing in frozen showcases, etc.
サーモプラスチックレコーディング、フォトクロミック
メモリー、アモルファス半導体メモリーなどの基材とし
ても使用される。さらに、メーター類の窓、ブラウン管
1作業マットなどの静電気防止用、蛍光灯のクイックス
タート用1選択光透過膜などの用途に使用できることは
当然である。It is also used as a base material for thermoplastic recording, photochromic memory, amorphous semiconductor memory, etc. Furthermore, it is a matter of course that it can be used for anti-static purposes such as meter windows and work mats for cathode ray tubes, and as a selective light transmission film for quick start of fluorescent lamps.
実施例1
(1) カルボン酸アミン塩基を有するポリウレタン
水分散液[東洋ポリマー■製:商品名メルシー585]
28部(非揮発成分として)、アクリル系樹脂エマル
ジョン[メタクリル酸メチル/アクリル酸エチル/アク
リルアミド= 49/ 43/ 8(モル%)]28部
、メチレンビス・ステアロアミド7部、コロイダルシリ
カ水分散液(平均粒径40〜507y1μ)27部、及
びポリオキシエチレンノニルフェニルエーテル[日本油
脂[7:商品名N8208.5110部をイオン交換水
で希釈溶解し、固形分濃度2重量%の塗布液を調製した
。Example 1 (1) Polyurethane aqueous dispersion having a carboxylic acid amine base [manufactured by Toyo Polymer ■: trade name Merci 585]
28 parts (as non-volatile components), 28 parts of acrylic resin emulsion [methyl methacrylate/ethyl acrylate/acrylamide = 49/43/8 (mol%)], 7 parts of methylene bis stearamide, colloidal silica aqueous dispersion (average A coating liquid having a solid content concentration of 2% by weight was prepared by diluting and dissolving 27 parts of polyoxyethylene nonyl phenyl ether [NOF [7: trade name N8208.
(′2J 溶融したポリエチレンテレフタレートをエ
クストルーダでダイから押出し、キャスティングドラム
上で急冷した未延伸フィルムを加熱した金属ロール上で
長手方向に3.6倍に延伸した。('2J) Molten polyethylene terephthalate was extruded from a die using an extruder, and the unstretched film, which had been rapidly cooled on a casting drum, was stretched 3.6 times in the longitudinal direction on a heated metal roll.
このフィルムの片面上に上記(1)で調製した塗液をキ
スコート法にて均一に塗布した。The coating liquid prepared in (1) above was uniformly applied onto one side of this film by a kiss coating method.
このときの平均塗布量は上記−軸延伸フイルム1Td当
り、約49ウエツト量であった(この量は、下記の二軸
配向フィルムでは1TIi当り、約0.029に相当す
る)。片面塗布を施した一軸延伸フイルムをテンター内
に導き、98℃の予熱ゾーンを通過せしめ、105℃で
横方向に3.9倍に延伸し、更に225℃で6.3秒間
熱固定したく塗布液は塗布されたフィルムが加熱を受け
た時間は合計で11秒間に相当する)。The average coating amount at this time was approximately 49 wet per 1Td of the above-mentioned -axially oriented film (this amount corresponds to approximately 0.029 per 1TIi for the biaxially oriented film described below). A uniaxially stretched film coated on one side is introduced into a tenter, passed through a preheating zone at 98°C, stretched 3.9 times in the transverse direction at 105°C, and then heat-set at 225°C for 6.3 seconds. The total time the film was heated corresponds to 11 seconds).
(3) かくして得られたフィルム厚み75μmを直
流マグネトロンスパッタリング装置内の基板保持台に固
定し、圧力が1 x 10′5Torrになるまで真空
槽を排気した。その後、Ar102混合ガス(0225
%)を真空槽内に導入し、圧力を4x 10’ T o
rrに保った後、in/Sn合金(Sn5wt%)より
なるターゲットを用い、反応性スパッタリング法により
、約1000人7m1nの堆積速度で錫ドープの酸化イ
ンジウム(ITO)膜を形成した。ITO膜厚は200
人であった。該サンプルの特性は波長550nmにおけ
る光透過率86%2表面電気抵抗450Ω/口であった
。(3) The film thus obtained with a thickness of 75 μm was fixed on a substrate holder in a DC magnetron sputtering device, and the vacuum chamber was evacuated until the pressure reached 1×10′5 Torr. After that, Ar102 mixed gas (0225
%) into the vacuum chamber, and the pressure was increased to 4x 10' To
After maintaining the temperature at rr, a tin-doped indium oxide (ITO) film was formed by reactive sputtering using a target made of in/Sn alloy (5 wt % Sn) at a deposition rate of about 1000 people/7 ml. ITO film thickness is 200
It was a person. The characteristics of the sample were a light transmittance of 86% at a wavelength of 550 nm and a surface electrical resistance of 450 Ω/hole.
(4) 上記(3)で得られた導電性フィルムについ
てITO膜面同志をスペーサにより 100μm間隔に
なる様に対向させた透明スイッチを作成し、以下のよう
にして耐久性を評価した。(4) A transparent switch was prepared using the conductive film obtained in (3) above, with the ITO film surfaces facing each other with a spacer at intervals of 100 μm, and the durability was evaluated as follows.
先端が7Rのシリコンゴム製亡ロッド(重さ200g)
を連続的にソレノイドで透明スイッチ上に自由落下させ
たくくり返し周波数3Hz>。Silicone rubber rod with 7R tip (weight 200g)
is continuously free-falling onto a transparent switch using a solenoid at a frequency of 3Hz>.
ロッドが落下する毎にスイッチが押され定電流電源によ
り1 mAがスイッチに流れるようにした。透明スイ
ッチが押された時のパルス状の波形をシンクロスコープ
により観測しながら、スイッチ寿命を調べた。パルス状
の波形が観測されなくなった時の押印回数をスイッチ寿
命と定義した時、スイッチ寿命は120万回であった。Each time the rod fell, the switch was pressed and 1 mA was applied to the switch by a constant current power supply. The life of the switch was investigated by observing the pulse-like waveform when the transparent switch was pressed using a synchroscope. When the switch life was defined as the number of presses when the pulse-like waveform was no longer observed, the switch life was 1.2 million times.
又、同様に(3)で得られた導電性フィルムについて、
ITOg1面を厚さ 100μmのアルミニウム板にエ
ポキシ系接着剤で貼り合わせ、80℃で5分間熱処理す
ることにより接着剤を硬化させた。Similarly, regarding the conductive film obtained in (3),
One side of the ITOg was bonded to a 100 μm thick aluminum plate using an epoxy adhesive, and the adhesive was cured by heat treatment at 80° C. for 5 minutes.
引続いて、引張り試験機の所定位置に取付け、180度
剥離試験を行なった(剥離速度10IJ/1n )。剥
離中に観測されたサンプルI atr幅当りの力を、I
TO膜と基材フィルムとの密着力<9/cm>と定義し
た時、密着力は4809 / anであった。Subsequently, it was attached to a predetermined position in a tensile testing machine and a 180 degree peel test was conducted (peel rate: 10 IJ/1n). The force per width of the sample I atr observed during peeling is expressed as I
When the adhesion force between the TO film and the base film was defined as <9/cm>, the adhesion force was 4809/an.
比較例1
実施例1に於て、(1)の塗布液を塗布することなくテ
ンター内に導き、実施例1と同様に延伸、加熱処理した
密着層のない75μmのフィルムを得た。Comparative Example 1 In Example 1, the coating solution of (1) was introduced into a tenter without being applied, and a 75 μm film without an adhesive layer was stretched and heat-treated in the same manner as in Example 1.
膜厚200人のITO膜を実施例1と同様の操作で形成
し光透過率84%2表面電気抵抗520Ω/口の導電性
フィルムを作製した。An ITO film having a thickness of 200 was formed in the same manner as in Example 1 to produce a conductive film having a light transmittance of 84% and a surface electrical resistance of 520 Ω/hole.
かくして得られた導電性フィルムのスイッチスを命は2
5万回以下であり、又180度剥離試験に於けるITO
膜と基材フィルムとの密着力は290g/′αであった
。The life of the conductive film switches thus obtained is 2.
50,000 times or less, and ITO in the 180 degree peel test
The adhesion between the membrane and the base film was 290 g/'α.
特許出願人 帝 人 株 式 会 社 メー′1、′4
代 理 人 弁理士 前 1) 純 博1
・′〜\、−Patent Applicant Teijin Ltd. Mae'1, '4 Agent Patent Attorney Former 1) Jun Hiroshi 1
・′〜\、−
Claims (1)
層を形成した導電性フィルムにおいて、基材フィルムと
導電性の層との間に、ポリウレタン(A)、アクリル系
樹脂(B)、脂肪酸アミド又はビスアミド(C)を主成
分とする組成物よりなる層をもうけた事を特徴とする導
電性フィルム。 2、前記ポリウレタン(A)が水性ポリウレタンである
特許請求の範囲第1項記載の導電性フィルム。 3、前記アクリル系樹脂(B)はメチルメタクリレート
成分が40〜80モル%であり、これらと共重合可能な
他のビニルモノマー成分が20〜60モル%である水性
アクリル樹脂である特許請求の範囲第1項記載の導電性
フィルム。 4、前記組成物よりなる層が粗面化物質(D)を含有す
る特許請求の範囲第1項〜第3項記載のいずれかの導電
性フィルム。 5、前記導電性の層は金属薄膜又は金属化合物薄膜であ
る特許請求の範囲第1項〜第4項記載のいずれかの導電
性フィルム。 6、前記導電性の層は透明である特許請求の範囲第5項
記載の導電性フィルム。 7、前記導電性の層は錫ドープの酸化インジウム(IT
O)薄膜である特許請求の範囲第6項記載の導電性フィ
ルム。[Claims] 1. In a conductive film in which a conductive layer is formed on a base film made of a polymer film, polyurethane (A), acrylic-based A conductive film characterized by having a layer made of a composition whose main components are a resin (B), a fatty acid amide, or a bisamide (C). 2. The conductive film according to claim 1, wherein the polyurethane (A) is an aqueous polyurethane. 3. The claim that the acrylic resin (B) is an aqueous acrylic resin containing 40 to 80 mol% of a methyl methacrylate component and 20 to 60 mol% of other vinyl monomer components copolymerizable therewith. The conductive film according to item 1. 4. The conductive film according to any one of claims 1 to 3, wherein the layer made of the composition contains a surface roughening substance (D). 5. The conductive film according to any one of claims 1 to 4, wherein the conductive layer is a metal thin film or a metal compound thin film. 6. The conductive film according to claim 5, wherein the conductive layer is transparent. 7. The conductive layer is made of tin-doped indium oxide (IT
O) The conductive film according to claim 6, which is a thin film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62151412A JPS63317333A (en) | 1987-06-19 | 1987-06-19 | Conductive film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62151412A JPS63317333A (en) | 1987-06-19 | 1987-06-19 | Conductive film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63317333A true JPS63317333A (en) | 1988-12-26 |
Family
ID=15518039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62151412A Pending JPS63317333A (en) | 1987-06-19 | 1987-06-19 | Conductive film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63317333A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980016222A (en) * | 1996-08-27 | 1998-05-25 | 구광시 | METHOD FOR PREPARING COMPOSITE TOTAL FILM FILM |
JP2010080237A (en) * | 2008-09-25 | 2010-04-08 | Fujifilm Corp | Conductive material and method of producing the same |
JP2013218829A (en) * | 2012-04-05 | 2013-10-24 | Ulvac Japan Ltd | Conductive metal paste |
-
1987
- 1987-06-19 JP JP62151412A patent/JPS63317333A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980016222A (en) * | 1996-08-27 | 1998-05-25 | 구광시 | METHOD FOR PREPARING COMPOSITE TOTAL FILM FILM |
JP2010080237A (en) * | 2008-09-25 | 2010-04-08 | Fujifilm Corp | Conductive material and method of producing the same |
JP2013218829A (en) * | 2012-04-05 | 2013-10-24 | Ulvac Japan Ltd | Conductive metal paste |
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