JPS63316813A - Position adjusting method for hologram lens and semiconductor laser - Google Patents

Abstract

PURPOSE:To decrease the man-hours of adjusting processes by using anaerobic ultraviolet ray setting resin (anaerobic UV resin) to adjust and fix the position of a hologram lens and a semiconductor laser. CONSTITUTION:The slide surface 11 of a base 3 is coated with the anaerobic UV resin, a jogging arm 13 having a semiconductor laser 1 is slid with the macrometer push pin 9 of an adjusting jig 8, and while a beam shape on a target 10 is observed, the arm is jogged in an X, a Y, and a Z direction. An ultraviolet ray is projected from a fiber 4 when the beam diameter enters a set value range, the anaerobic UV resin sets to fix the jogging arm 13 and base 3 temporarily by an UV setting part 15 which swells at the periphery of the jogging arm 13, and then the slide surface 11 and anaerobic setting part 14 are adhered completely by anaerobic setting.

Description

[Detailed Description of the Invention] [Summary] The present invention relates to a method for adjusting the position of a hologram lens and a semiconductor laser in an optical system used in a laser printer, etc. Aiming at a position adjustment method that prevents the laser l from shifting, a hologram lens is placed on one side of an L-shaped base and a semiconductor laser is slidably positioned on the other side, and the laser light from the semiconductor laser hits the hologram lens. When adjusting the position of the hologram lens and semiconductor laser so that the target is irradiated through the hologram lens, an anaerobic ultraviolet curing resin is applied to the slide surface of the semiconductor laser, and the positional relationship between the hologram lens and semiconductor laser is determined. At times, the material is temporarily fixed by irradiating it with ultraviolet rays and using an anaerobic ultraviolet curable resin that rises around it, and the main curing is performed by utilizing the anaerobic properties of the slide surface.

[Industrial application field]

The present invention relates to a method for adjusting the position of a hologram lens and a semiconductor laser in an optical system used in a laser printer or the like.

There is a strong need for cost reduction in laser printers and the like, and printing quality must be maintained, so a manufacturing method for manufacturing inexpensive printers with guaranteed accuracy is required.

[Conventional technology]

FIG. 3 is a diagram showing an optical system for a laser printer. In the figure, 1 is a semiconductor laser, 2 is a hologram lens, 3 is a base, 5 is a hologram scanner, 6 is a mirror, and 7
13 is a set screw, and 13 is a fine movement arm to which the semiconductor laser 1 is attached.

The optical system described above is used in electronic printers and the like, and the laser beam from the semiconductor laser 1 is converged by the hologram lens 2 and is incident on the hologram scanner 5, which scans the drum surface. This scanning of the drum surface will result in irregular printing unless the accuracy is ±zOμ, so the laser light from the semiconductor laser 1 must always be incident on one point on the hologram scanner 5. For this purpose, the positions of the hologram lens 2 and the semiconductor laser 1 are adjusted.

In the conventional position adjustment method, the base 3 is fixed to the adjustment jig 8 as shown in FIG. 4, and the target 10 is positioned at a point where light from the hologram lens 2 is incident. The fine movement arm 13 is configured to finely move the slide surface 11 in the X, Y, and Z directions, and has the semiconductor laser 1.
Slide it with the micro push pin 9 of the adjustment jig 8, and finely move it in the X, Y, and Z directions while observing the beam shape on the predetermined target 10. When the beam diameter is within the set value, finely move it. The arm 13 is fixed to the base 3 with a set screw 7.

[Problems to be solved by the invention] Conventional hologram lens 2 and semiconductor laser l shown in FIG.
In the position adjustment method, while observing the beam diameter incident on a predetermined target 10, at the position where the diameter of the beam is the minimum,
The fine movement arm 13 is screwed.

When fixing with screws, the set screw 7 rotates, so the position of the semiconductor laser 1, which has been carefully adjusted, becomes misaligned and the adjusted value becomes incorrect. Therefore, the adjustment has to be repeated many times, resulting in a large amount of work. It required a lot of man-hours.

An object of the present invention is to provide a method for adjusting the position of the hologram lens 2 and the semiconductor laser 1, in which the position of the adjusted semiconductor laser 1 does not change when the fine movement arm 13 is fixed to the base 3.

[Means for solving problems]

The problem is as shown in FIG. 1, the hologram lens 2 and the semiconductor laser 1 are slidably positioned on the base 3 (equipped with a constant temperature device), and the laser light from the semiconductor laser 1 does not affect the hologram lens 2. When adjusting the positions of the hologram lens and the semiconductor laser so as to irradiate the target (with a beam diameter measurement device) 10 through the ) is applied, and when the positional relationship between the hologram lens 2 and the semiconductor laser 1 is determined, ultraviolet rays are irradiated from the fiber 4, and temporary fixation is performed using the anaerobic ultraviolet curable resin raised around the periphery. This problem is solved by the method of adjusting the position of a hologram lens and a semiconductor laser according to the present invention, which takes advantage of anaerobic properties.

[For production]

That is, in the present invention, since anaerobic UV resin is used for the sliding surface 11 of the semiconductor laser 1, the semiconductor laser 1 can be slightly moved by the fine movement arm 13 while observing the beam diameter of the target IO during adjustment. After adjusting the position of the semiconductor laser 1, the anaerobic UV resin raised around the sliding surface 11 of the fine movement arm 13 is fixed by the ultraviolet rays irradiated by the fiber 4 of the ultraviolet irradiation device, and the fine movement arm 13 does not move. It is temporarily fixed to the base 3. Furthermore, since the U resin is anaerobic, the contact surface between the slide surface 11 and the fine movement arm 13 becomes fixed over time, resulting in a strong surface bond.

〔Example〕

FIGS. 2(A) to 2(C) are views for explaining one embodiment of the present invention, in which (A) is a side view, (B) is a front view, and (C) is an enlarged view of the bonded portion. Note that the same reference numerals refer to the same objects throughout the plan.

In the figure, 1 is a semiconductor laser, 2 is a hologram lens, and 3 is a semiconductor laser.
is an L-shaped base (with a constant temperature device), 4 is a fiber of the irradiation device, 8 is an adjustment jig, 9 is a push pin with a micro, 10 is a target (with a beam diameter measuring device), 11 is a slide surface,
12 is a semiconductor laser adjustment direction, and 13 is a fine movement arm.

In the position adjustment method of the present invention, the base 3 is fixed to the adjustment jig 8 as shown in FIG. 2, and the target eye O is located at a position where the light from the hologram lens 2 is incident. Fine movement arm 1
3 is a configuration in which the slide surface 11 is slightly moved in the X, Y, and Z directions. In the present invention, anaerobic UV resin is applied to the sliding surface 11 of the base 3, and the fine movement arm 13 having the semiconductor laser 1 is slid with the micro-equipped push pin 9 of the adjustment jig 8, thereby shaping the beam on the target 10. While observing this, move slightly in the X and YSZ directions. Then, when the beam diameter falls within the set value, ultraviolet rays are irradiated from the fiber 4 of the irradiation device. This fixes the UV resin, as shown in Figure 2 (
As shown in c), the fine movement arm 13 and the base 3 are temporarily fixed in the UV cured part 15 raised around the fine movement arm 13, and then the anaerobic cured part 14 of the slide surface 11 is completely bonded by anaerobic curing. Ru. Note that the base 3 is equipped with a temperature constant device (for example, a seek sink, etc.), and the fine movement arm 13 having the semiconductor laser 1 is surface-bonded to the base 3, so that thermal conductivity is guaranteed.

In addition, with the conventional method of adjusting the position of the hologram lens and semiconductor laser, the adjustment value becomes incorrect when screwing it into the base after adjustment, so the adjustment has to be repeated many times, requiring a large amount of man-hours. In the present invention, there was no change after adjustment, and the number of adjustment steps was significantly reduced.

〔Effect of the invention〕

As explained above, according to the present invention, by using anaerobic UV resin, it can be fixed without changing while being adjusted, and since the fine movement arm having a semiconductor laser is surface-adhered to the base, strong adhesion can be achieved. Power and thermal conductivity are also guaranteed, and the number of adjustment steps is greatly reduced.

[Brief explanation of the drawing]

Fig. 1 is a diagram explaining the present invention in detail, Fig. 2 (a) to (c) are diagrams explaining an embodiment of the present invention, and Fig. 3 is a diagram showing an optical system for a laser printer. , 1 is a semiconductor laser, 2 is a hologram lens, 3 is a base, 4 is a UV fiber, 8 is an adjustment jig, 9 is a push pin with a micro, 10 is a target, 11 is a slide surface, 12 is a semiconductor laser adjustment direction, 13 is the fine movement arm, 14 is the anaerobic hardening section, °-a
Shinrin Kun connection method 1g limb θ stroke 6 figure 74 figure

Claims (1)

[Claims] A hologram lens (2) and a semiconductor laser (1) are slidably positioned on a base (3), and a laser beam from the semiconductor laser (1) is transmitted to the hologram lens (2).
When adjusting the positions of the hologram lens (2) and the semiconductor laser (1) so as to irradiate the target (10) through the When the positional relationship between the hologram lens (2) and the semiconductor laser (1) is determined, they are temporarily fixed by irradiating the hologram lens (2) and the semiconductor laser (1) with the raised ultraviolet curing resin curing portion (15) around the periphery, and the main curing is carried out on the slide surface (11). ) A method for adjusting the position of a hologram lens and a semiconductor laser, characterized in that the method is carried out using the anaerobic curing section (14).