JPS6331632U - - Google Patents
Info
- Publication number
- JPS6331632U JPS6331632U JP1986125196U JP12519686U JPS6331632U JP S6331632 U JPS6331632 U JP S6331632U JP 1986125196 U JP1986125196 U JP 1986125196U JP 12519686 U JP12519686 U JP 12519686U JP S6331632 U JPS6331632 U JP S6331632U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- reduction structure
- crosstalk reduction
- connector
- conductive patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Telephone Exchanges (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Structure Of Printed Boards (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
Description
図面はいずれも本考案の実施例を説明するもの
であり、第1図はマザーボードの平面図、第2図
はマザーボードの側面図、第3図はプリント板の
導電パターンの詳細図である。
(記号の説明)1……プリント板、2……コネ
クタ、21;接続端子、22;接触子、3……導
電パターン、31a〜31j;通話線導電パター
ン、32;ランドパターン、33a〜33k;シ
ールドパターン。
The drawings are for explaining an embodiment of the present invention, and FIG. 1 is a plan view of the motherboard, FIG. 2 is a side view of the motherboard, and FIG. 3 is a detailed view of the conductive pattern on the printed board. (Explanation of symbols) 1... Printed board, 2... Connector, 21; Connection terminal, 22; Contact, 3... Conductive pattern, 31a-31j; Communication line conductive pattern, 32; Land pattern, 33a-33k; shield pattern.
Claims (1)
で形成され、かつ外部との接続をコネクタで行う
ようにした装置に於いて、上記プリント板の通話
線導電パターン間にシールドパターンを形成する
とともに、上記コネクタの接触子を設定個毎に上
記シールドパターンに接続した漏話軽減構造。 2 プリント板がマザーボード用プリント板であ
る実用新案登録請求の範囲第1項に記載の漏話軽
減構造。 3 プリント板が回線ユニツト用プリント板であ
る実用新案登録請求の範囲第1項に記載の漏話軽
減構造。[Scope of Claim for Utility Model Registration] 1. In a device in which two or more communication lines are formed by conductive patterns on a printed board and connections to the outside are made by connectors, the connection between the communication line conductive patterns on the printed board A crosstalk reduction structure is provided in which a shield pattern is formed on the surface of the connector, and the contacts of the connector are connected to the shield pattern in set units. 2. The crosstalk reduction structure according to claim 1, wherein the printed board is a printed board for a motherboard. 3. The crosstalk reduction structure according to claim 1, wherein the printed board is a printed board for a line unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986125196U JPS6331632U (en) | 1986-08-15 | 1986-08-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986125196U JPS6331632U (en) | 1986-08-15 | 1986-08-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6331632U true JPS6331632U (en) | 1988-03-01 |
Family
ID=31017888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986125196U Pending JPS6331632U (en) | 1986-08-15 | 1986-08-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6331632U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5815371B2 (en) * | 1979-11-09 | 1983-03-25 | 株式会社池貝 | compression packaging machine |
-
1986
- 1986-08-15 JP JP1986125196U patent/JPS6331632U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5815371B2 (en) * | 1979-11-09 | 1983-03-25 | 株式会社池貝 | compression packaging machine |
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