JPS6331547U - - Google Patents
Info
- Publication number
- JPS6331547U JPS6331547U JP12515686U JP12515686U JPS6331547U JP S6331547 U JPS6331547 U JP S6331547U JP 12515686 U JP12515686 U JP 12515686U JP 12515686 U JP12515686 U JP 12515686U JP S6331547 U JPS6331547 U JP S6331547U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- external terminal
- resin molded
- conductive frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12515686U JPS6331547U (el) | 1986-08-14 | 1986-08-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12515686U JPS6331547U (el) | 1986-08-14 | 1986-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6331547U true JPS6331547U (el) | 1988-03-01 |
Family
ID=31017816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12515686U Pending JPS6331547U (el) | 1986-08-14 | 1986-08-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6331547U (el) |
-
1986
- 1986-08-14 JP JP12515686U patent/JPS6331547U/ja active Pending