JPS633049A - Resin composition - Google Patents

Resin composition

Info

Publication number
JPS633049A
JPS633049A JP14505886A JP14505886A JPS633049A JP S633049 A JPS633049 A JP S633049A JP 14505886 A JP14505886 A JP 14505886A JP 14505886 A JP14505886 A JP 14505886A JP S633049 A JPS633049 A JP S633049A
Authority
JP
Japan
Prior art keywords
resin composition
density polyethylene
propylene
polypropylene polymer
breakdown voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14505886A
Other languages
Japanese (ja)
Inventor
Yoshiji Miyashita
芳次 宮下
Hiroshi Kato
寛 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Priority to JP14505886A priority Critical patent/JPS633049A/en
Publication of JPS633049A publication Critical patent/JPS633049A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE:A resin composition suitable as an electrical insulating coating composition for electric wire, especially electric cable, having improved impulse breakdown voltage and flexibility of no practical hindrance, comprising a polypropylene polymer and a low-density polyethylene. CONSTITUTION:(A) A resin composition containing (A) 5-95wt%, preferably 20-80wt% propylene polymer such as propylene homopolymer, propylene- ethylene random copolymer having <=10wt% ethylene content or block copoly mer, having 163-166 deg.C, preferably 163-164 deg.C melting point and (B) 95-5pts.wt., preferably 80-20pts.wt. low-density polyethylene having <0.935g/cm<3>, preferably <=0.920g/cm<3> density (20 deg.C) wherein at least one of the components A and B is preferably crosslinked.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂組成物に関し、更に詳しくは電線の被覆絶
縁樹脂組成物として極めて好適な樹脂組成物に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin composition, and more particularly to a resin composition that is extremely suitable as an insulating resin composition for covering electric wires.

〔従来の技術〕[Conventional technology]

電wa中特に電カケープルの被覆絶縁樹脂組成物として
は各種の樹脂を主成分とするものが使用されているが、
優れた耐破壊電圧性を有する架橋ポリエチレンが主流と
なって来ている。
Insulating resin compositions containing various resins as main components are used as coating insulating resin compositions for electric cables, especially electric cables.
Crosslinked polyethylene, which has excellent breakdown voltage resistance, has become mainstream.

しかしながら最近の技術分野の向上により、この種を線
就中電カケープルに於いても、益々高性能が要求され、
耐破壊電圧についてもより−、!!優れたものが強く要
求されるようになって来た。
However, with recent improvements in the technical field, even in this type of line-based electric cable, higher performance is required.
More about breakdown voltage! ! There has been a strong demand for superior products.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

本発明が解決しようとする問題点は、上記要求に応えう
る新しい樹脂組成物を開発することであり、更に詳しく
は、従来の架橋ポリエチレンからなる樹脂組成物よりも
、更に一層優れたi5を破壊電圧性を有する樹脂組成物
を開発することである。
The problem to be solved by the present invention is to develop a new resin composition that can meet the above requirements. The objective is to develop a resin composition that has voltage properties.

〔問題点を解決するための手段〕[Means for solving problems]

この問題点はポリプロピレン系重合体と低密度ポリエチ
レンとを好ましくはある特定割合で混合したものを樹脂
組成物として使用することにより達成される。即ち本発
明は、ポリプロピレン系重合体と低密度ポリエチレンと
を含有してなる樹脂組成物に係るものである 本発明者の研究に依ると、ポリプロピレン系重合体は架
橋直鎖状ポリエチレンや低密度ポリエチレンに比し破壊
電圧就中インパルス破壊電圧が高いという優れた性質を
有することが判明した。しかしながらこのポリプロピレ
ン系重合体は高融点並びに高結晶化度を有し、特に高結
晶性であるがために、可撓性に乏しく、電線就中型カケ
ープルの絶縁被覆用組成物としては、このままでは実用
上支障があることが判明した。
This problem can be solved by using a mixture of a polypropylene polymer and low density polyethylene, preferably in a certain ratio, as a resin composition. That is, the present invention relates to a resin composition containing a polypropylene polymer and a low-density polyethylene.According to the research of the present inventor, the polypropylene polymer is a crosslinked linear polyethylene or a low-density polyethylene. It has been found that this material has superior properties such as a high breakdown voltage, particularly a high impulse breakdown voltage. However, this polypropylene polymer has a high melting point and a high degree of crystallinity, and because it is particularly highly crystalline, it has poor flexibility and cannot be used as it is as an insulating coating composition for medium-sized cables. It turned out that there was a problem.

よって更に研究を続けるうち、このポリプロピレン系重
合体を低密度ポリエチレンと併用するときは、特にこれ
等両者を特定の配合割合で併用するときは、優れたイン
パルス破壊電圧と、実用上支障の無い程度の可撓性とを
具備するに至ることを見出し、これに基づく本発明を完
成したものである。
Therefore, as we continued our research, we found that when this polypropylene polymer is used in combination with low-density polyethylene, especially when these two are used together in a specific blending ratio, it has an excellent impulse breakdown voltage and a level that does not cause any practical problems. The present invention has been completed based on this discovery.

〔発明の構成並びに作用〕[Structure and operation of the invention]

本発明の樹脂組成物は、基本的にはポリプロピレン系重
合体と低密度ポリエチレンとを含有して成るものであり
、更に好ましくは、これ等両者または其のいずれか一方
が更に架橋されたものである。
The resin composition of the present invention basically contains a polypropylene polymer and low density polyethylene, and more preferably, both or one of them is further crosslinked. be.

本発明で使用するポリプロピレン系重合体はプロピレン
の単独重合体とプロピレンとエチレンとの共重合体(エ
チレン含有110重1%以下)とを包含するものである
。そして共重合体としては、ランダム共重合体、ブロッ
ク共重合体が使用される。
The polypropylene polymer used in the present invention includes a propylene homopolymer and a copolymer of propylene and ethylene (ethylene content of 110% by weight or less). As the copolymer, a random copolymer or a block copolymer is used.

融点は通常163〜166℃好ましくは163〜164
℃程度で、また単独重合体やランダム共重合体の結晶化
度は50〜55重量%程度のものが好ましい。
Melting point is usually 163-166℃, preferably 163-164℃
℃, and the degree of crystallinity of the homopolymer or random copolymer is preferably about 50 to 55% by weight.

また本発明に於いて使用する低密度ポリエチレンとして
も、これ自体は従来から良(知られたものであり、其の
密度が20℃に於いて0.935g/cdに達しないも
のが使用され、好ましくは密度0.920g/−以下の
ものである。
Furthermore, the low-density polyethylene used in the present invention is one that has been known in the past and has a density of less than 0.935 g/cd at 20°C. Preferably, the density is 0.920 g/- or less.

これ等両者の配合割合は、ポリプロピレン系重合体が5
〜95重量%、低密度ポリエチレンが95〜5重量%の
範囲好ましくは前者20〜80重量%、後者80〜20
重景%の範囲がら適宜に決定される。これ等の配合割合
の変化により若干インパルス破壊電圧並びに可撓性が変
化するが、上記範囲内、特に好ましいとされる上記範囲
内では、実用上支障の無い可撓性と優れた破壊電圧が発
揮される。
The blending ratio of these two is 5% polypropylene polymer.
~95% by weight, low density polyethylene in the range of 95 to 5% by weight, preferably the former 20 to 80% by weight, the latter 80 to 20% by weight.
It is determined as appropriate based on the range of weighted background percentage. Impulse breakdown voltage and flexibility will change slightly due to changes in these blending ratios, but within the above range, particularly within the above range which is considered preferable, flexibility and excellent breakdown voltage that will not cause any practical problems will be exhibited. be done.

特に本発明に於いては使用するポリプロピレン系重合体
の種類に応して上記範囲内で更に低密度ポリエチレンと
の配合割合を適宜選択することが好ましい、たとえばポ
リプロピレン系重合体が単独重合体の場合は5〜90重
量%特に好ましくは20〜80重量%程度、またランダ
ム共重合体の場合は5〜50重量%特に好ましくは20
〜4゜重量%、ブロック共重合体の場合は10〜80重
量%特に好ましくは20〜60重量%程度である。
In particular, in the present invention, it is preferable to appropriately select the blending ratio with low density polyethylene within the above range depending on the type of polypropylene polymer used. For example, when the polypropylene polymer is a homopolymer. is 5 to 90% by weight, particularly preferably about 20 to 80% by weight, and in the case of random copolymers, 5 to 50% by weight, particularly preferably 20% by weight.
-4% by weight, in the case of block copolymers, about 10-80% by weight, particularly preferably about 20-60% by weight.

また本発明に於いては、これ等ポリプロピレン系重合体
及び低密度ポリエチレンのいずれか一方または双方を適
当な架橋剤を、或いは電子線等を用いる通常の架橋手段
で架橋することができる。
Further, in the present invention, either or both of these polypropylene polymers and low density polyethylene can be crosslinked using a suitable crosslinking agent or by a conventional crosslinking method using an electron beam or the like.

これにより、更に耐熱性を向上せしめることができる。Thereby, heat resistance can be further improved.

本発明の組成物には必要に応じて従来からこの種組成物
に使用されて来た各種の添加剤を添加するを妨げない、
その具体例としては、たとえば各種顔料、充填剤、老化
防止剤、難燃化剤、滑剤、電圧安定剤等を例示すること
が出来る。
Various additives conventionally used in compositions of this type may be added to the composition of the present invention as necessary.
Specific examples include various pigments, fillers, anti-aging agents, flame retardants, lubricants, voltage stabilizers, and the like.

また本発明の組成物には、上記特性を損なわない範囲で
他の樹脂を配合することも出来る。これ等信の樹脂とし
ては、たとえばEVA (エチレン−酢酸ビニル共重合
体) 、EEA (エチレン−エチルアクリレート共重
合体)等を挙げることが出来る。
Further, other resins can be added to the composition of the present invention within a range that does not impair the above characteristics. Examples of such resins include EVA (ethylene-vinyl acetate copolymer) and EEA (ethylene-ethyl acrylate copolymer).

〔実施例〕〔Example〕

以下に実施例を挙げて本発明を説明する。 The present invention will be explained below with reference to Examples.

実施例1 第1表に示す所定の原料を第1〜4図に示す所定の割合
で混合して各種の組成物を調べた。
Example 1 Various compositions were investigated by mixing the predetermined raw materials shown in Table 1 in the predetermined ratios shown in FIGS. 1 to 4.

第1表 注1=プロピレン単独重合体 注2:エチレンープロピレンランダム共重合体注3=エ
チレン−プロピレンブロック共重合体性4:エチレンー
プロピレンブロック共重合体注5=低密度ポリエチレン 此の各種組成物夫々について第5図に示すリセスシート
(リセス部属=約1tI)に成形し、試料とした。この
試料についてインパルス破壊電圧を次の様にして測定し
た。
Table 1 Note 1 = Propylene homopolymer Note 2: Ethylene-propylene random copolymer Note 3 = Ethylene-propylene block copolymer Property 4: Ethylene-propylene block copolymer Note 5 = Low-density polyethylene Various compositions Each material was molded into a recessed sheet (recess portion = approximately 1 tI) shown in FIG. 5, and used as a sample. The impulse breakdown voltage of this sample was measured as follows.

(インパルス破壊電圧の測定)IX40μ秒負極性標準
波を用い、破壊予想電圧の70%値から5kV/1回の
ステップ昇圧法にて、シリコンオイル中、各電圧で3回
印加により破壊に至らしめた。
(Measurement of impulse breakdown voltage) Using an IX 40 μsec negative polarity standard wave, apply a step-up method of 5 kV/time from 70% of the expected breakdown voltage to reach breakdown by applying each voltage three times in silicone oil. Ta.

また、各試料の物理特性(可撓性)は、IWM厚シート
に成形後、恒温槽付引張試験機によって測定した。結晶
化度の算出には、データ処理’A’ll付き示差熱分析
器(DSC)を用いた。
In addition, the physical properties (flexibility) of each sample were measured using a tensile tester equipped with a constant temperature oven after forming into an IWM thick sheet. A differential thermal analyzer (DSC) with data processing 'A'll was used to calculate the degree of crystallinity.

物理特性(可撓性)の測定結果を第1〜4図に、またイ
ンパルス破壊電圧の測定結果を第6〜9図に示した。
The measurement results of physical properties (flexibility) are shown in Figs. 1 to 4, and the measurement results of impulse breakdown voltage are shown in Figs. 6 to 9.

但し、第1〜4図中実線は降伏点応力を、また点線は伸
びを示す、また第1図並びに第2図中、LDPEは夫々
低密度ポリエチレンを示す。第5図の番号は夫々(1)
がエポキシ樹脂、(2)が導電性ペイント、(3)がプ
ラス電極、(4)が試料、(5)がポリ塩化ビニル、(
6)が高圧側平円板電極を示す。
However, the solid line in FIGS. 1 to 4 indicates the stress at yield point, and the dotted line indicates elongation. In FIGS. 1 and 2, LDPE indicates low density polyethylene. The numbers in Figure 5 are (1) respectively.
is epoxy resin, (2) is conductive paint, (3) is positive electrode, (4) is sample, (5) is polyvinyl chloride, (
6) shows the high voltage side flat disk electrode.

〔発明の効果〕〔Effect of the invention〕

本発明の組成物は、従来の架橋ポリエチレンを主体とす
る樹脂組成物よりも更に優れたインパルス破壊電圧を有
し、且つ実用上支障のない可撓性を有するので、電線就
中量カケープルの絶縁被覆用組成物として極めて好適な
ものであり、その産業上の利用性は極めて高い。
The composition of the present invention has an impulse breakdown voltage superior to that of conventional resin compositions mainly composed of crosslinked polyethylene, and has flexibility that does not pose a problem in practical use. It is extremely suitable as a coating composition and has extremely high industrial applicability.

【図面の簡単な説明】[Brief explanation of the drawing]

第1〜4図は、樹脂組成物の混合比と物理特性との関係
を示すグラフであり、第6〜9圓は同じくインパルス破
壊電圧との関係を示すグラフである。また第5図はりセ
スシートシステムを示す概略図である。 1・・・・エポキシ樹脂 2・・・・導電性ペイント 3・・・・プラス電極 4・・・・試料 5・・・・ポリ塩化ビニル 6・・・・平円板電極(プラス) (以上) 第1図 長委比率 第2図 満@−π単 第3図 ン良、4ミトレC三叫り 第4図 5先・−ξ;≧、+(jシュ 第6図 混りに輩 混々Jt卑
1 to 4 are graphs showing the relationship between the mixing ratio of the resin composition and the physical properties, and 6th to 9th circles are graphs showing the relationship to the impulse breakdown voltage. FIG. 5 is a schematic diagram showing a beam access sheet system. 1... Epoxy resin 2... Conductive paint 3... Positive electrode 4... Sample 5... Polyvinyl chloride 6... Flat disk electrode (positive) (or more) ) Figure 1 Chair ratio Figure 2 Full @ -π single Figure 3 N good, 4 Mitre C three shouts Figure 4 5 ahead -ξ; Jt low

Claims (5)

【特許請求の範囲】[Claims] (1)ポリプロピレン系重合体と低密度ポリエチレンと
からなり、ポリプロピレン系重合体と低密度ポリエチレ
ンとの混合比が前者95〜5重量%、後者5〜95重量
%である樹脂組成物。
(1) A resin composition consisting of a polypropylene polymer and low density polyethylene, in which the mixing ratio of the polypropylene polymer and low density polyethylene is 95 to 5% by weight of the former and 5 to 95% by weight of the latter.
(2)ポリプロピレン系重合体がプロピレンの単独体重
合体である特許請求の範囲第1項に記載の組成物。
(2) The composition according to claim 1, wherein the polypropylene polymer is a homopolymer of propylene.
(3)ポリプロピレン系重合体がプロピレンとエチレン
のランダム共重合体である特許請求の範囲第1項に記載
の組成物。
(3) The composition according to claim 1, wherein the polypropylene polymer is a random copolymer of propylene and ethylene.
(4)ポリプロピレン系重合体がプロピレンとエチレン
のブロック共重合体である特許請求の範囲第1項に記載
の組成物。
(4) The composition according to claim 1, wherein the polypropylene polymer is a block copolymer of propylene and ethylene.
(5)ポリプロピレン系重合体及び低密度ポリエチレン
の少なくとも一種が架橋したものである特許請求の範囲
第1項に記載の組成物。
(5) The composition according to claim 1, wherein at least one of a polypropylene polymer and a low density polyethylene is crosslinked.
JP14505886A 1986-06-20 1986-06-20 Resin composition Pending JPS633049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14505886A JPS633049A (en) 1986-06-20 1986-06-20 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14505886A JPS633049A (en) 1986-06-20 1986-06-20 Resin composition

Publications (1)

Publication Number Publication Date
JPS633049A true JPS633049A (en) 1988-01-08

Family

ID=15376404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14505886A Pending JPS633049A (en) 1986-06-20 1986-06-20 Resin composition

Country Status (1)

Country Link
JP (1) JPS633049A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0837476A2 (en) * 1996-10-17 1998-04-22 Union Carbide Chemicals & Plastics Technology Corporation Tree resistant cable
JP2018518567A (en) * 2015-06-11 2018-07-12 ダウ グローバル テクノロジーズ エルエルシー Cable insulation comprising a blend of LDPE and polypropylene

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0837476A2 (en) * 1996-10-17 1998-04-22 Union Carbide Chemicals & Plastics Technology Corporation Tree resistant cable
EP0837476A3 (en) * 1996-10-17 1998-08-12 Union Carbide Chemicals & Plastics Technology Corporation Tree resistant cable
JP2018518567A (en) * 2015-06-11 2018-07-12 ダウ グローバル テクノロジーズ エルエルシー Cable insulation comprising a blend of LDPE and polypropylene

Similar Documents

Publication Publication Date Title
FI100246B (en) Halogen-free, fire-retardant polymer composition
EP0129617B1 (en) Semiconducting compositions and wires and cables using the same
JP4341203B2 (en) Wire or cable
JPH01319204A (en) High voltage cable having insulation mainly composed of ethylene polymer having high resistance against formation of water-tree
JPS633049A (en) Resin composition
JPS633043A (en) Resin composition
JPS63205340A (en) Semiconductive mixture
JPH0564401B2 (en)
JPS5810801B2 (en) Semiconductive resin composition with improved peelability
JPH09129039A (en) Dc cable
JPS61225235A (en) Resin composition
JPS6112738A (en) Mixture for semiconductive layer
JPS61228047A (en) Resin composition
JPH024619B2 (en)
JPH01215841A (en) Flame-retarding composition
JPH04255738A (en) Insulating composition and production thereof
JPH0386742A (en) Crosslinkable ethylene copolymer composition
JPH0360122B2 (en)
JPH04253747A (en) Flame-retarding electrical-insulating composition
JPH04504B2 (en)
JPS61228045A (en) Resin composition
JPH0463904B2 (en)
JPH01118552A (en) Semiconductive composition
JPS61213233A (en) Polyolefin resin composition
JPS61228048A (en) Resin composition