JPS63300977A - Socket for semiconductor element inspection - Google Patents

Abstract

PURPOSE:To automate the loading and unloading of an IC to and from a socket for inspection by locking a stopper by a couple of pressure lids when the pressure lids slant to inversion positions. CONSTITUTION:The IC 1 is mounted on a receptacle 5 and then the couple of pressure lids 2 are slanted inward; and leads 20 of the IC 1 are pressed against contact pins 4 until the pins 4 and leads 20 contact each other electrically. When the tips of the lids 2 are at the inversion positions where the leads 20 are pressed, the rear ends of the lids 2 engages the engagement parts 17 of stoppers 3. The stoppers 3 are energized by spring 7, so the engagement states are held stably. Then electric characteristics of the IC 1 are inspected and then the upper ends of the stoppers 3 are fallen down inward to disengage the rear ends of the lids 2 from the engagement parts 17, so that the lids 2 return to their raised positions through the operation of springs 8. Consequently, the IC 2 can be taken out of the socket.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device testing socket for testing the electrical characteristics of a semiconductor device (hereinafter referred to as an IC).

[Prior Art] Conventionally, in this type of socket, an IC lead is held by a top cover that opens and closes in one direction, and the top cover is stopped with a manual stopper to allow the IC lead to be mounted and tested for electrical characteristics.

[Problems to be Solved by the Invention] However, in the conventional socket described above, since the IC lead is held down by only one top cover that opens and closes in one direction, the load is applied to only one IC lead immediately before the IC lead is held down. There is a problem in that there is a risk of bending the IC lead.

Furthermore, since the top cover is locked by a manual stopper, it is difficult to automatically mount or remove an IC from the socket.

Incidentally, the number of pins of recent ICs has increased, the IC leads have come out from the package in four orthogonal directions, and the IC leads have become thinner and the spacing between the pins has become narrower. Because of this, it is not possible to deal with such situations by manually holding down the IC lead as in the past, and there is a need for the development of a socket that can automatically attach and detach an IC.

The present invention has been made in view of such circumstances, and
It is possible to automatically attach or detach C.
Moreover, to provide a semiconductor device testing socket which avoids a situation where an uneven force acts on an IC and bends the IC lead when pressing the IC lead, and allows the IC to be mounted reliably and safely. With the goal.

[Means for Solving the Problems] A socket for testing semiconductor devices according to the present invention is a socket for testing semiconductor devices in which a semiconductor device is mounted and its electrical characteristics are tested. , at least one pair of presser covers that are supported so as to be tiltable and press the leads of the semiconductor element in the inverted position; a first biasing means that urges the presser covers toward the upright position; and a locking position and a release member. a stopper that is rotatably supported between the locking position and the locking position and locking the presser cover in the inverted position; and a second urging means that urges the stopper toward the locking position. It is characterized by

[Function] In the present invention, after placing the semiconductor element on the pedestal,
Each presser cover is simultaneously brought down to the down position to press the leads of the semiconductor element, and the presser cover is locked by a stopper. Therefore, the leads of the semiconductor element can be held down simply by folding down the holding cover. Note that since the stopper is biased toward the stop position by the second biasing means, it reliably locks the presser cover.

On the other hand, in order to remove the semiconductor element from the socket,
The stopper may be rotated to the release position to release the stopper from locking the presser cover. This allows the presser foot cover to
It stands up due to the urging force of the urging means and separates from the leads of the semiconductor element.

Further, since at least one pair of such presser covers is provided, an unbalanced load is not applied to the leads of the semiconductor element, and the leads of the semiconductor element are not bent. Note that when the leads of the semiconductor element come out from the package in four orthogonal directions, it is preferable to install two pairs of such holding lids to hold down the leads from the four orthogonal directions. Thereby, the load on the leads can be made more uniform.

[Embodiments] Next, embodiments of the present invention will be described with reference to the accompanying drawings. 1 and 2 are a front view and a plan view, respectively, showing a socket according to an embodiment of the present invention.

An IC is connected to the base 9 of the socket via a spring spring 6.
A cradle 5 is attached, and the IC cradle 5 is elastically supported by this spring 6.

The height of the pedestal 5 can be adjusted by moving the spring 6 up or down when attaching the spring 6 to the base 9.

Further, a contact pin 4 is attached to the base 9 near the edge of the pedestal 5 with its longitudinal direction perpendicular. In addition, in FIG. 2, an area 10 indicated by a dashed line is an area where the contact bottles 4 are arranged. Figure 2 also shows the outer frame 1 of the IC.
1 is also indicated by a dashed line.

On the base 9, facing the four sides of the rectangular ICI to be installed,
Two pairs of long lead pressers M2 extending along each side of the lead presser M2
is installed. This presser foot M2 is attached to the base 9 by support shafts 12 attached parallel to each side of the ICI so as to be swingable between an upright state and a state that is tilted toward the center of the socket. The presser lid 2 is urged toward the upright position (in the direction shown by the arrow 14) by a spring spring 8 serving as a first urging means. When the presser lid 2 is in the inverted position, its tip portion holds the ICI lead 20 between the upper end of the contact bin 4 and brings the lead 20 and the contact bin 4 into contact.

A stopper 3 is disposed adjacent to the outside of each presser lid 2. This stopper 3 is supported by a support shaft 15 extending parallel to the support shaft 12 of the presser lid 2 so as to be able to swing slightly, and is biased by a spring spring 7 in the direction indicated by an arrow 16 in the figure. . In addition, at the bottom of the stopper 3,
An engaging portion 17 that engages with the rear end portion of the presser lid 2 is formed.

In a socket configured in this way, first, the IC
I is lowered and placed on the pedestal 5.

Next, the two pairs of presser lids 2 are simultaneously tilted inward, and the tips of the presser lids 2 press the ICI lead 20 against the contact bin 4, and the tips and contact pins 4 are pressed together.
The contact bottle 4 and the lead 20 are brought into electrical contact by sandwiching the lead 20 between them.

Then, as the tip of the presser cover 2 falls toward the IC, the rear end of the presser cover 2 tilts toward the stopper 3, and after the rear end contacts the lower part of the stopper 3, it slightly pushes it away and rises. do.

The rear end of the presser cover 2 is engaged with the engaging portion 17 of the stopper 3 in the inverted position where the tip of the presser cover 2 presses the lead 20. Since the stopper 3 is biased by the spring 7, it stably maintains this engaged state.

When the IC 1 is removed from the socket after inspecting the electrical characteristics of the ICI, the upper end of the stopper 3 is slightly tilted inward to release the engagement between the rear end of the presser cover 2 and the engaging portion 17. . Then, due to the action of the spring 8, the presser cover 2
returns to standing position.

This frees up the ICI so that it can be removed from the socket.

[Effects of the Invention] As explained above, according to the present invention, at least one
Since a pair of presser covers are provided and the stopper locks the presser cover when the presser cover is tilted to the folded position, it is possible to automate the mounting and removal of semiconductor elements.

Further, since the leads of the semiconductor element are held down by at least one pair of holding lids, the load on the leads can be made uniform for each lead. Furthermore, when the leads come out from the package in four directions, by providing two pairs of holding lids, the leads can be held down with a more uniform and distributed force.

Therefore, occurrence of lead bending, etc. is suppressed.

[Brief explanation of drawings]

FIG. 1 is a front view showing a socket according to an embodiment of the present invention;
FIG. 2 is also a plan view thereof.

Claims (1)

[Claims] A socket for testing semiconductor devices in which a semiconductor device is mounted and its electrical characteristics tested includes a pedestal on which the semiconductor device is placed, and at least one pair of pedestals that are supported in a tiltable manner and hold down the leads of the semiconductor device in the tilted position. A presser cover, a first biasing means for urging the presser cover toward the upright position, and a first biasing means that is rotatably supported between a locking position and a release position, and in the locking position, the presser cover is turned down. 1. A socket for testing semiconductor devices, comprising: a stopper that locks the stopper; and second urging means that urges the stopper toward the locking position.