JPS63298924A - Resin mould bushing - Google Patents
Resin mould bushingInfo
- Publication number
- JPS63298924A JPS63298924A JP12974487A JP12974487A JPS63298924A JP S63298924 A JPS63298924 A JP S63298924A JP 12974487 A JP12974487 A JP 12974487A JP 12974487 A JP12974487 A JP 12974487A JP S63298924 A JPS63298924 A JP S63298924A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- airtightness
- central conductor
- thermal contraction
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 23
- 239000011347 resin Substances 0.000 title claims abstract description 23
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- 239000004945 silicone rubber Substances 0.000 claims description 6
- 239000002654 heat shrinkable material Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 239000002390 adhesive tape Substances 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 4
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 abstract description 3
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 abstract description 3
- 229920001971 elastomer Polymers 0.000 abstract description 2
- 238000005336 cracking Methods 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 description 13
- 238000005266 casting Methods 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Insulators (AREA)
Abstract
Description
【発明の詳細な説明】
(発明の目的)
(産業上の利用分野)
本発明は、例えば油入変圧器のような絶縁油または絶縁
ガス等を使用した電気機器に取付けられ、気密保持を必
要とする樹脂モールドブッシングに関するものである。Detailed Description of the Invention (Objective of the Invention) (Industrial Field of Application) The present invention is a device that is installed in electrical equipment that uses insulating oil or gas, such as an oil-immersed transformer, and that requires airtight maintenance. The present invention relates to a resin molded bushing.
(従来の技術)
注型絶縁は、電気絶縁機能、構造物としての機能を合せ
持ち、他の成形方法に比べて複雑な形状の製品がボイド
レスで得られることから、高電圧機器の固体絶縁の分野
に幅広く使用されている。(Prior technology) Cast insulation has both electrical insulation and structural functions, and can produce products with more complex shapes without voids than other molding methods, making it an ideal choice for solid insulation for high-voltage equipment. Widely used in various fields.
また、最近の電気機器は、大容量化、縮小化等による設
置スペースの縮少およびトータルコストの低減が望まれ
、使用される部品も付加価値の大、きいものが要求され
ている。In addition, recent electrical equipment is desired to have a larger capacity, to be smaller, and to thereby reduce the installation space and total cost, and the parts used are also required to be high-value-added and compact.
このことから、各種電気機器は、シリコーンオイル、フ
ロン液および石油系の絶縁油と固体絶縁との組合せ、ま
たは、六フッ化硫黄、フロンガス等の絶縁ガスと固体絶
縁との組合せによる使用が余儀なくされている。For this reason, various electrical devices are forced to use a combination of solid insulation with silicone oil, fluorocarbon liquid, or petroleum-based insulating oil, or a combination of insulating gas such as sulfur hexafluoride or fluorocarbon gas with solid insulation. ing.
このため、使用される各種部品に対しては、絶縁油およ
び絶縁ガスに対する気密性が要求され、使用条件も増々
苛酷なものとなっている。For this reason, the various parts used are required to be airtight against insulating oil and gas, and the conditions of use are becoming increasingly severe.
例えば、電車用の変圧器は、石油系絶縁油と樹脂モール
ドブッシングとしてエポキシ注型ブッシングとの組合せ
が利用され、車体の床下のような外部に取付けられる。For example, a transformer for a train uses a combination of petroleum-based insulating oil and an epoxy cast bushing as a resin molded bushing, and is installed outside, such as under the floor of a car body.
、電車の運転時は、コイル等の発熱により100°C以
上の高温に晒され、停止時、特に厳冬期には一20℃以
下の低温に晒される。このような苛酷な冷熱サイクルの
繰返しにより、待にエポキシ注型ブッシングの注型樹脂
に亀裂が発生した場合、重大事故を誘発することはいう
までもない。When a train is in operation, it is exposed to high temperatures of 100°C or more due to heat generated by coils, etc., and when it is stopped, especially in the harsh winter months, it is exposed to low temperatures of -20°C or less. Needless to say, if cracks occur in the cast resin of the epoxy cast bushing due to the repetition of such severe cooling and heating cycles, a serious accident may occur.
そこで、従来のエポキシ注型ブッシングは、第2図に示
すように中心導体1と注型樹脂層3の間に応力緩和層2
が設けられており、気密性をもたせるために中心導体1
の中間部に円形の銅板による隔壁4を半田付けし、この
部分だけは注型樹脂層3と強固に接着され気密保持を行
なっている。Therefore, the conventional epoxy cast bushing has a stress relaxation layer 2 between the center conductor 1 and the cast resin layer 3, as shown in FIG.
is provided, and the center conductor 1 is provided to provide airtightness.
A partition wall 4 made of a circular copper plate is soldered to the middle part of the wall, and only this part is firmly bonded to the casting resin layer 3 to maintain airtightness.
応力緩和層2には、硬化物がゴム状の性質を有する可ど
う性エポキシ樹脂やポリウレタン樹脂等が用いられてき
た。For the stress relaxation layer 2, flexible epoxy resins, polyurethane resins, and the like, whose cured products have rubber-like properties, have been used.
なお、同図の符@5はエポキシ注型ブッシングの取付ネ
ジがねじ込まれるねじ穴を設けた埋金、符号6はパツキ
ン用溝を示す。Note that in the same figure, the symbol @5 indicates a filler metal having a screw hole into which the mounting screw of the epoxy cast bushing is screwed, and the symbol 6 indicates a groove for a packing.
(発明が解決しようとする問題点)
しかし、可とう性エポキシ樹脂やポリウレタン樹脂によ
る応力緩和層2は、室温から高温域ではゴム状を呈し、
応力緩和層としての役割を十分発揮するが、例えば、−
20℃、−30’Cの低温域では弾性率が増し、ゴム状
の性質はなくなり、もろく、応力緩和層としての性質は
期待できないため、注型樹脂層3より早く亀裂が発生す
る場合もある。(Problems to be Solved by the Invention) However, the stress relaxation layer 2 made of flexible epoxy resin or polyurethane resin exhibits a rubber-like appearance in the range from room temperature to high temperature.
Although it fully plays its role as a stress relaxation layer, for example, -
In the low temperature range of 20°C and -30'C, the elastic modulus increases, the rubber-like properties disappear, and it becomes brittle and cannot be expected to have properties as a stress relaxation layer, so cracks may occur earlier than the casting resin layer 3. .
また、気密保持のため中心導体1の一部(隔壁4の取付
部)は注型樹脂層3と強固に接着するように処理がほど
こされているが、第2図に示すA部のような応力緩和層
2との境界は、液状の注型材料が反応によって硬化し、
固化した時の体積収縮により残留歪が発生する部分であ
り、上記した冷熱サイクルによって最も応力集中が起り
やすく、亀裂の引金となる部位である。In addition, in order to maintain airtightness, a part of the center conductor 1 (the attachment part of the partition wall 4) is treated so that it firmly adheres to the casting resin layer 3. At the boundary with the stress relaxation layer 2, the liquid casting material hardens by reaction,
This is the part where residual strain is generated due to volumetric contraction when solidified, and is the part where stress concentration is most likely to occur due to the above-mentioned cooling/heating cycle, which can trigger cracks.
隔壁4については、注型樹脂層3に悪影響をおよぼすこ
となくしかも電気的に電界集中の起りにくい形状とする
ため、複雑な応力計算および電界計算によって決定され
るから、加工や中心導体1への取付位置、取付方法等に
かなりの工夫が必要となり、コストアップの原因となっ
ていた。むしろ、エポキシ注型ブッシングからみた場合
、隔壁4は不要であり、ない方が特性的に良い。The partition wall 4 is determined by complex stress calculations and electric field calculations in order to have a shape that does not adversely affect the cast resin layer 3 and is less likely to cause electrical field concentration, so there are no processing or changes to the central conductor 1. Considerable ingenuity was required in the mounting position, mounting method, etc., leading to an increase in costs. Rather, when viewed from the epoxy cast bushing, the partition wall 4 is unnecessary, and its characteristics are better without it.
本発明の目的は、耐亀裂性および耐気密性の優れた樹脂
モールドブッシングを提供することにある。An object of the present invention is to provide a resin molded bushing with excellent crack resistance and airtightness.
(問題を解決するための手段および作用)本発明は、中
心導体と注型樹脂層の間に応力緩和層を介在させる樹脂
モールドブッシングにおいて、中心導体にシリコンゴム
系粘着剤からなる第1層を設け、この第1層の上に熱収
縮材からなる第2層を設けて加熱することにより、応力
緩和層を形成するようにしたもので、苛酷な環境で使用
しても十分なる耐気密性と耐亀裂性を持つようにしたも
のでおる。(Means and effects for solving the problem) The present invention provides a resin molded bushing in which a stress relaxation layer is interposed between a center conductor and a cast resin layer, in which a first layer made of a silicone rubber adhesive is applied to the center conductor. A second layer made of a heat shrinkable material is provided on top of the first layer and heated to form a stress relaxation layer, which has sufficient airtightness even when used in harsh environments. It is made to have crack resistance.
(実施例)
以下、本発明の一実施例を図面を参照して説明する。な
お、第2図と同一部分には同符号を付し、重複した説明
は省略する。第1図は本発明の一実施例の断面図である
。エポキシ注型ブッシングは、中心導体1に厚さ約0.
5mのシリコーンゴム系粘着テープ(株式会社レイケム
の商品、商品番号31085−1−900 >を1/2
ラツプで巻回して応力緩和層の主要部となる第1層11
を設け、この第1層11の上に架橋ポリオレフィン系の
熱収縮テープ(ペンニット−株式会社の商品名インサル
テープ)を同じく1/2ラツプで巻回して第2層12を
設け、この後所定の条件で加熱収縮を行ない応力緩和層
13を形成する。このようにして得られた応力緩和層1
3に、注型樹脂H3との接着性向上のため、表面を有機
溶剤およびクロム酸混液(重クロム酸ナトリウムと水と
@酸を加えたもの)で処理する。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. Note that the same parts as in FIG. 2 are denoted by the same reference numerals, and redundant explanation will be omitted. FIG. 1 is a sectional view of an embodiment of the present invention. The epoxy cast bushing is applied to the center conductor 1 with a thickness of approximately 0.0 mm.
5m silicone rubber adhesive tape (product of Raychem Co., Ltd., product number 31085-1-900)
The first layer 11 is wound in a lap and becomes the main part of the stress relaxation layer.
A cross-linked polyolefin heat-shrinkable tape (Pennnit Co., Ltd.'s product name Insuru Tape) is wound on top of this first layer 11 with a 1/2 wrap to form a second layer 12. Heat shrinkage is performed under the following conditions to form the stress relaxation layer 13. Stress relaxation layer 1 obtained in this way
3, the surface is treated with an organic solvent and a chromic acid mixture (a mixture of sodium dichromate, water, and @acid) to improve adhesion to the casting resin H3.
この処理をした後金型に組込み、所定の条件で予熱を行
う。この後、ビスフェノールA型エポキシ樹脂、三無水
物系硬化剤、副資材としてシリカン粉末を多量に含み、
さらに硬化促進剤として第三級アミノを混合したエポキ
シ樹脂系注型材料によって注型を行ない、所定の硬化条
件で硬化させる。After this treatment, it is assembled into a mold and preheated under predetermined conditions. After this, a bisphenol A type epoxy resin, a trianhydride curing agent, and a large amount of silica powder as an auxiliary material are added.
Further, casting is performed using an epoxy resin casting material mixed with tertiary amino as a curing accelerator, and the material is cured under predetermined curing conditions.
なお、本発明者らはこのような方法により、略直径が1
00IrunX長さ500mのエポキシ注型ブッシング
を製作した。In addition, the present inventors used such a method to obtain a material with a diameter of approximately 1.
00IrunX An epoxy cast bushing with a length of 500 m was manufactured.
次に、以上のようにして製作したエポキシ注型ブッシン
グの特性について説明する。Next, the characteristics of the epoxy cast bushing produced as described above will be explained.
中心導体1に近接するシリコーンゴム系粘着テープによ
る第1層11は、150℃以上の高温下でもパテ状を保
ち、流れ出ることはなく、−50℃の低温雰囲気でもゴ
ム弾性を失なわないから急熱、急冷時に中心導体1と注
型尉脂層3の熱膨張係数の差によって発生する応力を十
分緩和できる。しかも、シリコンゴム系粘着テープによ
る第1層11は、熱収縮テープによる第2層12の熱収
縮により、中心導体1と熱収縮テープによる第2層12
に密着し、完全に気密が保たれる。熱収縮テープによる
第2層12は、クロム酸混液処理により、注型樹脂層3
と全体に強固に接着させるため耐気密性を増し、注型樹
脂層3に対して応力集中のない耐亀裂性の優れたエポキ
シ注型ブッシングが得られる。次の表に従来法によるエ
ポキシ注型ブッシングと本発明の一実施例のエポキシ注
型ブッシングを、試験前と98℃〜100’Cの温水に
1時間浸漬、O℃〜2℃冷水に1時間浸漬を1サイクル
とし、10サイクル繰返す冷熱サイクル試験を行なった
後の目視検査による亀裂の有無およびヘリウムデテクタ
ーによる気密性の検査結果を示す。実施例に用いたエポ
キシ注型ブッシングは、1O−7torr、 11 /
secを保証する必要があるが、同表に示すように繰返
し冷熱サイクルを受けても外観に異常はみられず、上記
した気密性を十分満足するものが本発明により得られた
。The first layer 11 made of silicone rubber adhesive tape adjacent to the center conductor 1 maintains a putty-like shape even at high temperatures of 150°C or higher, does not flow out, and does not lose its rubber elasticity even in a low-temperature atmosphere of -50°C. The stress generated due to the difference in thermal expansion coefficient between the center conductor 1 and the cast resin layer 3 during heating and rapid cooling can be sufficiently alleviated. In addition, the first layer 11 made of silicone rubber adhesive tape is heated by heat shrinking of the second layer 12 made of heat shrinkable tape, and the center conductor 1 and the second layer 11 made of heat shrinkable tape are bonded together.
It is completely airtight. The second layer 12 made of heat-shrinkable tape is formed by the casting resin layer 3 by treatment with a chromic acid mixture.
Since it is firmly adhered to the whole body, airtightness is increased, and an epoxy cast bushing with excellent crack resistance without stress concentration on the cast resin layer 3 is obtained. The following table shows the epoxy cast bushings made by the conventional method and the epoxy cast bushings according to an embodiment of the present invention, before testing, immersed in hot water at 98°C to 100'C for 1 hour, and immersed in cold water at 0°C to 2°C for 1 hour. The results of a visual inspection of the presence of cracks and an airtightness inspection using a helium detector after conducting a thermal cycle test in which 1 cycle of immersion was repeated for 10 cycles are shown. The epoxy cast bushing used in the example had a pressure of 1O-7torr, 11/
sec, but as shown in the table, there was no abnormality in appearance even after repeated cooling and heating cycles, and the present invention provided a product that satisfactorily satisfies the above-mentioned airtightness.
本発明は、以上のように構成されているから、シリコー
ンゴム系粘着剤による第1層と熱収縮テープによる第2
層で応力緩和層を形成することにより鴬1耐気密性の優
れた。しかも苛酷な冷熱サイクルによっても亀裂発生の
ない樹脂モールドブッシングが得られる。Since the present invention is configured as described above, the first layer is made of a silicone rubber adhesive and the second layer is made of a heat shrinkable tape.
By forming a stress-relaxing layer, Utsugi 1 has excellent airtightness. Moreover, a resin molded bushing that does not crack even under severe heating and cooling cycles can be obtained.
第1図は本発明の一実施例を示す断面図、第2図は従来
のエポキシ注型ブッシングを示す断面図である。
1・・・中心導体、 3・・・注型樹脂層11・・
・第1層、 12・・・第2層13・・・応力緩
和層
(8733) 代理人 弁理士 猪 股 祥 晃(ば
か1名)
第2図FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional epoxy cast bushing. 1... Center conductor, 3... Casting resin layer 11...
・First layer, 12...Second layer 13...Stress relaxation layer (8733) Agent Patent attorney Yoshiaki Inomata (1 idiot) Figure 2
Claims (1)
脂モールドブッシングにおいて、前記中心導体にシリコ
ンゴム系粘着剤からなる第1層を設け、この第1層の上
に熱収縮性材からなる第2層を設けて加熱することによ
り、前記応力緩和層を形成することを特徴とする樹脂モ
ールドブッシング。In a resin molded bushing in which a stress relaxation layer is interposed between a center conductor and a cast resin layer, a first layer made of a silicone rubber adhesive is provided on the center conductor, and a heat-shrinkable material is applied on the first layer. A resin molded bushing, characterized in that the stress relaxation layer is formed by providing a second layer and heating it.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12974487A JPS63298924A (en) | 1987-05-28 | 1987-05-28 | Resin mould bushing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12974487A JPS63298924A (en) | 1987-05-28 | 1987-05-28 | Resin mould bushing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63298924A true JPS63298924A (en) | 1988-12-06 |
Family
ID=15017132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12974487A Pending JPS63298924A (en) | 1987-05-28 | 1987-05-28 | Resin mould bushing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63298924A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3355318A1 (en) * | 2017-01-31 | 2018-08-01 | Tyco Electronics Raychem GmbH | High-power bushing for harsh environments |
-
1987
- 1987-05-28 JP JP12974487A patent/JPS63298924A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3355318A1 (en) * | 2017-01-31 | 2018-08-01 | Tyco Electronics Raychem GmbH | High-power bushing for harsh environments |
WO2018141775A1 (en) * | 2017-01-31 | 2018-08-09 | Tyco Electronics Raychem Gmbh | High-power bushing for harsh environments |
CN110268485A (en) * | 2017-01-31 | 2019-09-20 | 泰科电子瑞侃有限责任公司 | High power casing for adverse circumstances |
KR20190108618A (en) * | 2017-01-31 | 2019-09-24 | 타이코 일렉트로닉스 레이켐 게엠베하 | High Power Bushings for Harsh Environments |
CN110268485B (en) * | 2017-01-31 | 2021-03-09 | 泰科电子瑞侃有限责任公司 | High power bushing for harsh environments |
US10971832B2 (en) | 2017-01-31 | 2021-04-06 | Tyco Electronics Raychem Gmbh | High-power bushing for harsh environments |
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