JPS63275663A - Production of crosslinked resin - Google Patents
Production of crosslinked resinInfo
- Publication number
- JPS63275663A JPS63275663A JP10967287A JP10967287A JPS63275663A JP S63275663 A JPS63275663 A JP S63275663A JP 10967287 A JP10967287 A JP 10967287A JP 10967287 A JP10967287 A JP 10967287A JP S63275663 A JPS63275663 A JP S63275663A
- Authority
- JP
- Japan
- Prior art keywords
- polyoxazine
- oxazine
- oxazoline
- derivative
- methyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 26
- 239000011347 resin Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 21
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 238000006243 chemical reaction Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 8
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 18
- 125000001931 aliphatic group Chemical group 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 6
- 229920000515 polycarbonate Polymers 0.000 abstract description 6
- 239000004417 polycarbonate Substances 0.000 abstract description 6
- 230000009477 glass transition Effects 0.000 abstract description 5
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 abstract description 2
- 150000002430 hydrocarbons Chemical group 0.000 abstract description 2
- 238000005809 transesterification reaction Methods 0.000 abstract description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical class C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 13
- 239000002253 acid Substances 0.000 description 9
- -1 etherimide Polymers 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- IQOZTIKBIHWYQQ-UHFFFAOYSA-N 4h-1,3-oxazine Chemical compound C1C=COC=N1 IQOZTIKBIHWYQQ-UHFFFAOYSA-N 0.000 description 5
- 239000002841 Lewis acid Chemical class 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 150000007517 lewis acids Chemical class 0.000 description 5
- 229920002492 poly(sulfone) Polymers 0.000 description 4
- 229920001230 polyarylate Polymers 0.000 description 4
- ZXTHWIZHGLNEPG-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C1=CC=CC=C1 ZXTHWIZHGLNEPG-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 150000001350 alkyl halides Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000765 poly(2-oxazolines) Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- FOCSWKJNNDKQBA-UHFFFAOYSA-N 2-(2-methylphenyl)-4,5-dihydro-1,3-oxazole Chemical compound CC1=CC=CC=C1C1=NCCO1 FOCSWKJNNDKQBA-UHFFFAOYSA-N 0.000 description 2
- IFIUFEBEPGGBIJ-UHFFFAOYSA-N 4-methyl-4,5-dihydro-1,3-oxazole Chemical compound CC1COC=N1 IFIUFEBEPGGBIJ-UHFFFAOYSA-N 0.000 description 2
- CIIILUMBZOGKDF-UHFFFAOYSA-N 5-methyl-4,5-dihydro-1,3-oxazole Chemical compound CC1CN=CO1 CIIILUMBZOGKDF-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000002918 oxazolines Chemical class 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- BEQDKWKSUMQVMX-UHFFFAOYSA-N 2,4-dimethyl-4,5-dihydro-1,3-oxazole Chemical compound CC1COC(C)=N1 BEQDKWKSUMQVMX-UHFFFAOYSA-N 0.000 description 1
- DXPIUHXKXUKZDK-UHFFFAOYSA-N 2,5-dimethyl-4,5-dihydro-1,3-oxazole Chemical compound CC1CN=C(C)O1 DXPIUHXKXUKZDK-UHFFFAOYSA-N 0.000 description 1
- IRLYGRLEBKCYPY-UHFFFAOYSA-M 2,5-dimethylbenzenesulfonate Chemical compound CC1=CC=C(C)C(S([O-])(=O)=O)=C1 IRLYGRLEBKCYPY-UHFFFAOYSA-M 0.000 description 1
- KFNAHVKJFHDCSK-UHFFFAOYSA-N 2-[2-(4,5-dihydro-1,3-oxazol-2-yl)ethyl]-4,5-dihydro-1,3-oxazole Chemical compound N=1CCOC=1CCC1=NCCO1 KFNAHVKJFHDCSK-UHFFFAOYSA-N 0.000 description 1
- GZQKJQLFIGBEIE-UHFFFAOYSA-N 2-[4-(4,5-dihydro-1,3-oxazol-2-yl)butyl]-4,5-dihydro-1,3-oxazole Chemical compound N=1CCOC=1CCCCC1=NCCO1 GZQKJQLFIGBEIE-UHFFFAOYSA-N 0.000 description 1
- VRRKNSMODVXFPP-UHFFFAOYSA-N 2-[4-(5,6-dihydro-4h-1,3-oxazin-2-yl)butyl]-5,6-dihydro-4h-1,3-oxazine Chemical compound N=1CCCOC=1CCCCC1=NCCCO1 VRRKNSMODVXFPP-UHFFFAOYSA-N 0.000 description 1
- NYEZZYQZRQDLEH-UHFFFAOYSA-N 2-ethyl-4,5-dihydro-1,3-oxazole Chemical compound CCC1=NCCO1 NYEZZYQZRQDLEH-UHFFFAOYSA-N 0.000 description 1
- GUXJXWKCUUWCLX-UHFFFAOYSA-N 2-methyl-2-oxazoline Chemical compound CC1=NCCO1 GUXJXWKCUUWCLX-UHFFFAOYSA-N 0.000 description 1
- NHKJNWKLSOOMTQ-UHFFFAOYSA-N 2-prop-1-enyl-4,5-dihydro-1,3-oxazole Chemical compound CC=CC1=NCCO1 NHKJNWKLSOOMTQ-UHFFFAOYSA-N 0.000 description 1
- FYQUELMPDYVBFY-UHFFFAOYSA-N 4-methyl-2-[4-(4-methyl-4,5-dihydro-1,3-oxazol-2-yl)phenyl]-4,5-dihydro-1,3-oxazole Chemical compound CC1COC(C=2C=CC(=CC=2)C=2OCC(C)N=2)=N1 FYQUELMPDYVBFY-UHFFFAOYSA-N 0.000 description 1
- UFTHEDBYLPFRDP-UHFFFAOYSA-N 5,6-dihydro-2h-oxazine Chemical compound C1CC=CNO1 UFTHEDBYLPFRDP-UHFFFAOYSA-N 0.000 description 1
- UWHWRJUMACAJPY-UHFFFAOYSA-N 5-methyl-2-phenyl-4,5-dihydro-1,3-oxazole Chemical compound O1C(C)CN=C1C1=CC=CC=C1 UWHWRJUMACAJPY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical class FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- AGEZXYOZHKGVCM-UHFFFAOYSA-N benzyl bromide Chemical compound BrCC1=CC=CC=C1 AGEZXYOZHKGVCM-UHFFFAOYSA-N 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- KMGBZBJJOKUPIA-UHFFFAOYSA-N butyl iodide Chemical compound CCCCI KMGBZBJJOKUPIA-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 description 1
- FHESUNXRPBHDQM-UHFFFAOYSA-N diphenyl benzene-1,3-dicarboxylate Chemical compound C=1C=CC(C(=O)OC=2C=CC=CC=2)=CC=1C(=O)OC1=CC=CC=C1 FHESUNXRPBHDQM-UHFFFAOYSA-N 0.000 description 1
- HPGJOUYGWKFYQW-UHFFFAOYSA-N diphenyl benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OC=2C=CC=CC=2)C=CC=1C(=O)OC1=CC=CC=C1 HPGJOUYGWKFYQW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- XDRMBCMMABGNMM-UHFFFAOYSA-N ethyl benzenesulfonate Chemical compound CCOS(=O)(=O)C1=CC=CC=C1 XDRMBCMMABGNMM-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- ANNNGOUEZBONHD-UHFFFAOYSA-N ethyl phenylmethanesulfonate Chemical compound CCOS(=O)(=O)CC1=CC=CC=C1 ANNNGOUEZBONHD-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- HVTICUPFWKNHNG-UHFFFAOYSA-N iodoethane Chemical compound CCI HVTICUPFWKNHNG-UHFFFAOYSA-N 0.000 description 1
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 1
- XJTQJERLRPWUGL-UHFFFAOYSA-N iodomethylbenzene Chemical compound ICC1=CC=CC=C1 XJTQJERLRPWUGL-UHFFFAOYSA-N 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- CZXGXYBOQYQXQD-UHFFFAOYSA-N methyl benzenesulfonate Chemical compound COS(=O)(=O)C1=CC=CC=C1 CZXGXYBOQYQXQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- PVWOIHVRPOBWPI-UHFFFAOYSA-N n-propyl iodide Chemical compound CCCI PVWOIHVRPOBWPI-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- CYTQBVOFDCPGCX-UHFFFAOYSA-N trimethyl phosphite Chemical compound COP(OC)OC CYTQBVOFDCPGCX-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は架橋樹脂の製造法に関するものであり、更に詳
しくは、耐熱性、耐薬品性、m械的特性に優れた架橋樹
脂を速架橋性でかつ優れた成形性で製造する方法に関す
るものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a method for producing a crosslinked resin, and more specifically, the present invention relates to a method for producing a crosslinked resin. The present invention relates to a method for producing the product with high flexibility and excellent moldability.
〈従来技術〉
近年、技術の進歩に伴ない、耐熱性1機械的性質に優れ
、かつ成形性の優れた樹脂が要求されている。これらの
樹脂の中でも特に反応性モノマーあるいはオリゴマーを
用いた反応成形型樹脂、すなわち、比較的低粘度の原料
を用いて成形と重合とを同時に行う樹脂が注目されてい
る。かかる樹脂としてはポリウレタン樹脂、ポリウレア
樹脂。<Prior Art> In recent years, with the advancement of technology, there has been a demand for resins that have excellent heat resistance, mechanical properties, and moldability. Among these resins, reaction-molding resins using reactive monomers or oligomers, that is, resins in which molding and polymerization are simultaneously performed using raw materials with relatively low viscosity, have attracted particular attention. Such resins include polyurethane resin and polyurea resin.
ナイロン樹脂、エポキシ樹脂、不飽和ボリエステル樹脂
等が知られており、一部は商品化されている。Nylon resins, epoxy resins, unsaturated polyester resins, etc. are known, and some are commercialized.
しかしながら、これらの樹脂には夫々一長一短があり、
例えはポリウレタン樹脂では耐熱性が低く、不飽和ポリ
エステル樹脂では反応、すなわち成形に時間がかかる等
の欠点があり、必ずしも十分な性能および成形性を有し
ているとはいえない。However, each of these resins has its advantages and disadvantages.
For example, polyurethane resins have low heat resistance, and unsaturated polyester resins have drawbacks such as the time required for reaction, that is, molding, and cannot necessarily be said to have sufficient performance and moldability.
一方、溶融成形可能で機械的特性の優れたポリマーとし
て芳香族ポリエステル、芳香族ポリカーボネート、ポリ
アミド等の熱可塑性樹脂が知られている。しかし、かか
る熱可塑性樹脂は熱硬化型樹脂に比べ耐熱性が十分でな
く、また耐薬品性等にも問題がある。On the other hand, thermoplastic resins such as aromatic polyester, aromatic polycarbonate, and polyamide are known as polymers that can be melt molded and have excellent mechanical properties. However, such thermoplastic resins do not have sufficient heat resistance compared to thermosetting resins, and also have problems in chemical resistance.
〈発明の目的〉
本発明者等は、熱可塑性樹脂の有する優れた成形性1機
械的性質等と、熱硬化樹脂の有する優れた耐熱性、耐薬
品性等を兼備した新規な樹脂を開発すべく鋭意検討した
結果、熱可塑性樹脂とポリオキサジン誘導体とを特定割
合で配合してなる組成物を触媒の存在下に加熱し、該熱
可塑性樹脂マトリックス中で該ポリオキサジン誘導体を
重合させることにより、上述の特性を兼備した強靭な架
橋樹脂が得られることを見出し、本発明に到達した。<Purpose of the Invention> The present inventors have developed a new resin that combines the excellent moldability and mechanical properties of thermoplastic resins with the excellent heat resistance, chemical resistance, etc. of thermosetting resins. As a result of intensive study, we found that by heating a composition formed by blending a thermoplastic resin and a polyoxazine derivative in a specific ratio in the presence of a catalyst, and polymerizing the polyoxazine derivative in the thermoplastic resin matrix, It was discovered that a strong crosslinked resin having the above-mentioned properties could be obtained, and the present invention was achieved.
従って、本発明の目的は耐熱性、耐薬品性1機械的性質
に優れた架橋樹脂を迅速かつ優れた成形性で製造する方
法を提供することにある。Therefore, an object of the present invention is to provide a method for producing a crosslinked resin having excellent heat resistance, chemical resistance, and mechanical properties quickly and with excellent moldability.
〈発明の構成・効果〉
本発明の目的は、本発明によれば、熱可塑性樹脂(A)
と下記式(I)
a
−C−Rh
/ \ Rc
−C−Re
f
で示されるポリオキサジン誘導体(B)からなり、かつ
熱可塑性樹脂(A)対ポリオキサジン誘導体(B)の割
合が重量比で90:10〜30ニア0である組成物を、
触媒の存在下に加熱反応させることを特徴とする架橋樹
脂の製造法によって達成される。<Configuration/Effects of the Invention> According to the present invention, an object of the present invention is to provide thermoplastic resin (A)
and a polyoxazine derivative (B) represented by the following formula (I) a -C-Rh / \ Rc -C-Re f , and the ratio of the thermoplastic resin (A) to the polyoxazine derivative (B) is the same by weight. A composition having a ratio of 90:10 to 30 near 0,
This is achieved by a method for producing a crosslinked resin characterized by carrying out a heating reaction in the presence of a catalyst.
本発明においてA成分として用いる熱可塑性樹脂として
は、芳香族ポリエステル、ポリアミド。The thermoplastic resin used as component A in the present invention includes aromatic polyester and polyamide.
芳香族ポリカーボネート、ポリスルホン、ポリエーテル
、ポリエーテルスルホン、ポリエーテルイミド、ポリオ
レフィン、アクリル系樹脂等を例示することができるが
、これらのうちガラス転移点(’1’ g )が50℃
以上であるものが好ましい、このガラス転移点(Tg)
が高いもの程得られる架橋樹脂の耐熱性も高くなるので
、該ガラス転移点(Tg)が100℃以上のものが更に
好ましい、好ましい熱可塑性樹脂の具体例としては芳香
族ポリカーボネート、ボリアリレート、ポリエーテルイ
ミド、ポリスルホン、ポリエーテルスルホン等の非品性
もしくは難結晶性ポリマーを挙げることができる。Examples include aromatic polycarbonates, polysulfones, polyethers, polyethersulfones, polyetherimides, polyolefins, acrylic resins, etc. Among these, those with a glass transition point ('1' g ) of 50°C
This glass transition point (Tg) is preferably higher than or equal to
The higher the temperature, the higher the heat resistance of the resulting crosslinked resin, so those with a glass transition point (Tg) of 100°C or higher are more preferable.Specific examples of preferable thermoplastic resins include aromatic polycarbonate, polyarylate, and polyester. Examples include non-quality or poorly crystalline polymers such as etherimide, polysulfone, and polyethersulfone.
熱可塑性樹脂の重合度としては、例えは固有粘度で0.
3以上、更には0.4以上、特に0.5以上であること
とが好ましい。The degree of polymerization of thermoplastic resin is, for example, 0.0 in terms of intrinsic viscosity.
It is preferably 3 or more, more preferably 0.4 or more, particularly 0.5 or more.
本発明においてB成分として用いるポリオキサジン誘導
体は下記式(■))
a
N−C−Rb
7 \ Rc
0− C−Re
f
で示される化合物である。上記式中、nは2〜4の整数
を示すが、これらのうち2が好ましい。The polyoxazine derivative used as component B in the present invention is a compound represented by the following formula (■)) a N-C-Rb7\Rc0-C-Ref. In the above formula, n represents an integer of 2 to 4, with 2 being preferred.
Rはn価の脂肪族、脂環族および芳香族の炭化水素基を
示し、n=2の場合、Rは直接結合であってもよい、R
としては、具体的には、n=2の場合エチレン、トリメ
チレン、プロピレン、テトラメチレン、ヘキサメチレン
、ネオベンチレン・10以下の脂肪族、炭素数10以下
の脂環族、炭素数12以下の芳香族の炭化水素基が好ま
しい。R represents an n-valent aliphatic, alicyclic, or aromatic hydrocarbon group, and when n = 2, R may be a direct bond, R
Specifically, when n=2, ethylene, trimethylene, propylene, tetramethylene, hexamethylene, neobenzene, aliphatic group having 10 or less carbon atoms, alicyclic group having 10 or less carbon atoms, aromatic group having 12 carbon atoms or less Hydrocarbon groups are preferred.
Ra、 Rb、 Rc、 Rd、 ReおよびRfは夫
々水素原子、炭素数3以下の脂肪族炭化水素基および炭
素数7以下の芳香族炭化水素基を示し、これらは同一で
も夫々異なってもよい、具体的には、炭素数3以下の脂
肪族化水素基としてはメチル基、エチル基等を例示でき
、炭素数7以下の芳香族炭化水素基としてはフェニル基
、トリル基等を例示できる。Ra、Rb、Re、Rd、
ReおよびRfはそのすべてが水素原子、あるいはその
うち任意の1つがメチル基で、残りが水素原子であるこ
とが好ましく、すべてが水素原子であることが特に好ま
しい。Ra, Rb, Rc, Rd, Re and Rf each represent a hydrogen atom, an aliphatic hydrocarbon group having 3 or less carbon atoms, and an aromatic hydrocarbon group having 7 or less carbon atoms, and these may be the same or different, Specifically, examples of the aliphatic hydrogen group having 3 or less carbon atoms include methyl group and ethyl group, and examples of the aromatic hydrocarbon group having 7 or less carbon atoms include phenyl group and tolyl group. Ra, Rb, Re, Rd,
It is preferable that all of Re and Rf are hydrogen atoms, or any one of them is a methyl group, and the rest are hydrogen atoms, and it is particularly preferable that all of them are hydrogen atoms.
かかるポリオキサジン誘導体としては、具体的には、2
,2°−ビス(5,6−シヒドロー40−1.3−オキ
サジン) 、 2.2’−エチレンビス(5,6−シヒ
ドロー48−1.3−オキサジン) 、 2.2’−テ
トラメチレンビス(5,6−シヒドロー4H−1,3−
オキサジン) 、 2.2’−へキサメチレンビス(5
,6−ジしドロー4](−1,3−オキサジン) 、
2,2°−オクタメチレンビス(5,6−シヒドロー4
H−1,3−オキサジン) 、 2.2’−1,4−シ
クロヘキシレンビス(5,6−シヒドロー4H−1,3
−オキサジン) 、 2.2’−ビス(4−メチル−5
,6−シヒドロー4 H−1,3−オキサジン) 、
2.2’−ビス(5−メチル−5,6−シヒドロー48
−1.3−オキサジン) 、 2.2’−ビス(6−メ
チル−5,6−シヒドロー4H−1,3−オキサジン)
、2.2’−m−フェニレンビス(5,6−シヒドロー
4H−1,3−オキサジン) 、 2.2’−P−フェ
ニレンビス(5,6−ジヒド0−4H−1.3−オキサ
ジン)、2.2’−m−フニレンビス(4−メチル−5
,6−シヒドロー48−1.3−オキサジン)、2.2
’−m−フェニレンビス(5−メチル−5,6−シヒド
ロー4H−1,3−オキサジン)、2.2’−m−フェ
ニレンビス(6−メチル−5,6−ジしドロー4H−1
,3−オキサジン)、2.2”−p−フェニレンビス(
4−メチル−5,6−シヒドロー48−1.3−オキサ
ジン)。Specifically, such polyoxazine derivatives include 2
, 2°-bis(5,6-sihydro-40-1,3-oxazine), 2,2'-ethylenebis(5,6-sihydro-48-1,3-oxazine), 2,2'-tetramethylenebis (5,6-Sihydro4H-1,3-
oxazine), 2,2'-hexamethylene bis(5
, 6-jishi draw 4] (-1,3-oxazine),
2,2°-octamethylenebis(5,6-sihydro4
H-1,3-oxazine), 2,2'-1,4-cyclohexylenebis(5,6-cyhydro4H-1,3
-oxazine), 2,2'-bis(4-methyl-5
,6-sihydro4H-1,3-oxazine),
2.2'-bis(5-methyl-5,6-sihydro48
-1,3-oxazine), 2,2'-bis(6-methyl-5,6-sihydro-4H-1,3-oxazine)
, 2.2'-m-phenylenebis(5,6-dihydro-4H-1,3-oxazine), 2.2'-P-phenylenebis(5,6-dihydro-4H-1,3-oxazine) , 2,2'-m-phnylenebis(4-methyl-5
, 6-sihydro48-1,3-oxazine), 2.2
'-m-phenylenebis(5-methyl-5,6-dihydro4H-1,3-oxazine), 2,2'-m-phenylenebis(6-methyl-5,6-dihydro4H-1
, 3-oxazine), 2.2”-p-phenylenebis(
4-methyl-5,6-sihydro-48-1,3-oxazine).
2.2“−p−フェニレンビス(5−メチル−5,6−
シヒドロー4H−1,3−オキサジン) 、 2,2°
−p−フェニレンビス(6−メチル−5,6−シヒドロ
ー48−1.3−オキサジン)等を例示することができ
る。これらのうち2,2°−ビス(5,6−ジしドロー
48−1.3−オキサジン) 、 2.2’−テトラメ
チレンビス(5,6−シヒドロー4 H−1,3−オキ
サジン) 、 2,2°−m−フェニレンビス(5,6
−シヒドロー4H−1,3−オキサジン) 、 2,2
°−p−フニレンビス(5,6−シヒドロー4H−1,
3−オキサジン)が好ましい、これらは一種または二種
以上の混合物として用いることができる。2.2"-p-phenylenebis(5-methyl-5,6-
Shihydro 4H-1,3-oxazine), 2,2°
-p-phenylenebis(6-methyl-5,6-cyhydro-48-1,3-oxazine) and the like can be exemplified. Among these, 2,2°-bis(5,6-dihydro-48-1,3-oxazine), 2,2'-tetramethylenebis(5,6-dihydro-4H-1,3-oxazine), 2,2°-m-phenylenebis(5,6
-Sihydro4H-1,3-oxazine), 2,2
°-p-phnylenebis(5,6-sihydro4H-1,
3-oxazine) is preferred, and these can be used alone or as a mixture of two or more.
・本発明においてポリオキサジン誘導体の一部を下記式
(II)
で示されるオキサゾリン誘導体及び/または下記式(I
I[)
Ra
−C−Rb
)N
\ / Rd
−C−Re
\、。- In the present invention, a part of the polyoxazine derivative is an oxazoline derivative represented by the following formula (II) and/or a part of the polyoxazine derivative represented by the following formula (I).
I[) Ra -C-Rb )N \ / Rd -C-Re \,.
1及びRfは式(I)の場合と同じである。)で示され
るモノオキサジン化合物で置換することかできる。オキ
サゾリン誘導体のうちポリオキサゾリン誘導体の使用量
は例えばポリオキサジン誘導体の90モル%以下、更に
は70モル%以下を置換する量が好ましく、またモノオ
キサゾリン誘導体やモノオキサジン化合物の使用量は例
えばポリオキサジン誘導体の30モル%以下、更には2
5モル%以下を置換する量が好ましい。ポリオキサゾリ
ン誘導体とモノオキサゾリン誘導体及び/またはモノオ
キサジン化合物とを併用する場合には、これらの総量が
ポリオキサジン誘導体の90モル%を越えないようにす
るのか好ましい。式(n)におけるR、Ra 、Rb
、RcおよびRd並びに式(III)におけるRa 、
Rb 、Rc 、Rd 、ReおよびRfの説明には、
夫々式(I)のところで説明したことがそのまま適用で
きる。また式(II)におけるmは1〜4の整数である
が、2〜4のうちでは2が特に好ましい、lが2の場合
Rは直接結合でもよい、また式(III)におけるR′
の1価の脂肪族、脂環族、芳香族の炭化水素基は式(n
)におけるn=1のときのRに相当する。1 and Rf are the same as in formula (I). ) can be substituted with a monooxazine compound represented by Among the oxazoline derivatives, the amount of the polyoxazoline derivative used is preferably an amount that substitutes, for example, 90 mol% or less of the polyoxazine derivative, and more preferably 70 mol% or less of the polyoxazine derivative, and the amount of the monooxazoline derivative or monooxazine compound used is, for example, 30 mol% or less, and even 2
An amount that substitutes 5 mol% or less is preferred. When a polyoxazoline derivative and a monooxazoline derivative and/or a monooxazine compound are used together, it is preferable that the total amount thereof does not exceed 90 mol% of the polyoxazine derivative. R, Ra, Rb in formula (n)
, Rc and Rd and Ra in formula (III),
In the explanation of Rb, Rc, Rd, Re and Rf,
What has been explained in relation to formula (I) can be applied as is. In addition, m in formula (II) is an integer of 1 to 4, but 2 is particularly preferable among 2 to 4. When l is 2, R may be a direct bond, and R' in formula (III)
The monovalent aliphatic, alicyclic, or aromatic hydrocarbon group has the formula (n
) corresponds to R when n=1.
ポリオキサゾリン誘導体としては、具体的には、2.2
°−ビス(2−オキサゾリン) 、 2.2’−エチレ
ンビス(2−オキサゾリン) 、 2.2’−テトラメ
チレンビス(2−オキサゾリン) 、 2,2°−へキ
サメチレンビス(2−オキサゾリン) 、 2.2’−
オクタジメチレンビス(2−オキサゾリン)、2,2°
−1,4−シクロヘキシレンビス(2−オキサゾリン)
、2,2°−ビス(4−メチル−2−オキサゾリン)。Specifically, the polyoxazoline derivatives include 2.2
°-bis(2-oxazoline), 2,2'-ethylenebis(2-oxazoline), 2,2'-tetramethylenebis(2-oxazoline), 2,2°-hexamethylenebis(2-oxazoline) , 2.2'-
Octadimethylenebis(2-oxazoline), 2,2°
-1,4-cyclohexylenebis(2-oxazoline)
, 2,2°-bis(4-methyl-2-oxazoline).
2.2゛−ビス(5−メチル−2−オキサゾリン)。2.2′-bis(5-methyl-2-oxazoline).
2.2°−m−フェニレンビスく2−オキサゾリン)。2.2°-m-phenylenebis(2-oxazoline).
2.2”−p−フェニレンビス(2−オキサゾリン)。2.2”-p-phenylenebis(2-oxazoline).
2.2’−m−フェニレンビス(4−メチル−2−オキ
サゾリン) 、 2,2°−m−フェニレンビス(5−
メチル−2−オキサゾリン)、2.2’−p−フェニレ
ンビス(4−メチル−2−オキサゾリン)、2゜2°−
p−フェニレンビス(5−メチル−2−オキサゾリン)
、 1,3.5− トリス(2−オキサゾリニル−2
)ベンゼン等を例示することができる。これらのうち2
,2°−ビス(2−オキサゾリン)、2゜2°−テトラ
メチレンビス(2−オキサゾリン)。2.2'-m-phenylenebis(4-methyl-2-oxazoline), 2,2°-m-phenylenebis(5-
Methyl-2-oxazoline), 2,2'-p-phenylenebis(4-methyl-2-oxazoline), 2゜2゜-
p-phenylenebis(5-methyl-2-oxazoline)
, 1,3.5-tris(2-oxazolinyl-2
) Benzene etc. can be exemplified. 2 of these
, 2°-bis(2-oxazoline), 2°2°-tetramethylenebis(2-oxazoline).
2.2°−m−フェニレンビス(2−オキサゾリン)。2.2°-m-phenylenebis(2-oxazoline).
2.2’−p−フェニレンビス(2−オキサゾリン)が
好ましい。2.2'-p-phenylenebis(2-oxazoline) is preferred.
モノオキサゾリン誘導体としては、具体的には、メチル
−2−オキサゾリン、2−エチル−2−オキサゾリン、
2−プロペニル−2−オキサゾリン。Specifically, the monooxazoline derivatives include methyl-2-oxazoline, 2-ethyl-2-oxazoline,
2-propenyl-2-oxazoline.
2−フェニル−2−オキサゾリン、2−トリル−2−オ
キサゾリン、2,5−ジメチル−2−オキサゾリン、2
,4−ジメチル−2−オキサゾリン、2−フェニル−4
−メチル−2−オキサゾリン、2−フェニル−5−メチ
ル−2−オキサゾリン等を例示することができる。これ
らのうち2−フェニル−2−オキサゾリン、2−トリル
−2−オキサゾリンが好ましい。2-phenyl-2-oxazoline, 2-tolyl-2-oxazoline, 2,5-dimethyl-2-oxazoline, 2
, 4-dimethyl-2-oxazoline, 2-phenyl-4
Examples include -methyl-2-oxazoline and 2-phenyl-5-methyl-2-oxazoline. Among these, 2-phenyl-2-oxazoline and 2-tolyl-2-oxazoline are preferred.
モノオキサジン化合物としては、具体的には、2−メチ
ル−5,6−シヒドロー4H−1,3−オキサジン、2
−エチル75,6−ジ辷ドロー4H−1,3−オキサジ
ン、2−プロペニル−5,6−シヒドロー4H−1,3
−オキサジン、2−フェニル−5,6−ジ辷ドロー4H
−1,3−オキサジン、2−トリル−5,6−シヒドロ
ー4H−1,3−オキサジン、2−フェニル−4−メチ
ル−5,6−シヒドロー48−1.3−オキサジン、2
−フェニル−5−メチル−5,6−シヒドロー4H−1
,3−オキサジン、2−フェニル−6−メチル−5,6
−シヒドロー4H−1,3−オキサジン等を例示するこ
とができる。これらのうち2−フェニル−5,6−シヒ
ドロー48−1.3−オキサジン、2−トリル−5,6
−ジしドロー4H−1,3−オキサジンが好ましい。Specifically, the monooxazine compound includes 2-methyl-5,6-cyhydro-4H-1,3-oxazine, 2
-Ethyl 75,6-dihydro 4H-1,3-oxazine, 2-propenyl-5,6-dihydro 4H-1,3
-Oxazine, 2-phenyl-5,6-distal draw 4H
-1,3-oxazine, 2-tolyl-5,6-sihydro 4H-1,3-oxazine, 2-phenyl-4-methyl-5,6-sihydro 48-1,3-oxazine, 2
-phenyl-5-methyl-5,6-sihydro4H-1
,3-oxazine,2-phenyl-6-methyl-5,6
-Sihydro 4H-1,3-oxazine and the like can be exemplified. Among these, 2-phenyl-5,6-cyhydro-48-1,3-oxazine, 2-tolyl-5,6
- Dishidraw 4H-1,3-oxazine is preferred.
熱可塑性樹脂(A)とポリオキサジン誘導体(B)との
使用割合は、重量比で、A/B=90/10〜30/
TOである。熱可塑性樹脂(A>の割合(重量比)が9
0を越えると耐熱性、耐薬品が十分でなく、またポリオ
キサジン誘導体(B)の割合(重量比)が70を越える
と機械的特性が十分でないので、好ましくない、好まし
い使用割合(重量比)はA/B=80/20〜40/
60である。The ratio of thermoplastic resin (A) and polyoxazine derivative (B) used is A/B = 90/10 to 30/ by weight.
It is T.O. The proportion (weight ratio) of thermoplastic resin (A>) is 9
If it exceeds 0, the heat resistance and chemical resistance will not be sufficient, and if the proportion (weight ratio) of the polyoxazine derivative (B) exceeds 70, the mechanical properties will not be sufficient, so it is not preferable, but it is preferable to use the proportion (weight ratio). is A/B=80/20~40/
It is 60.
本発明においては熱可塑性樹脂(A)とポリオキサジン
誘導体(B)よりなる組成物を触媒の存在下に加熱し、
該熱可塑性樹脂のマトリックス中でポリオキサジン誘導
体を重合させる。かかる触媒としては、例えばプロトン
酸、プロトン酸エステル、ルイス酸、ルイス酸錯体、ア
ルキルハライド、ハロゲン等を挙げることができる。プ
ロトン酸としては、例えばメタンスルホン酸、エタンス
ルホン酸、ベンゼンスルホンB、p−トルエンスルホン
酸等の如き有機スルホン酸;硫酸、リン酸。In the present invention, a composition consisting of a thermoplastic resin (A) and a polyoxazine derivative (B) is heated in the presence of a catalyst,
A polyoxazine derivative is polymerized in the thermoplastic resin matrix. Examples of such catalysts include protic acids, protic acid esters, Lewis acids, Lewis acid complexes, alkyl halides, and halogens. Examples of protonic acids include organic sulfonic acids such as methanesulfonic acid, ethanesulfonic acid, benzenesulfone B, and p-toluenesulfonic acid; sulfuric acid, and phosphoric acid.
亜すン酸、ホスフィン酸、ホスホン酸、過塩素酸等の如
き無機プロトン酸等が挙げられ、プロトン酸エステルと
しては上記プロトン酸のメチル、エチル、フェニル等の
エステル、例えばベンゼンスルホン酸メチル、ベンゼン
スルホン酸エチル、p−トルエンスルホン酸メチル、p
−トルエンスルポン酸エチル等の如き有機スルホン酸エ
ステル類;硫酸ジメチル、リン酸トリメチル、リン酸ト
リフェニル、亜リン酸トリメチル、亜リン酸トリフェニ
ル等の如き無機プロトン酸エステル類等が挙げられる。Examples include inorganic protonic acids such as sulfurous acid, phosphinic acid, phosphonic acid, perchloric acid, etc. Protonic acid esters include esters of the above protonic acids such as methyl, ethyl, and phenyl, such as methyl benzenesulfonate and benzene. Ethyl sulfonate, p-Methyl toluenesulfonate, p
- Organic sulfonic acid esters such as ethyl toluenesulfonate; inorganic protonic acid esters such as dimethyl sulfate, trimethyl phosphate, triphenyl phosphate, trimethyl phosphite, triphenyl phosphite, etc.;
ルイス酸およびその錯体としては、例えば四塩化チタン
、四塩化スズ、塩化亜鉛、塩化アルミニウム、トリフロ
ロボラン、トリフロロボランエーテル錯体等が挙げられ
、アルキルハライドとしては、例えばヨウ化メチル、ヨ
ウ化エチル。Examples of Lewis acids and their complexes include titanium tetrachloride, tin tetrachloride, zinc chloride, aluminum chloride, trifluoroborane, and trifluoroborane ether complexes, and examples of alkyl halides include methyl iodide and ethyl iodide. .
ヨウ化プロピル、ヨウ化ブチル、ヨウ化ベンジル。Propyl iodide, butyl iodide, benzyl iodide.
臭化ベンジル等が挙げられ、またハロゲンとしては例え
ばヨウ素が挙げられる。これらのうち特にpKaが23
5以下のプロトン酸、pKaが1.0以下のプロトン酸
のエステル、ルイス酸、ルイス酸錯体、アルキルハライ
ド及びヨウ素が好ましい。Examples include benzyl bromide, and examples of the halogen include iodine. Among these, especially pKa is 23
Preferred are protic acids with a pKa of 5 or less, esters of protic acids with a pKa of 1.0 or less, Lewis acids, Lewis acid complexes, alkyl halides and iodine.
これら触媒の使用量は、特に制用はないが、ポリオキサ
ジン誘導体(B)に対して0.01〜20モル%、更に
は0.05〜15モル%、特に0.1〜10モル%が好
ましい。The amount of these catalysts to be used is not particularly limited, but 0.01 to 20 mol%, more preferably 0.05 to 15 mol%, particularly 0.1 to 10 mol%, based on the polyoxazine derivative (B). preferable.
本発明において、加熱反応温度としては160″C以上
、更には170℃以上、特に180°C以上が好ましい
、また反応時間は、目的とする樹脂が十分に硬化するに
足る時間であればよく、またこの時間は用いる原料の種
類、使用割合1反応温度等によっても異なるが、好まし
くは10秒〜60分、より好ましくは20秒〜30分、
特に好ましくは30秒〜15分程度である0反応は常圧
〜加圧で行うことができる。In the present invention, the heating reaction temperature is preferably 160"C or higher, more preferably 170°C or higher, particularly 180°C or higher, and the reaction time may be any time that is sufficient to fully cure the target resin. In addition, this time varies depending on the type of raw materials used, usage ratio 1 reaction temperature, etc., but is preferably 10 seconds to 60 minutes, more preferably 20 seconds to 30 minutes,
The reaction, which is particularly preferably about 30 seconds to 15 minutes, can be carried out at normal pressure to increased pressure.
本発明における加熱反応は種々の態様をとることができ
るが、最も好ましい態様は次の通りである。Although the heating reaction in the present invention can take various forms, the most preferred form is as follows.
熱可塑性樹脂(A)とポリオキサジン誘導体(B)とを
該熱可塑性樹脂の溶融条件下で均一に混合し、次いで得
られる組成物の流れ開始温度以上、好ましくは200°
C以下、より好ましくは180°C以下、特に好ましく
は160℃以下の温度で触媒を添加混合し、続いて反応
性組成物(触媒を含有した組成物)を所望形状の金型に
充填しかつ前記反応温度に加熱して反応させる方法であ
る。The thermoplastic resin (A) and the polyoxazine derivative (B) are mixed uniformly under the melting conditions of the thermoplastic resin, and then the resulting composition is heated at a temperature higher than the flow start temperature, preferably at 200°C.
The catalyst is added and mixed at a temperature below C, more preferably below 180°C, particularly preferably below 160°C, and then the reactive composition (composition containing the catalyst) is filled into a mold of the desired shape. This is a method of heating to the above-mentioned reaction temperature and causing the reaction.
熱可塑性樹脂は一般に高い流れ開始温度を有するものが
多いが、該樹脂にポリオキサジン誘導体を均一に溶融混
合することにより組成物の流れ開始温度を著しく下げる
ことが出来るので、触媒は該組成物に添加混合するのが
好ましい。Many thermoplastic resins generally have a high flow initiation temperature, but by uniformly melting and mixing a polyoxazine derivative with the resin, the flow initiation temperature of the composition can be significantly lowered. Addition mixing is preferred.
尚、本発明の架橋樹脂には必要に応じて、例えば炭素繊
維、ガラス繊維等の補強材、各種フィラー、充填材、顔
料、@色剤、酸化安定剤、紫外線吸収剤、離型剤等の添
加剤を適宜配合してもよい。In addition, the crosslinked resin of the present invention may contain reinforcing materials such as carbon fibers and glass fibers, various fillers, fillers, pigments, coloring agents, oxidation stabilizers, ultraviolet absorbers, mold release agents, etc., as necessary. Additives may be added as appropriate.
〈実施例〉
以下、実施例を挙げて本発明を詳述するが、実施例は説
明のためであって、本発明はこれに限定されるものでは
ない。<Examples> Hereinafter, the present invention will be described in detail with reference to Examples, but the Examples are for illustrative purposes and the present invention is not limited thereto.
尚、実施例中「部」は[重量部」を意味する。In the examples, "part" means "part by weight".
ガラス転移点(Tg)はTMA (熱機械特性測定装置
)で10℃/分の昇温速度で測定した。また、流れ開始
温度とは、直径0.5+w+、長さ1 m+nのノズル
を備えたフローテスターを用い、100kf/−の圧力
下でポリマーを溶融押出することかできる温度(’C)
を云う。The glass transition point (Tg) was measured using a TMA (Thermomechanical Characteristics Measuring Apparatus) at a heating rate of 10° C./min. In addition, the flow start temperature is the temperature ('C) at which the polymer can be melt-extruded under a pressure of 100 kf/- using a flow tester equipped with a nozzle with a diameter of 0.5+w+ and a length of 1 m+n.
says.
実施例1〜3及び比較例1
ビスフェノールAとジフェニルカーボネートをエステル
交換法により反応させて得られたポリカーボネー(固有
粘度0.81) (A)と、2,2°−m−フェニレ
ンビス(5,6−シヒドロー48−1.3−オキサジン
)(B)とを、第1表に示す割合(重量比)で混合し、
30amφの二軸ルーダ−を用いて250℃で溶融押出
した。得られた組成物の流れ開始温度を第1表に示す。Examples 1 to 3 and Comparative Example 1 Polycarbonate (intrinsic viscosity 0.81) (A) obtained by reacting bisphenol A and diphenyl carbonate by a transesterification method and 2,2°-m-phenylene bis(5 , 6-sihydro48-1.3-oxazine) (B) in the ratio (weight ratio) shown in Table 1,
It was melt-extruded at 250° C. using a 30 amφ twin-screw router. The flow onset temperatures of the resulting compositions are shown in Table 1.
次いで、該組成物の粉砕物100部に第1表に示す触媒
の所定量をS型ブレンダーを用いて良く混合し、得られ
る混合物をシリンダ一温度140℃。Next, 100 parts of the pulverized product of the composition was thoroughly mixed with a predetermined amount of the catalyst shown in Table 1 using an S-type blender, and the resulting mixture was heated to a cylinder temperature of 140°C.
金型温度200°Cの条件下で射出成形した。その際、
金型保持時間は5分とした。Injection molding was performed at a mold temperature of 200°C. that time,
The mold holding time was 5 minutes.
比較のため、上記ポリカーボネート単独を用いて、シリ
ンダ一温度280℃、金型温度130℃の条件下で射出
成形した。For comparison, injection molding was performed using the above polycarbonate alone under conditions of a cylinder temperature of 280°C and a mold temperature of 130°C.
得られた成形品の物性を第1表に示す、実施例1〜3の
ものは架橋樹脂の成形品であって、比較例1のものに比
べて耐熱性(”rg)、il薬品性に優れていることが
わかる。The physical properties of the obtained molded products are shown in Table 1. Examples 1 to 3 are crosslinked resin molded products, and compared to Comparative Example 1, they have better heat resistance (rg) and il chemical resistance. It turns out that it is excellent.
第1表
実施例4,5及び比較例2
2.2°−m−7二二レンビス(5,6−ジしドロー4
H−1,3−オキサジン)100部を、第2表に示す量
のポリスルホン(ユニオンカーバイト社製。Table 1 Examples 4 and 5 and Comparative Example 2
100 parts of H-1,3-oxazine) and polysulfone (manufactured by Union Carbide Co., Ltd.) in the amount shown in Table 2.
udel P−3500)と混合し、30m+φの二
輪ルーダ−を用いて270℃で溶融押出した。得られた
組成物の流れ開始温度を第2表に示す。udel P-3500) and melt-extruded at 270°C using a 30m+φ two-wheeled router. The flow onset temperatures of the resulting compositions are shown in Table 2.
次いで、該組成物の粉砕物100部に第2表に示す触媒
の所定量をS型ブレンダーを用いて良く混合し、得られ
る混合物を235℃に加熱された金型に仕込み、15分
間保持し、反応成形した。得られた架橋樹脂の成形品の
物性を第2表に示す。Next, 100 parts of the pulverized product of the composition was thoroughly mixed with a predetermined amount of the catalyst shown in Table 2 using an S-type blender, and the resulting mixture was charged into a mold heated to 235°C and held for 15 minutes. , reaction molded. Table 2 shows the physical properties of the obtained crosslinked resin molded product.
比較のため、上記ポリスルホンの成形品を用いて、耐熱
性(Tg)と耐薬品性を測定し、その結果を第2表に示
す。For comparison, heat resistance (Tg) and chemical resistance were measured using the polysulfone molded article, and the results are shown in Table 2.
′実施例6
ジフェニルテレフタレート318部、ジフェニルイソフ
タレート318部及びビスフェノールA479部を酢酸
第1g0.1部の存在下常法により溶融重合せしめ固有
粘度0.66のボリアリレート(Tg:169°C)を
得た。'Example 6 318 parts of diphenyl terephthalate, 318 parts of diphenyl isophthalate and 479 parts of bisphenol A were melt-polymerized by a conventional method in the presence of 1 g of acetic acid and 0.1 parts to give a polyarylate (Tg: 169°C) with an intrinsic viscosity of 0.66. Obtained.
次いで該ボリアリレート100部と2,2°−p−フェ
ニレンビス(5,6−シヒドロー48−1.3−オキサ
ジン)100部を混合し、2軸ルーグーを用いて270
°Cで溶融混合した。得られた組成物の流れ開始温度は
85℃であった。Next, 100 parts of the polyarylate and 100 parts of 2,2°-p-phenylenebis(5,6-sihydro-48-1,3-oxazine) were mixed, and 270 parts of the polyarylate was mixed using a two-screw Rougoux.
Melt mixed at °C. The flow onset temperature of the resulting composition was 85°C.
次いで該組成物100部にベンゼンスルホン酸エチル4
部を均一に混合し、200°Cに加熱した金型に仕込み
、10分間保持した。得られた架橋樹脂成形品のTgは
270°Cであった。Next, 4 parts of ethyl benzenesulfonate was added to 100 parts of the composition.
The mixture was mixed uniformly, placed in a mold heated to 200°C, and held for 10 minutes. The Tg of the obtained crosslinked resin molded article was 270°C.
Claims (1)
脂環族、芳香族の炭化水素基を示す但し、n=2の場合
、Rは直接結合でもよいRa、Rb、Rc、Rd、Re
およびRfは夫々水素原子、炭素数3以下の脂肪族炭化
水素基および炭素数7以下の芳香族炭化水素基を示し、
これらは同一でも夫々異なっていてもよい。〕で示され
るポリオキサジン誘導体(B)からなり、かつ熱可塑性
樹脂(A)対ポリオキサジン誘導体(B)の割合が重量
比で90:10〜30:70である組成物を、触媒の存
在下に加熱反応させることを特徴とする架橋樹脂の製造
法。[Claims] Thermoplastic resin (A) and the following formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼...(I) [In the formula, n represents an integer from 2 to 4, and R represents an n-valent aliphatic,
Represents an alicyclic or aromatic hydrocarbon group. However, when n=2, R may be a direct bond. Ra, Rb, Rc, Rd, Re
and Rf respectively represent a hydrogen atom, an aliphatic hydrocarbon group having 3 or less carbon atoms, and an aromatic hydrocarbon group having 7 or less carbon atoms,
These may be the same or different. ] In the presence of a catalyst, a composition consisting of a polyoxazine derivative (B) and having a weight ratio of thermoplastic resin (A) to polyoxazine derivative (B) of 90:10 to 30:70 is prepared. A method for producing a cross-linked resin, characterized by subjecting it to a heating reaction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10967287A JPS63275663A (en) | 1987-05-07 | 1987-05-07 | Production of crosslinked resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10967287A JPS63275663A (en) | 1987-05-07 | 1987-05-07 | Production of crosslinked resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63275663A true JPS63275663A (en) | 1988-11-14 |
Family
ID=14516243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10967287A Pending JPS63275663A (en) | 1987-05-07 | 1987-05-07 | Production of crosslinked resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63275663A (en) |
-
1987
- 1987-05-07 JP JP10967287A patent/JPS63275663A/en active Pending
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