JPS6327041U - - Google Patents

Info

Publication number
JPS6327041U
JPS6327041U JP1986119349U JP11934986U JPS6327041U JP S6327041 U JPS6327041 U JP S6327041U JP 1986119349 U JP1986119349 U JP 1986119349U JP 11934986 U JP11934986 U JP 11934986U JP S6327041 U JPS6327041 U JP S6327041U
Authority
JP
Japan
Prior art keywords
bonding wire
spool
comb
supply device
elasticity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986119349U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0244519Y2 (ja�@�@
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986119349U priority Critical patent/JPH0244519Y2/ja
Publication of JPS6327041U publication Critical patent/JPS6327041U/ja
Application granted granted Critical
Publication of JPH0244519Y2 publication Critical patent/JPH0244519Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Unwinding Of Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP1986119349U 1986-08-05 1986-08-05 Expired JPH0244519Y2 (ja�@�@)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986119349U JPH0244519Y2 (ja�@�@) 1986-08-05 1986-08-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986119349U JPH0244519Y2 (ja�@�@) 1986-08-05 1986-08-05

Publications (2)

Publication Number Publication Date
JPS6327041U true JPS6327041U (ja�@�@) 1988-02-22
JPH0244519Y2 JPH0244519Y2 (ja�@�@) 1990-11-27

Family

ID=31006638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986119349U Expired JPH0244519Y2 (ja�@�@) 1986-08-05 1986-08-05

Country Status (1)

Country Link
JP (1) JPH0244519Y2 (ja�@�@)

Also Published As

Publication number Publication date
JPH0244519Y2 (ja�@�@) 1990-11-27

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