JPS6327041U - - Google Patents

Info

Publication number
JPS6327041U
JPS6327041U JP1986119349U JP11934986U JPS6327041U JP S6327041 U JPS6327041 U JP S6327041U JP 1986119349 U JP1986119349 U JP 1986119349U JP 11934986 U JP11934986 U JP 11934986U JP S6327041 U JPS6327041 U JP S6327041U
Authority
JP
Japan
Prior art keywords
bonding wire
spool
comb
supply device
elasticity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986119349U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0244519Y2 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986119349U priority Critical patent/JPH0244519Y2/ja
Publication of JPS6327041U publication Critical patent/JPS6327041U/ja
Application granted granted Critical
Publication of JPH0244519Y2 publication Critical patent/JPH0244519Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Unwinding Of Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP1986119349U 1986-08-05 1986-08-05 Expired JPH0244519Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986119349U JPH0244519Y2 (fr) 1986-08-05 1986-08-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986119349U JPH0244519Y2 (fr) 1986-08-05 1986-08-05

Publications (2)

Publication Number Publication Date
JPS6327041U true JPS6327041U (fr) 1988-02-22
JPH0244519Y2 JPH0244519Y2 (fr) 1990-11-27

Family

ID=31006638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986119349U Expired JPH0244519Y2 (fr) 1986-08-05 1986-08-05

Country Status (1)

Country Link
JP (1) JPH0244519Y2 (fr)

Also Published As

Publication number Publication date
JPH0244519Y2 (fr) 1990-11-27

Similar Documents

Publication Publication Date Title
JPS6327041U (fr)
JPS62177017U (fr)
JPS624071U (fr)
JPS61106038U (fr)
JPS61188957U (fr)
JPS6355556U (fr)
JPS61149306U (fr)
JPH028053U (fr)
JPH0288447U (fr)
JPS61188264U (fr)
JPS6341715U (fr)
JPS61183534U (fr)
JPS6190245U (fr)
JPH0275747U (fr)
JPS6296857U (fr)
JPH0488447U (fr)
JPS6355536U (fr)
JPS62147364U (fr)
JPS62170699U (fr)
JPS6447056U (fr)
JPS6193467U (fr)
JPS63134553U (fr)
JPH01132560U (fr)
JPS6390864U (fr)
JPS6294648U (fr)