JPS63267543A - Base material for laminate - Google Patents
Base material for laminateInfo
- Publication number
- JPS63267543A JPS63267543A JP10182187A JP10182187A JPS63267543A JP S63267543 A JPS63267543 A JP S63267543A JP 10182187 A JP10182187 A JP 10182187A JP 10182187 A JP10182187 A JP 10182187A JP S63267543 A JPS63267543 A JP S63267543A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- metal
- layer
- density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 239000004743 Polypropylene Substances 0.000 claims abstract description 11
- -1 polypropylene Polymers 0.000 claims abstract description 10
- 229920001155 polypropylene Polymers 0.000 claims abstract description 9
- 229920013716 polyethylene resin Polymers 0.000 claims abstract description 7
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 6
- 238000003475 lamination Methods 0.000 claims description 13
- 150000008065 acid anhydrides Chemical class 0.000 claims description 5
- 239000005022 packaging material Substances 0.000 abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 abstract description 9
- 235000013305 food Nutrition 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 235000011888 snacks Nutrition 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 229910052793 cadmium Inorganic materials 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 238000004512 die casting Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 150000008064 anhydrides Chemical class 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000005025 cast polypropylene Substances 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 5
- 239000002952 polymeric resin Substances 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 4
- 239000005026 oriented polypropylene Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 235000013606 potato chips Nutrition 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 2
- 241000482268 Zea mays subsp. mays Species 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 235000019685 rice crackers Nutrition 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 150000004671 saturated fatty acids Chemical class 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 2
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明はラミネート用基材に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to substrates for lamination.
更に詳しくは、金属蒸着層を有するラミネート用基材に
関する。More specifically, the present invention relates to a laminating base material having a metal vapor deposited layer.
[従来の技術]
ガスバリア性の向上、外観、美観の向上を目的として、
表面に金属蒸着を施したプラスチックフィルムが、押出
しラミネート、ドライラミネート等のラミネート用基材
として近年多量に用いられている。[Conventional technology] For the purpose of improving gas barrier properties, appearance, and aesthetics,
BACKGROUND ART In recent years, plastic films whose surfaces have been subjected to metal vapor deposition have been widely used as base materials for laminations such as extrusion laminates and dry laminates.
特にアルミ蒸着を施したキャストポリプロピレン(以下
VMCPPと略す)フィルムは低温ヒートシール性に優
れ、フィルムの腰が強いことからポテトチップ、ポツプ
コーン、せんべい等のスナック菓子の包装材料の基材と
して多量に用いられている。In particular, aluminum-deposited cast polypropylene (hereinafter referred to as VMCPP) film has excellent low-temperature heat-sealing properties and is strong, so it is widely used as a base material for packaging snack foods such as potato chips, popcorn, and rice crackers. ing.
VMCPPフィルムは通常その表面をコロナ処理後アル
ミ蒸着されるが、コロナ処理を施してもキャストポリプ
ロピレン(以下CPPと略す)フィルムと蒸着アルミと
の接着力が弱く、このためVMCPPフィルムと、二軸
延伸ポリプロピレン(以下OPPと略す)、ナイロン、
ポリエステル等のフィルム基材とを、たとえ金属への接
着力に優れた樹脂を用いサンドラミネーションしたとし
ても、得られた積層体は、アルミ蒸着層とCPPフィル
ム層との間で簡単に層間剥離が起こるという問題があっ
た。VMCPP film is usually coated with aluminum after corona treatment, but even after corona treatment, the adhesion between cast polypropylene (hereinafter abbreviated as CPP) film and vapor deposited aluminum is weak, so VMCPP film and biaxially oriented Polypropylene (hereinafter abbreviated as OPP), nylon,
Even if a resin with excellent adhesion to metal is used for sand lamination with a film base material such as polyester, the resulting laminate will easily suffer from delamination between the aluminum vapor-deposited layer and the CPP film layer. There was a problem that happened.
蒸着アルミとCPPフィルムとの接着力を高めるためC
PPフィルムにアンカーコート剤を塗布後アルミ蒸着を
施すことが検討されている。しかし、この方法ではアン
カーコート剤乾燥時にCPPフィルムが熱収縮を起し易
く、このため均一なアルミ蒸着が行われず、美観上もさ
ることながら製品の歩留りも悪くコスト上昇になるなど
の問題がある。C to increase the adhesion between vapor-deposited aluminum and CPP film.
It is being considered to apply an anchor coating agent to a PP film and then perform aluminum vapor deposition. However, with this method, the CPP film tends to undergo heat shrinkage when the anchor coating agent dries, and as a result, uniform aluminum deposition is not achieved, which not only improves aesthetics, but also reduces product yield and increases costs. .
[発明が解決しようとする問題点]
本発明の目的は、金属蒸着層との接着力、低温ヒートシ
ール性に優れ且つ腰の強いラミネート用基材を提供する
ことにある。[Problems to be Solved by the Invention] An object of the present invention is to provide a base material for lamination that has excellent adhesive strength with a metal vapor-deposited layer, low-temperature heat sealability, and is strong.
[問題点を解決するための手段]
本発明の要旨は、ポリプロピレン樹脂及び/又は密度0
.93g/m以上のポリエチレン樹脂に不飽和カルボン
酸又はその酸無水物をグラフト反応させたグラフト変性
樹脂層(1)に蒸着金属層(II)を積層したことを特
徴とするラミネート用基材に関するものである。[Means for solving the problems] The gist of the present invention is that polypropylene resin and/or
.. Regarding a base material for lamination, characterized in that a vapor-deposited metal layer (II) is laminated on a graft-modified resin layer (1) obtained by graft-reacting an unsaturated carboxylic acid or its acid anhydride to a polyethylene resin of 93 g/m or more It is.
本発明の(I)層を構成するグラフト変性樹脂は、ラジ
カル発生剤の存在下で、ポリプロピレン樹脂及び/又は
密度0.93g/cI1以上のポリエチレン樹脂に、不
飽和カルボン酸又はその酸無水物をグラフト反応させて
得られるものである。The graft-modified resin constituting layer (I) of the present invention is an unsaturated carboxylic acid or its acid anhydride added to a polypropylene resin and/or a polyethylene resin with a density of 0.93 g/cI1 or more in the presence of a radical generator. It is obtained by grafting reaction.
本発明の(1)層を構成する樹脂の内ポリプロピレン樹
脂は特にその種類を限定するものではなく、通常の押出
し成形に用いられるポリプロピレン樹脂、プロピレン−
エチレンランダム又はブロック共重合樹脂などが好適に
用いられる。Among the resins constituting the layer (1) of the present invention, the polypropylene resin is not particularly limited in its type, and may include polypropylene resins used in ordinary extrusion molding, propylene resins, etc.
Ethylene random or block copolymer resins are preferably used.
又、ポリエチレン樹脂はJIS K−6780による密
度が0.93g/i以上であることが必須である。密度
が0.93g/cd未満では基材とした際の腰が弱く、
本発明の基材を用いてラミネートしたものをスナック食
品等の包材として用いた場合、包材に「張り」がないた
め見た目の商品価値が低下する恐れがある。Further, it is essential that the polyethylene resin has a density of 0.93 g/i or more according to JIS K-6780. If the density is less than 0.93 g/cd, the stiffness when used as a base material is weak,
When a product laminated using the base material of the present invention is used as a packaging material for snack foods, etc., the packaging material lacks "tightness", so there is a risk that the product value in appearance may be reduced.
本発明において用いられる不飽和カルボン酸又はその酸
無水物としては、アクリル酸、メタクリル酸、マレイン
酸、フマル酸、クロトン酸、イタコン酸、シトラコン酸
、無水マレイン酸、無水イタコン酸、無水シトラコン酸
等が例示される。Examples of the unsaturated carboxylic acid or its acid anhydride used in the present invention include acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, maleic anhydride, itaconic anhydride, citraconic anhydride, etc. is exemplified.
本発明で前記したポリエチレン、ポリプロピレン等の重
合体樹脂にこれらをグラフト反応させる方法は、前記重
合体樹脂と重合体樹脂に対して0.1〜100重量%の
不飽和カルボン酸又はその酸無水物を適当な溶剤、例え
ば、トルエン、キシレンに溶解し、更にこの溶液に過酸
化ベンゾイル、過酸化ラウリル、過酸化ジクミル等の有
機過酸化物やアゾビスイソブチロニトリルなどのラジカ
ル開始剤を加え、ラジカル開始剤の分解温度以上、通常
は50〜300℃で1分〜10時間加熱することにより
達成される。またグラフト反応は溶融状態の重合体樹脂
に、直接、ラジカル開始剤を加え、前記重合体樹脂の溶
融温度以上で1分〜10時間混練することによっても行
なうことができる。この際のグラフト化率については特
に制限はないが、一般には約0.1−15重量%の範囲
であることが好ましい。In the method of grafting these onto polymer resins such as polyethylene and polypropylene described above in the present invention, an unsaturated carboxylic acid or its acid anhydride of 0.1 to 100% by weight based on the polymer resin and the polymer resin is used. is dissolved in a suitable solvent such as toluene or xylene, and an organic peroxide such as benzoyl peroxide, lauryl peroxide, or dicumyl peroxide or a radical initiator such as azobisisobutyronitrile is added to this solution. This is achieved by heating at a temperature higher than the decomposition temperature of the radical initiator, usually 50 to 300°C, for 1 minute to 10 hours. The graft reaction can also be carried out by directly adding a radical initiator to a molten polymer resin and kneading the mixture at a temperature above the melting temperature of the polymer resin for 1 minute to 10 hours. There is no particular restriction on the grafting rate at this time, but it is generally preferably in the range of about 0.1-15% by weight.
これら本発明の(I)層を構成する樹脂のメルトフロー
レイト(MPR)は押出し加工性の点から0.1〜lQ
Og/10分が好ましい。The melt flow rate (MPR) of the resin constituting the layer (I) of the present invention is 0.1 to 1Q from the viewpoint of extrusion processability.
Og/10 minutes is preferred.
本発明の(II)層を構成する蒸着金属としては例えば
AI% ZnSAg、 Cu、 Cd等があげられる。Examples of the vapor-deposited metal constituting the layer (II) of the present invention include AI% ZnSAg, Cu, and Cd.
(1)層に(II)層を蒸着する方法は、特に限定する
ものではなくTダイキャスト又はインフレーション法等
で得た樹脂フィルム表面に通常の真空蒸着条件を採用し
て行なうことができる。The method of vapor depositing the layer (II) on the layer (1) is not particularly limited, and can be carried out by employing normal vacuum vapor deposition conditions on the surface of a resin film obtained by T-die casting or inflation.
本発明の(I)層の厚みについては特に限定するもので
はないが、ラミネート基材の腰の強さ及び経済性を考慮
すると(1)層の厚みは10〜100μlが適切である
。又、(II)層の厚みは通常の真空蒸着条件を採用す
れば2〜100a+μ程度である。The thickness of the layer (I) of the present invention is not particularly limited, but in consideration of the stiffness and economic efficiency of the laminate base material, the thickness of the layer (1) is suitably 10 to 100 μl. Further, the thickness of the layer (II) is about 2 to 100 a+μ if normal vacuum deposition conditions are employed.
<X>層を構成する樹脂の押出し加工時のスリップ性付
与、押出し加工後のフィルムのブロッキング防止を目的
としく1)層を構成する樹脂に、更に、飽和又は不飽和
の脂肪酸アミド、脂肪酸の金属塩、飽和又は不飽和の脂
肪酸ビスアミド及び無機充填材等の1種以上を樹脂に対
して約0.01〜5重量%用いることは好ましい。<X> For the purpose of imparting slip properties during extrusion processing of the resin constituting the layer and preventing blocking of the film after extrusion processing, 1) saturated or unsaturated fatty acid amide, fatty acid It is preferred to use about 0.01 to 5% by weight of one or more metal salts, saturated or unsaturated fatty acid bisamides, and inorganic fillers based on the resin.
[実施例] 次に実施例で本発明を更に詳細に説明する。[Example] Next, the present invention will be explained in more detail with reference to Examples.
実施例1〜2比較例1〜2
低密度ポリエチレン樹脂(MFR−7g/10分、密度
−0,939g/ d)をジクミルパーオキサイドラジ
カル開始剤の存在下で無水マレイン酸と共に溶融混合し
、無水マレイン酸を0.5重量%グラフト共重合させた
無水マレイン酸変性樹脂を得た(Aとする)。Examples 1-2 Comparative Examples 1-2 A low density polyethylene resin (MFR - 7 g/10 min, density - 0,939 g/d) was melt mixed with maleic anhydride in the presence of a dicumyl peroxide radical initiator, A maleic anhydride-modified resin obtained by graft copolymerizing 0.5% by weight of maleic anhydride was obtained (referred to as A).
ポリプロピレン樹脂(MPR−10g/lo分、密度−
0,907g/ d)をジクミルパーオキサイドラジカ
ル開始剤の存在下で無水マレイン酸と共に溶融混合し、
無水マレイン酸を0.3重量%グラフト共重合させた無
水マレイン酸変性樹脂を得た(Bとする)これらの変性
物を(I)層の樹脂として用いた。Polypropylene resin (MPR-10g/lo min, density-
0,907 g/d) with maleic anhydride in the presence of a dicumyl peroxide radical initiator;
Maleic anhydride-modified resins were obtained by graft copolymerizing 0.3% by weight of maleic anhydride (referred to as B). These modified resins were used as the resin for layer (I).
Tダイ押出し機を用い第1表に示す樹脂を第1表に示す
グイ温度、厚みで押出しして(1)層のキャストフィル
ムとした。このキャストフィルム上に1O−4u+lI
gの真空度でアルミニウムを真空蒸着し、ラミネート用
基材を作製した。The resin shown in Table 1 was extruded using a T-die extruder at the temperature and thickness shown in Table 1 to obtain a cast film of layer (1). 1O-4u+lI on this cast film
Aluminum was vacuum-deposited at a vacuum degree of g to produce a base material for lamination.
この基材をサンド側、厚み20μmのOPPをメイン繰
出し側としアンカーコート剤(東洋モートン(株)裂開
品名「アトコート37FIJ )を用いてOPPにアン
カーコート塗布後エチレンーアクリル酸共重合樹脂(M
FR−20g710分、アクリル酸含量9 vt%)を
用い樹脂温度210℃、厚み20μ謂でサンドラミネー
トした。With this base material on the sand side and the OPP with a thickness of 20 μm on the main feeding side, an anchor coating agent (Toyo Morton Co., Ltd. splitting product name "Atocoat 37FIJ") was used to apply an anchor coat to the OPP, and then ethylene-acrylic acid copolymer resin (M
Sand lamination was carried out using FR-20g (acrylic acid content: 9 vt%) for 710 minutes at a resin temperature of 210° C. and a thickness of 20 μm.
得られた包材のエチレン−アクリル酸共重合樹脂フィル
ムとアルミ蒸着プラスチックフィルムとの接着強度を測
定した。The adhesive strength between the ethylene-acrylic acid copolymer resin film and the aluminum-deposited plastic film of the resulting packaging material was measured.
又得られた包材を用い(I)層同志をヒートシールし低
温ヒートシール性を評価した。Furthermore, the (I) layers were heat-sealed using the obtained packaging material to evaluate low-temperature heat-sealability.
更に得られた包材にて品物をいれた袋を作成し外観をみ
た。結果を第1表に示す。比較としてVMCPP (
CPP :コロナ処理)とOPPをエチレン−アクリル
酸共重合樹脂でサンドラミネーションした包材の評価結
果を第1表、比較例2に併せて示す。Furthermore, bags containing items were made using the obtained packaging material and their appearance was examined. The results are shown in Table 1. For comparison, VMCPP (
Table 1 and Comparative Example 2 also show the evaluation results of packaging materials obtained by sand-laminating CPP (corona treatment) and OPP with ethylene-acrylic acid copolymer resin.
第1表かられかるように本発明の基材を用いラミネート
し作成した包材は、アルミ蒸着との接着力、低温ヒート
シール性に優れ、腰が強いため袋物の外観も良い。As shown in Table 1, the packaging material laminated using the base material of the present invention has excellent adhesion to aluminum vapor deposition, low-temperature heat-sealability, and is strong, so the appearance of the bag is good.
表−1 尚、表−1中の記号は次を意味する。Table-1 The symbols in Table 1 have the following meanings.
PE:ポリエチレン樹脂 MPR−3g710分 密度−0,925g/cd PP:ポリプロピレン樹脂′ MPR−10g/10分 密度−0,907g/cd 又各試験方法は次のとうりである。PE: polyethylene resin MPR-3g710 minutes Density - 0,925g/cd PP: Polypropylene resin' MPR-10g/10min Density - 0,907g/cd The test methods are as follows.
!)接着強度
ラミネート後の包材のエチレン−アクリル酸共重合樹脂
と蒸着フィルムとの接着強度をシジッパー型引張試験機
を用い、剥離速度300 +a+s/m1nで測定した
。尚、全サンプル共(1)層/(■)層間で剥離した。! ) Adhesive strength The adhesive strength between the ethylene-acrylic acid copolymer resin of the packaging material after lamination and the vapor-deposited film was measured using a Schizpper type tensile tester at a peeling rate of 300+a+s/m1n. In all samples, peeling occurred between the (1) layer and (■) layer.
2)低温ヒートシール性
ラミネート後の包材の(1)層同士をヒートシーラーで
180℃、 1kg/cj、 1秒の条件でヒート
シールし、シール部分を手で剥離し良く接着していれば
○、接着していなければ×とした。2) Low temperature heat sealability Heat seal the (1) layers of the packaging material after lamination with a heat sealer at 180℃, 1kg/cj, 1 second, and peel off the sealed part by hand to ensure good adhesion. It was marked as ○, and if it was not adhered, it was marked as ×.
3)外観
ラミネート後の包材を用いポテトチップ40gを詰めた
15X20aoの袋を160℃、 1 kg/ cj、
1秒の条件でヒートシールし、作製した。3) A 15×20ao bag filled with 40g of potato chips using the laminated packaging material was heated to 160°C, 1 kg/cj,
It was produced by heat sealing for 1 second.
作製した袋を観察し、外観が良好なものを○、袋に腰が
ないための外観が不良なものを×とした。The produced bags were observed, and those with good appearance were rated ○, and those with poor appearance due to lack of elasticity were rated ×.
[発明の効果]
本発明の基材は、蒸着金属と樹脂フィルムとの接着力に
優れ、低温ヒートシール性が良好で腰が強いためこれを
用いて押出しラミネーション、ホットメルトラミネーシ
ョン、ドライラミネーション等のラミネーションを施し
ポテトチップ、ポツプコーン、せんべい等のスナック食
品の包材として好適に用いられる。[Effects of the Invention] The base material of the present invention has excellent adhesive strength between vapor-deposited metal and resin film, has good low-temperature heat sealability, and is strong, so it can be used for extrusion lamination, hot melt lamination, dry lamination, etc. After lamination, it is suitable for use as a packaging material for snack foods such as potato chips, popcorn, and rice crackers.
Claims (1)
m^3以上のポリエチレン樹脂に不飽和カルボン酸又は
その酸無水物をグラフト反応させたグラフト変性樹脂か
らなる層( I )に蒸着金属層(II)を積層したことを
特徴とするラミネート用基材。1) Polypropylene resin and/or density 0.93g/c
A base material for lamination, characterized in that a vapor-deposited metal layer (II) is laminated on a layer (I) made of a graft-modified resin obtained by grafting an unsaturated carboxylic acid or its acid anhydride to a polyethylene resin having a molecular weight of m^3 or more. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10182187A JPS63267543A (en) | 1987-04-27 | 1987-04-27 | Base material for laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10182187A JPS63267543A (en) | 1987-04-27 | 1987-04-27 | Base material for laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63267543A true JPS63267543A (en) | 1988-11-04 |
Family
ID=14310782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10182187A Pending JPS63267543A (en) | 1987-04-27 | 1987-04-27 | Base material for laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63267543A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015083702A1 (en) * | 2013-12-06 | 2015-06-11 | 三井化学株式会社 | Laminate, packaging material using laminate, and production method for laminate |
-
1987
- 1987-04-27 JP JP10182187A patent/JPS63267543A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015083702A1 (en) * | 2013-12-06 | 2015-06-11 | 三井化学株式会社 | Laminate, packaging material using laminate, and production method for laminate |
CN105980146A (en) * | 2013-12-06 | 2016-09-28 | 三井化学株式会社 | Laminate, packaging material using laminate, and production method for laminate |
JPWO2015083702A1 (en) * | 2013-12-06 | 2017-03-16 | 三井化学株式会社 | LAMINATE, PACKAGING MATERIAL USING THE SAME, AND METHOD FOR PRODUCING THE SAME |
US10000849B2 (en) | 2013-12-06 | 2018-06-19 | Mitsui Chemicals, Inc. | Laminate, packaging material using the same and production process for the same |
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