JPS63266507A - Temperature corrected electronic parts - Google Patents
Temperature corrected electronic partsInfo
- Publication number
- JPS63266507A JPS63266507A JP10118887A JP10118887A JPS63266507A JP S63266507 A JPS63266507 A JP S63266507A JP 10118887 A JP10118887 A JP 10118887A JP 10118887 A JP10118887 A JP 10118887A JP S63266507 A JPS63266507 A JP S63266507A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- electronic parts
- circuit
- cooling
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 238000005057 refrigeration Methods 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、温度補正電子部品に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to temperature compensation electronic components.
〔従来の技術〕 、
従来の電子部品の放熱に関する部品構造は、第4.5.
6図に示す様に電子部品14を金属製の放熱板11や放
熱フィン12に接触させ、熱伝導により放熱板や放熱フ
ィンに伝わった熱を自然放熱あるいは強制冷却による冷
却方法を取っていた〔発明が解決しようとする問題点〕
しかし、前述の従来技術では高精度化(特性の向上)が
要求される電子部品において、自然放熱のものでは十分
な冷却能力が出せないとか、また、強制冷却では冷却は
できてもコントロール機能がなく一定温度に維持するこ
とがむづかしく、電子部品の温度特性から安定した電気
特性が得られないという問題点を有する。[Prior art] Component structures related to heat dissipation of conventional electronic components are described in Section 4.5.
As shown in Figure 6, electronic components 14 are brought into contact with metal heat sinks 11 and heat sinks 12, and the heat transferred to the heat sinks and heat sinks through thermal conduction is cooled by natural heat radiation or forced cooling. [Problems to be Solved by the Invention] However, with the above-mentioned conventional technology, natural heat dissipation cannot provide sufficient cooling capacity for electronic components that require high precision (improved characteristics). Although cooling is possible, there is no control function and it is difficult to maintain a constant temperature, and there are problems in that stable electrical characteristics cannot be obtained due to the temperature characteristics of electronic components.
そこで1本発明はこの様な問題点を解決するものでその
目的とするところは、高安定な温度コントロールができ
、高精度な電気特性を発揮できる温度補正電子部品を提
供するところにある。SUMMARY OF THE INVENTION The present invention is intended to solve these problems, and its purpose is to provide a temperature compensation electronic component that can perform highly stable temperature control and exhibit highly accurate electrical characteristics.
本発明の温度補正電子部品は、温度補正電子部において
、電子部品に冷却用冷凍素子を組込み、前記冷凍素子の
冷却量を制御し得る温度補正回路を有することを特徴と
する。The temperature correction electronic component of the present invention is characterized in that, in the temperature correction electronic section, a cooling refrigeration element is incorporated into the electronic component and a temperature correction circuit capable of controlling the amount of cooling of the refrigeration element is provided.
本発明の上記構成によれば、電子部品の発熱量に応じた
冷却作用が生じ、よって電子部品は安定した温度を維持
できるため、電子部品の温度特性により変動する電気特
性を、高精度にコントロールできる。According to the above configuration of the present invention, a cooling effect occurs in accordance with the amount of heat generated by the electronic component, and therefore the electronic component can maintain a stable temperature, so the electrical characteristics that fluctuate depending on the temperature characteristics of the electronic component can be controlled with high precision. can.
第1図は、本発明の基本的な温度制御回路図であり、電
子部品1には冷凍素子2が組み込まれ、温度センサー3
が電子部品の適位置に取り付けられている。この温度セ
ンサー3で検知した情報を温度補正回路4の温度検出回
路5であらかじめ設定した変換値と情報変換し、制御回
路6により、冷凍素子2への出力回路7を制御し冷却量
を調節することによって電子部品1の温度を安定的に保
つ。この場合、第1図では温度補正回路部4とし回路を
5.6.7と分離しであるが説明の為であり一体となっ
ていてもかまわないし、構成上いずれが独立していても
かまわない。FIG. 1 is a basic temperature control circuit diagram of the present invention, in which an electronic component 1 includes a refrigeration element 2, and a temperature sensor 3.
is attached to the appropriate position of the electronic component. The information detected by the temperature sensor 3 is converted into a preset conversion value by the temperature detection circuit 5 of the temperature correction circuit 4, and the control circuit 6 controls the output circuit 7 to the refrigeration element 2 to adjust the amount of cooling. This keeps the temperature of the electronic component 1 stable. In this case, although the temperature correction circuit section 4 and the circuits 5, 6, and 7 are separated in FIG. 1 for the sake of explanation, they may be integrated, or they may be independent depending on the configuration. do not have.
さらに第2.3図に他の実施例を図示した。第2図の断
面図に見る様に、従来のハイブリッ)ICやLSI等の
部品内に前述温度制御回路を組み込んだ例であり、温度
センサー3は封止材の内外いずれか適所に設け、温度補
正回路部4は封止材内に実装されている。第2図は封止
材8が中空状態で記されているが、埋込み式の樹脂封止
等であってもかまわない、第3図は温度補正回路部4が
電子部品lの外付けとなった状態を示している。Furthermore, another embodiment is illustrated in FIG. 2.3. As seen in the cross-sectional view of Fig. 2, this is an example in which the temperature control circuit described above is incorporated into components such as conventional hybrid ICs and LSIs, and the temperature sensor 3 is installed at an appropriate location either inside or outside the sealing material, and the temperature The correction circuit section 4 is mounted within the sealing material. Although the sealing material 8 is shown in a hollow state in FIG. 2, it may be an embedded type resin sealing, etc. In FIG. It shows the condition.
この場合温度センサー3は電子部品1の内外のいづれか
適所に設ける。また第1図の説明で述べた様に、温度補
正回路5.6.7から成るため、そのいずれかが第2.
3図の電子部品内組み込み型、電子部品外付は型となっ
てもよい。In this case, the temperature sensor 3 is provided at a suitable location either inside or outside the electronic component 1. Furthermore, as described in the explanation of FIG.
The electronic component built-in type and the electronic component externally attached type shown in FIG. 3 may be a mold.
実施例よる結果は、従来技術の電子部品であると環境温
度と共に変化することと、使用中においては、一般的に
数百度にまで達する種類もあるのに比べ、/+0.10
C以下の制御が可能であるため、従来温度特性の良好な
ものでも1%以内といったレベルであったものがO〜1
100FPレベルまでの高精度のものまで得られるよう
になった。The results of the example show that conventional electronic components change with the environmental temperature, and that some types typically reach temperatures of several hundred degrees during use;
Since it is possible to control temperatures below C, the level that used to be within 1% even for those with good temperature characteristics has decreased to O~1.
High precision up to the 100FP level can now be obtained.
以上の実施例に述べてきている電子部品には、LSI、
ハイブリッドIC1出カバワープバイス、標準発振子、
標準電源、標準発振回路モジュールや抵抗、コンデンサ
等の単品においても高精度が要求される電子部品には効
果的に使える。また、冷凍素子については、ペルチェ効
果を応用した素子や一般的冷凍機を小型化した冷凍板(
冷凍ブロック)等をいう。The electronic components described in the above embodiments include LSI,
Hybrid IC1 output cover warp vise, standard oscillator,
It can be effectively used for electronic components that require high precision even in single items such as standard power supplies, standard oscillation circuit modules, resistors, and capacitors. Regarding refrigeration elements, we also have elements that apply the Peltier effect and refrigeration plates that are miniaturized from general refrigerators (
frozen block) etc.
以上述べたように本発明の温度補正電子部品によれば、
電子部品に冷凍素子を組み込み、冷凍素子の冷却量を制
御し得る温度補正回路を設けることによって、電子部品
の電気特性が高精度に維持され、電子機器の高速、安定
性を促進し、もって電子機器発展への寄与、実質効果は
極めて大きいAs described above, according to the temperature correction electronic component of the present invention,
By incorporating a refrigeration element into an electronic component and providing a temperature compensation circuit that can control the amount of cooling of the refrigeration element, the electrical characteristics of the electronic component can be maintained with high precision, promoting high speed and stability of electronic equipment, and thereby improving the electronic performance. The contribution to equipment development and the actual effect are extremely large.
第1図は本発明にかかわる冷凍素子による温度補正電子
部品の温度制御回路チャートであり、第2図は電子部品
内に温度制御部を組み込んだ断面図、第3図は温度制御
部を外付けにした構成図である。第4.5.6図は従来
の放熱機能を持たせた電子部品の断面図である。
(1)・・・・・・電子部品
(2)・・・・・・冷凍素子
(3)・・・・・・温度センサー
(4)・・・・・・温度補正回路部
(5)・・・・・・温度検出回路
(6)・・・・・・制御回路
(7)・・・・・・出力回路
(8)・・・・・・封止材
(9)・・・・・・プリント回路
(10)・・・回路基板
(11)・・・放熱板
(12)・・・放熱フィン
(13)・・・リード端子
(14)・・・電子部品
(15)・・・封止材
以上Fig. 1 is a temperature control circuit chart of a temperature-corrected electronic component using a refrigeration element according to the present invention, Fig. 2 is a cross-sectional view of the temperature control section incorporated in the electronic component, and Fig. 3 is a temperature control circuit chart of the temperature control section installed externally. FIG. Figures 4.5.6 are cross-sectional views of conventional electronic components with a heat dissipation function. (1)...Electronic components (2)...Refrigerating element (3)...Temperature sensor (4)...Temperature correction circuit (5) ...Temperature detection circuit (6) ...Control circuit (7) ...Output circuit (8) ...Sealing material (9) ...・Printed circuit (10)...Circuit board (11)...Radiation plate (12)...Radiation fin (13)...Lead terminal (14)...Electronic component (15)...Sealing More than a stopper
Claims (1)
を組込み、前記冷凍素子の冷却量を制御し得る温度補正
回路を有することを特徴とする温度補正電子部品。1. A temperature correction electronic component, characterized in that the electronic component incorporates a cooling refrigeration element and has a temperature correction circuit capable of controlling the amount of cooling of the refrigeration element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10118887A JPS63266507A (en) | 1987-04-24 | 1987-04-24 | Temperature corrected electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10118887A JPS63266507A (en) | 1987-04-24 | 1987-04-24 | Temperature corrected electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63266507A true JPS63266507A (en) | 1988-11-02 |
Family
ID=14293997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10118887A Pending JPS63266507A (en) | 1987-04-24 | 1987-04-24 | Temperature corrected electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63266507A (en) |
-
1987
- 1987-04-24 JP JP10118887A patent/JPS63266507A/en active Pending
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